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    DS553 Price and Stock

    Same Sky CDS-5532-204L300

    55MM SQUARE, 5W, 4, 150HZ
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    Microchip Technology Inc CDS5535CUR-1

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    Microchip Technology Inc CDS5535CUR-1-TR

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    Swissbit SFCF2048H4BK2SA-I-DS-553-SMA

    MEM CARD COMPACTFLASH 2GB SLC
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    Microchip Technology Inc CDS5535BUR-1

    CDS5535BUR-1 - Tape and Reel (Alt: CDS5535BUR-1/TR)
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    DS553 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    DS55325 National Semiconductor Memory Drivers Original PDF

    DS553 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    DIM400DDM12-A000

    Abstract: DS5532-3
    Text: DIM400DDM12-A000 DIM400DDM12-A000 Dual Switch IGBT Module Replaces July 2002, version DS5532-2.1 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5532-3.0 March 2003


    Original     		DIM400DDM12-A000 DS5532-2 DS5532-3 3300Varantee DIM400DDM12-A000 PDF

    DIM1600FSM12-A000

    Abstract: LIN26324
    Text: DIM1600FSM12-A000 Single Switch IGBT Module DS5533-3.1 August 2008 LIN26324 FEATURES 10µs Short Circuit Withstand Non Punch Through Silicon Isolated AlSiC Base with AIN Substrates Lead Free Construction High Thermal Cycling Capability KEY PARAMETERS VCES


    Original     		DIM1600FSM12-A000 DS5533-3 LIN26324) DIM1600FSM12-A000 LIN26324 PDF

    DIM400DDM12-A000

    Abstract: No abstract text available
    Text: DIM400DDM12-A000 DIM400DDM12-A000 Dual Switch IGBT Module Preliminary Information DS5532-1.2 May 2002 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates KEY PARAMETERS


    Original     		DIM400DDM12-A000 DS5532-1 DIM400DDM12-A000 PDF

    Untitled

    Abstract: No abstract text available
    Text: DIM400LSS12-A000 DIM400LSS12-A000 Single Switch IGBT Module Replaces March 2003, version DS5534-3.0 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Baseplate DS5534-4.0 July 2003 KEY PARAMETERS VCES typ VCE(sat)*


    Original     		DIM400LSS12-A000 DS5534-3 FDS5534-4 DIM400LSS12-A000 PDF

    DIM800FSM12-A000

    Abstract: No abstract text available
    Text: DIM800FSM12-A000 Single Switch IGBT Module Replaces DS5531-3.1 DS5531-4 November 2010 LN27682 FEATURES KEY PARAMETERS • 10µs Short Circuit Withstand  High Thermal Cycling Capability  Non Punch Through Silicon VCES VCE(sat) * (typ) IC (max) IC(PK)


    Original     		DIM800FSM12-A000 DS5531-3 DS5531-4 LN27682) DIM800FSM12-A000 PDF

    lm 124 ic

    Abstract: ESM 310 DIM2400ESM12-A000
    Text: DIM2400ESM12-A000 Single Switch IGBT Module Replaces DS5536-3.0 DS5536-4 October 2010 LN27615 FEATURES KEY PARAMETERS • 10µs Short Circuit Withstand  High Thermal Cycling Capability  Non Punch Through Silicon VCES VCE(sat) * (typ) IC (max) IC(PK)


    Original     		DIM2400ESM12-A000 DS5536-3 DS5536-4 LN27615) lm 124 ic ESM 310 DIM2400ESM12-A000 PDF

    12v to 1000v inverters circuit diagrams

    Abstract: bi-directional switches IGBT DIM400LSS12-A000 6x55 diode IC LM 2003
    Text: DIM400LSS12-A000 DIM400LSS12-A000 Single Switch IGBT Module Replaces June 2002, version DS5534-2.1 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Baseplate DS5534-3.0 March 2003 KEY PARAMETERS VCES typ VCE(sat)*


    Original     		DIM400LSS12-A000 DS5534-2 DS5534-3 DIM400LSS12-A000 12v to 1000v inverters circuit diagrams bi-directional switches IGBT 6x55 diode IC LM 2003 PDF

    DIM2400ESM12-A000

    Abstract: No abstract text available
    Text: DIM2400ESM12-A000 DIM2400ESM12-A000 Single Switch IGBT Module Replaces July 2002, version DS5536-2.1 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5529-3.0 March 2003


    Original     		DIM2400ESM12-A000 DS5536-2 DS5529-3 33arantee DIM2400ESM12-A000 PDF

    DIM1600FSM12-A000

    Abstract: 6x transistor
    Text: DIM1600FSM12-A000 DIM1600FSM12-A000 Single Switch IGBT Module Replaces July 2002, version DS5533-2.1 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5533-3.0 March 2003


    Original     		DIM1600FSM12-A000 DS5533-2 DS5533-3 DIM1600FSM12-A000 6x transistor PDF

    DIM1600FSM12-A000

    Abstract: DIM1600FSM12-A
    Text: DIM1600FSM12-A000 Single Switch IGBT Module Replaces DS5533-4 DS5533-5 July 2014 LN31767 FEATURES KEY PARAMETERS • 10µs Short Circuit Withstand  High Thermal Cycling Capability  Non Punch Through Silicon VCES VCE(sat) * (typ) IC (max) IC(PK) (max)


