se97btp
Abstract: SE97B hwson8 footprint SE97 JESD22-A114 JESD22-A115 JESD78 TSE2002B1
Text: SE97B DDR memory module temp sensor with integrated SPD Rev. 01 — 27 January 2010 Product data sheet 1. General description Meets JEDEC Specification 42.4 TSE2002B1, 3 Jun 2009. The NXP Semiconductors SE97B measures temperature from −40 °C to +125 °C with JEDEC Grade B ±1 °C
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SE97B
TSE2002B1,
SE97B
JC-42
se97btp
hwson8 footprint
SE97
JESD22-A114
JESD22-A115
JESD78
TSE2002B1
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PEC 4179 DIODE
Abstract: 327879-001US
Text: Intel Communications Chipset 89xx Series Datasheet October 2012 Order Number: 327879-001US INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS
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327879-001US
LK100
PEC 4179 DIODE
327879-001US
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0040H
Abstract: PPG P05
Text: TMP86F808 CMOS 8-Bit Microcontroller TMP86F808DMG/NG The TMP86F808 is a high-speed, high-performance 8-bit microcomputer built around the TLCS870/C Series core with built-in 8-Kbyte flash memory and it is pin compatible with its mask ROM version, the TMP86C408/808. Writing programs in the built-in flash memory enables this
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TMP86F808
TMP86F808DMG/NG
TMP86F808
TLCS870/C
TMP86C408/808.
TMP86F808DMG
TMP86F808NG
P-SSOP30-56-0
P-SDIP30-400-1
0040H
PPG P05
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Untitled
Abstract: No abstract text available
Text: SE98A DDR memory module temp sensor, 1.7 V to 3.6 V Rev. 04 — 25 November 2009 Product data sheet 1. General description The NXP Semiconductors SE98A measures temperature from −40 °C and +125 °C with JEDEC Grade B ±1 °C accuracy between +75 °C and +95 °C communicating via the
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SE98A
SE98A
JC-42
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Z80 PROCESSOR
Abstract: EZ80 Z80 CPU Z80 CPU Instruction Set Z80 RAM 2 kb E104 E108 Z180 E102h
Text: Application Note Setting Interrupts with the eZ80 CPU AN017001-0903 ZiLOG Worldwide Headquarters • 532 Race Street • San Jose, CA 95126 Telephone: 408.558.8500 • Fax: 408.558.8300 • www.ZiLOG.com Application Note Setting Interrupts with the eZ80® CPU
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AN017001-0903
UM0077)
eZ80F91
PS0192)
eZ80F92
eZ80F93
eZ80F92/eZ80F93
PS0153)
Z80 PROCESSOR
EZ80
Z80 CPU
Z80 CPU Instruction Set
Z80 RAM 2 kb
E104
E108
Z180
E102h
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hwson8 footprint
Abstract: SE97 1E70H JESD22-A114 JESD22-A115 JESD78 SE98 Diode BAW 62 SE98B
Text: SE98A DDR memory module temp sensor, 1.7 V to 3.6 V Rev. 03 — 17 August 2009 Product data sheet 1. General description The NXP Semiconductors SE98A measures temperature from −40 °C and +125 °C with JEDEC Grade B ±1 °C accuracy between +75 °C and +95 °C communicating via the
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SE98A
SE98A
JC-42
hwson8 footprint
SE97
1E70H
JESD22-A114
JESD22-A115
JESD78
SE98
Diode BAW 62
SE98B
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SE97A
Abstract: SE97B DDR3 DIMM SE97 SE97PW jedec MO229 JESD22-A114 JESD22-A115 JESD78 SE97TK
Text: SE97 DDR memory module temp sensor with integrated SPD, 3.3 V Rev. 04 — 30 January 2009 Product data sheet 1. General description The NXP Semiconductors SE97 measures temperature from −40 °C to +125 °C with JEDEC Grade B ±1 °C accuracy between +75 °C and +95 °C and also provide 256 bytes
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JC-42
SE97A
SE97B
DDR3 DIMM
SE97
SE97PW
jedec MO229
JESD22-A114
JESD22-A115
JESD78
SE97TK
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RTD PT-300
Abstract: kty PT-100 CU 53 RTD PT-100 k 0538 thermocouple k 900 lg IBS sl 24 BK-T FC18 KTY81 ,kty81 application note
Text: IBSL BOX TEMP 2/2 M12 INTERBUS Loop Box With Two Analog Input Channels for Measuring Temperature Signals Data Sheet 5425B 0 2 INTERBUS Loop can only be used in conjunction with a controller board having firmware version 4.15 or later. 0 1 IN O U T Function
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5425B
SAC-4P-M12MS/1
SAC-4P-M12MS/3
SAC-4P-M12MS/5
SAC-4P-M12MR/1
SAC-4P-M12MR/3
SAC-4P-M12MR/5
RTD PT-300
kty PT-100
CU 53
RTD PT-100
k 0538
thermocouple k 900 lg
IBS sl 24 BK-T
FC18
KTY81
,kty81 application note
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842 317 SO8
Abstract: No abstract text available
Text: Intel Communications Chipset 89xx Series Datasheet June 2013 Order Number: 327879-002US INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS
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327879-002US
LK100
842 317 SO8
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f10d
Abstract: No abstract text available
Text: TMP86F807 CMOS 8-Bit Microcontroller TMP86F807MG/NG The TMP86F807 is a high-speed, high-performance 8-bit microcomputer built around the TLCS870/C Series core with built-in 8-Kbyte flash memory and it is pin compatible with its mask ROM version, the TMP86C407/807. Writing programs in the built-in flash memory enables this
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TMP86F807
TMP86F807MG/NG
TMP86F807
TLCS870/C
TMP86C407/807.
