Untitled
Abstract: No abstract text available
Text: Jones Plugs/Sockets Series 2400 Multiple Density Solder Eyelet • For use in cable-to-cable and cable-to-panel applications. ■ Designed for medium duty. ■ Plug prongs are .250" 6.35mm wide and .055" (1.40mm) thick. ■ Socket contacts have solder eyelet contacts of .093" diameters.
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Original
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E17021B
UL1977)
E130965
LR31996-2.
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PDF
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DC-37PTI
Abstract: ms24266r bacc63bn LGA 478 SOCKET PIN LAYOUT 94v-0 lcd display BACC45 BACC63CB bacc10gh BACC63BV MIL-C-27500
Text: Catalog No. C-865 CIN:APSE High Speed Interconnect Technology CIN:APSE ® FEATURES High-Speed Interconnect Technology • High signal speed capability enabling frequencies greater than 20 GHz. ■ Z-Axis, solderless, compression mount interconnect system.
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Original
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C-865
UT-304
FCT-551
FCT-552
DC-37PTI
ms24266r
bacc63bn
LGA 478 SOCKET PIN LAYOUT
94v-0 lcd display
BACC45
BACC63CB
bacc10gh
BACC63BV
MIL-C-27500
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PDF
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5-176-3 terminal block
Abstract: mini circuits 15542 MS14141 DIN 18541 8-32X3 s31512 mini 15542 P-306-CCE 5-140-Y E61245
Text: COMMERCIAL Barrier Blocks Circular Mini DIN BNC Jones Plugs Edge Connectors Commercial [.050” 1.27mm Density Solder Introduction Cup/Wire D-Microminiature] Cinch Commercial Products, consisting of Jones Plugs and Sockets, Barrier Blocks, Edge Cards, Two-Piece Commercial Dins,
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Original
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PDF
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DIN 41529
Abstract: bacc10 MIL-C-83513 connector BACC45FT BACC10GH BACC45FN S2402D PTI 30 040 ga BACC45FM cd 1191 acb
Text: Catalog No. C-865 CIN:APSE High Speed Interconnect Technology CIN:APSE ® FEATURES High-Speed Interconnect Technology • High signal speed capability enabling frequencies greater than 20 GHz. ■ Z-Axis, solderless, compression mount interconnect system.
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Original
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C-865
UT-304
FCT-551
FCT-552
DIN 41529
bacc10
MIL-C-83513 connector
BACC45FT
BACC10GH
BACC45FN
S2402D
PTI 30 040 ga
BACC45FM
cd 1191 acb
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PDF
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BACC63CB
Abstract: bacc63bv m32029 BACC45 BACC45FT M22759/33-26-9 BACC45FN BACC63BP MIL-C-39029/31 Cinch Connectors bacc45ft
Text: Catalog No. C-865 CIN:APSE High Speed Interconnect Technology CIN:APSE ® FEATURES High-Speed Interconnect Technology • High signal speed capability enabling frequencies greater than 20 GHz. ■ Z-Axis, solderless, compression mount interconnect system.
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Original
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C-865
UT-304
FCT-551
FCT-552
BACC63CB
bacc63bv
m32029
BACC45
BACC45FT
M22759/33-26-9
BACC45FN
BACC63BP
MIL-C-39029/31
Cinch Connectors bacc45ft
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PDF
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Untitled
Abstract: No abstract text available
Text: Jones Plugs/Sockets Series 2400 M ultiple Density Solder Eyelet For use in cable-to-cable and cable-to-panel applications. Designed for medium duty. Plug prongs are .250" 6.35mm wide and .055" (1.40mm) thick. Socket contacts have solder eyelet contacts of .093“ diameters.
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OCR Scan
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PDF
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mini circuits 15542
Abstract: chocolate vending machine 16161L mdc-8p13 25541 DIN 18541 MSX-10 302-RP 50-12SN-3 Cinch fanning strip 10-160b-r
Text: COMMERCIAL Barrier Blocks Circular Mini DIN BNC Jones Plugs Edge Connectors Commercial [.050” 1.27mm Density Solder Introduction Cup/Wire D-Microminiature] Cinch Commercial Products, consisting of Jones Plugs and Sockets, Barrier Blocks, Edge Cards, Two-Piece Commercial Dins,
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Original
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PDF
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