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    Untitled

    Abstract: No abstract text available
    Text: \ _ A_ |_ B_ |_ C_ |_ D_ |_ E_ |_ F_ / NOTES: 1. MATERIAL: 1.1 HOUSING: THERMOPLASTIC, HIGH TEMP., U L9 4 V -0 ; COLOR:SEE ORDER INFORMATION.


    OCR Scan     		PDF HIfECN-0803011) PDR-APD950258M ECN0607099

    Untitled

    Abstract: No abstract text available
    Text: B C _L 0 .5 N —1 ±o.05 A ± 0 .0 5 PCB PATTERN LAYOUT RECOMMENDED APPLICABLE FPC LAYOUT (THICKNESS:0.3±0.03) _L E D A NOTES: 1. MATERIAL: 1.1 HOUSING: THERMOPLASTIC. HIGH TEMP. U L94V-0; COLOR:NATURAL. 1.2 CONTACT: COPPER ALLOY 1.3 FITTING NAILCOPPER ALLOY


    OCR Scan     		PDF L94V-0; NICKAPP980148 ECN-0908077) ECN-0706088 ECN0607099