TMP86F807MG
TMP86F807NG
P-SOP28-450-1
P-SDIP28-400-1
f10d
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Untitled
Abstract: No abstract text available
Text: SE98A DDR memory module temp sensor, 1.7 V to 3.6 V Rev. 02 — 6 August 2009 Product data sheet 1. General description The NXP Semiconductors SE98A measures temperature from −40 °C and +125 °C with JEDEC Grade B ±1 °C accuracy between +75 °C and +95 °C communicating via the
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SE98A
SE98A
JC-42
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SE97
Abstract: S98A 1E70H JESD22-A114 JESD22-A115 JESD78 SE98 SE98APW jedec MO229 INTEL nehalem CPU
Text: SE98A DDR memory module temp sensor, 1.7 V to 3.6 V Rev. 01 — 5 March 2009 Product data sheet 1. General description The NXP Semiconductors SE98A measures temperature from −40 °C and +125 °C with JEDEC Grade B ±1 °C accuracy between +75 °C and +95 °C communicating via the
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SE98A
SE98A
JC-42
SE97
S98A
1E70H
JESD22-A114
JESD22-A115
JESD78
SE98
SE98APW
jedec MO229
INTEL nehalem CPU
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MO-229
Abstract: SE98 SE98PW SE98TK SODIMM ddr3 lp thermal
Text: SE98 DDR memory module temp sensor, 3.3 V Rev. 04 — 2 February 2009 Product data sheet 1. General description The NXP Semiconductors SE98 measures temperature from −40 °C to +125 °C communicating via the I2C-bus/SMBus. It is typically mounted on a Dual In-line Memory
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JC-42
MO-229
SE98
SE98PW
SE98TK
SODIMM ddr3 lp thermal
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SE97BTP
Abstract: DDR3 memory SE97 SE97B
Text: SE97B DDR memory module temp sensor with integrated SPD Rev. 01 — 27 January 2010 Product data sheet 1. General description Meets JEDEC Specification 42.4 TSE2002B1, 3 Jun 2009. The NXP Semiconductors SE97B measures temperature from −40 °C to +125 °C with JEDEC Grade B ±1 °C
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SE97B
TSE2002B1,
SE97B
JC-42
771-SE97BTP547
SE97BTP
DDR3 memory
SE97
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TMP86F807
Abstract: No abstract text available
Text: TMP86F807 Pin Assignments Top view P-SOP28-450-1.27/P-SDIP28-400-1.78 VSS XIN XOUT TEST VDD (XTIN) P21 (XTOUT) P22 RESET (STOP/INT5) P20 (TXD) P00 (RXD) P01 (SCLK) P02 (MOSI) P03 (MISO) P04 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18
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TMP86F807
P-SOP28-450-1
27/P-SDIP28-400-1
86F807-3
TLCS-870/C
Sn-63Pb
86F807-32
TMP86F807
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Untitled
Abstract: No abstract text available
Text: SE97B DDR memory module temp sensor with integrated SPD Rev. 01 — 27 January 2010 Product data sheet 1. General description Meets JEDEC Specification 42.4 TSE2002B1, 3 Jun 2009. The NXP Semiconductors SE97B measures temperature from −40 °C to +125 °C with JEDEC Grade B ±1 °C
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SE97B
TSE2002B1,
SE97B
JC-42
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SE975
Abstract: INTEL nehalem CPU SE97 SE97B
Text: SE97 DDR memory module temp sensor with integrated SPD, 3.3 V Rev. 05 — 6 August 2009 Product data sheet 1. General description The NXP Semiconductors SE97 measures temperature from −40 °C to +125 °C with JEDEC Grade B ±1 °C accuracy between +75 °C and +95 °C and also provide 256 bytes
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JC-42
SE975
INTEL nehalem CPU
SE97
SE97B
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hwson8 footprint
Abstract: SE97 SE97B JESD22-A114 JESD22-A115 JESD78 SE97PW SE97TK SE97TL DDR3 SODIMM SPD JEDEC
Text: SE97 DDR memory module temp sensor with integrated SPD, 3.3 V Rev. 07 — 29 January 2010 Product data sheet 1. General description The NXP Semiconductors SE97 measures temperature from −40 °C to +125 °C with JEDEC Grade B ±1 °C accuracy between +75 °C and +95 °C and also provide 256 bytes
