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10114829-11113LF
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Amphenol Communications Solutions
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1.25mm Wire to Board Wafer, Vertical, Through Hole, 13 Positions |
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54121-111362000LF
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Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch. |
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10129206-0011113LF
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Amphenol Communications Solutions
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DDR4 DIMM, Ultra Low Profile, Storage and Server Connector, Vertical , Through Hole, 288 Position , 0.85mm (0.033in) Pitch |
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54111-113162100LF
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 16 Positions, 2.54mm (0.100in) Pitch. |
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78511-113HLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 13 Positions, 2.54 mm Pitch. |
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