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JC-42
hwson8 footprint
SE97
SE97B
JESD22-A114
JESD22-A115
JESD78
SE97PW
SE97TK
SE97TL
DDR3 SODIMM SPD JEDEC
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SE97
Abstract: SE97B JESD22-A114 JESD22-A115 JESD78 SE97PW SE97TK SE97TL ic 741 working as comparator
Text: SE97 DDR memory module temp sensor with integrated SPD, 3.3 V Rev. 06 — 17 August 2009 Product data sheet 1. General description The NXP Semiconductors SE97 measures temperature from −40 °C to +125 °C with JEDEC Grade B ±1 °C accuracy between +75 °C and +95 °C and also provide 256 bytes
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JC-42
SE97
SE97B
JESD22-A114
JESD22-A115
JESD78
SE97PW
SE97TK
SE97TL
ic 741 working as comparator
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F012H
Abstract: transistor a3h TMP86F808DMG 9600 baud rate converter F10EH TMP86F808NG F108H E090
Text: TOSHIBA Original CMOS 8-Bit Microcontroller TLCS-870/C Series TMP86F808DMG TMP86F808NG Semiconductor Company Revision History Date Revision 2007/8/7 1 First Release 2008/8/29 2 Contents Revised Caution in Setting the UART Noise Rejection Time When UART is used, settings of RXDNC are limited depending on the transfer clock specified by BRG. The combination "O" is available but please do not select the combination "–".
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TLCS-870/C
TMP86F808DMG
TMP86F808NG
86F808-32
TMP86F808
P-SSOP30-56-0
86F808-33
P-SDIP30-400-1
86F808-34
F012H
transistor a3h
TMP86F808DMG
9600 baud rate converter
F10EH
TMP86F808NG
F108H
E090
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Untitled
Abstract: No abstract text available
Text: TMP86F807 CMOS 8-Bit Microcontroller TMP86F807MG/NG The TMP86F807 is a high-speed, high-performance 8-bit microcomputer built around the TLCS870/C Series core with built-in 8-Kbyte flash memory and it is pin compatible with its mask ROM version, the TMP86C407/807. Writing programs in the built-in flash memory enables this
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TMP86F807
TMP86F807MG/NG
TMP86F807
TLCS870/C
TMP86C407/807.
TMP86F807MG
TMP86F807NG
P-SOP28-450-1
P-SDIP28-400-1
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T-CON BOARD samsung
Abstract: E804H T-CON BOARD samsung pin 8004H 5808H B004H ARM SRAM compiler samsung Timing controller T-con E80CH bufer open drain
Text: KS32C6200 32-Bit RISC Microcontroller ELECTRONICS Data Sheet OVERVIEW SAMSUNG’S KS32C6200 16/32-bit RISC micro controller is designed to provide a cost-ettective and high performance micro-controller solution for general applications. To reduce total system cost,
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KS32C6200
32-Bit
KS32C6200
16/32-bit
T-CON BOARD samsung
E804H
T-CON BOARD samsung pin
8004H
5808H
B004H
ARM SRAM compiler
samsung Timing controller T-con
E80CH
bufer open drain
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4116 DRAM 16Kx1
Abstract: 82C206 82C558
Text: 82C556/82C557/82C558 Figure 2-3 82C557 SYSC Block Diagram I R ES ET PW RG D CLK ECLK LCLK HA[31:3] BE[7:0]# M /IO # D/C# W /R # /IN V /D IR TYO AD S # BRDY# NA# KEN #/LM EM # EADS#/(W B/W T#) HITM # CACHE# SM IACT# EC D OE# O C D O E# ECAWE#/CACSOO# OCAW E#/CACS1 O#
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82C556/82C557/82C558
82C557
4116 DRAM 16Kx1
82C206
82C558
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Untitled
Abstract: No abstract text available
Text: KS32C6200 32-Bit RISC Microcontroller ELECTRONICS Data Sheet OVERVIEW SAMSUNG’S KS32C6200 16/32-bit RISC micro controller is designed to provide a cost-effective and high performance micro-controller solution for general applications. To reduce total system cost,
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PDF
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KS32C6200
32-Bit
KS32C6200
16/32-bit
KS32C620
D04bD7D
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