    Original     		DIM1600FSM12-A000 DS5533-4 DS5533-5 LN31767) DIM1600FSM12-A000 DIM1600FSM12-A PDF

    DIM400DDM12-A000

    Abstract: DIM400DDM12-A
    Text: 6 3 Replaces DS5532-4 FEATURES ±0.2 • ±0.2 10µs Short Circuit Withstand 18 6 x O7 Dual Switch IGBT Module DS5532-5 June 2014 LN31690 14 ±0.2 11.5 ±0.2 DIM400DDM12-A000 KEY PARAMETERS 28 ±0.5  High44 Thermal ±0.2 Cycling Capability  Non Punch


    Original     		DS5532-4 DS5532-5 LN31690) DIM400DDM12-A000 DIM400DDM12-A000 DIM400DDM12-A PDF

    DIM2400ESM12-A000

    Abstract: DIM2400ESM12-A
    Text: DIM2400ESM12-A000 Single Switch IGBT Module Replaces DS5536-4 DS5536-5 August 2014 LN31869 FEATURES KEY PARAMETERS • 10µs Short Circuit Withstand  High Thermal Cycling Capability  Non Punch Through Silicon VCES VCE(sat) * (typ) IC (max) IC(PK) (max)


    Original     		DIM2400ESM12-A000 DS5536-4 DS5536-5 LN31869) DIM2400ESM12-A000 DIM2400ESM12-A PDF

    DIM400DDM12-A000

    Abstract: grease DS5532-4
    Text: 6 3 DS5532-4 November 2009 LN26754 14 ±0.2 ±0.2 Replaces DS5532-3.1 Dual Switch IGBT Module 11.5 DIM400DDM12-A000 FEATURES ±0.2 18 10µs Short Circuit Withstand ±0.2 6 x O7 KEY PARAMETERS 28 ±0.5 Non Punch Silicon ±0.2 57 Through VCES VCE(sat) * (typ)


    Original     		DS5532-4 LN26754) DS5532-3 DIM400DDM12-A000 DIM400DDM12-A000 grease PDF

    DIM1600FSM12-A000

    Abstract: No abstract text available
    Text: DIM1600FSM12-A000 DIM1600FSM12-A000 Single Switch IGBT Module Preliminary Information DS5533-1.2 May 2002 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates


    Original     		DIM1600FSM12-A000 DS5533-1 DIM1600FSM12-A000 PDF

    2 way video splitter circuit diagram

    Abstract: TV 2 way splitter, circuit diagram PHILIPS TV tuner block TV 3 way splitter, circuit diagram 2 way rf splitter circuit diagram video balun schematic f type connectors log tx2 tv schematic diagram PHILIPS zarlink modem
    Text: SL2150F Front End Power Splitter with AGC Data Sheet DS5535 Features • • • • • • Single chip quadruple power splitter primary channel, secondary channel, OOB channel and loop through Wide dynamic range on all channels Independent AGC facility incorporated into all


    Original     		SL2150F DS5535 -62dBc SL2150F/KG/LH2S SL2150F/KG/LH2T SL2150F 2 way video splitter circuit diagram TV 2 way splitter, circuit diagram PHILIPS TV tuner block TV 3 way splitter, circuit diagram 2 way rf splitter circuit diagram video balun schematic f type connectors log tx2 tv schematic diagram PHILIPS zarlink modem PDF

    DIM800FSM12-A000

    Abstract: No abstract text available
    Text: DIM800FSM12-A000 DIM800FSM12-A000 Single Switch IGBT Module Replaces July 2002, version DS5531-2.1 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5531-3.0 March 2003


    Original     		DIM800FSM12-A000 DS5531-2 DS5531-3 DIM800FSM12-A000 PDF

    DIM1600FSM12-A000

    Abstract: No abstract text available
    Text: DIM1600FSM12-A000 DIM1600FSM12-A000 Single Switch IGBT Module Replaces July 2002, version DS5533-2.1 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates DS5533-3.0 March 2003


    Original     		DIM1600FSM12-A000 DS5533-2 DS5533-3 DIM1600FSM12-A000 PDF

    LVCMOS33

    Abstract: XA2C64A AEC-Q100 LVCMOS15 LVCMOS25 XAPP427 XA2C64A-8VQG44Q
    Text: XA2C64A CoolRunner-II Automotive CPLD R DS553 v1.1 May 5, 2007 Features • AEC-Q100 device qualification and full PPAP support available in both I-grade and extended temperature Q-grade • Guaranteed to meet full electrical specifications over TA = -40° C to +105° C with TJ Maximum = +125° C


    Original     		XA2C64A DS553 AEC-Q100 44-pin 100-pin XAPP375: XAPP376: XAPP378: XAPP382: XAPP389: LVCMOS33 LVCMOS15 LVCMOS25 XAPP427 XA2C64A-8VQG44Q PDF

    LOG TX2 1044

    Abstract: ctb 43
    Text: SL2150F Front End Power Splitter with AGC Data Sheet DS5535 Features • • • • • • Single chip quadruple power splitter primary channel, secondary channel, OOB channel and loop through Wide dynamic range on all channels Independent AGC facility incorporated into all


    Original     		SL2150F DS5535 -62dBc SL2150F/KG/LH2S SL2150F/KG/LH2T SL2150F LOG TX2 1044 ctb 43 PDF

    DIM1600FSM12-A000

    Abstract: No abstract text available
    Text: DIM1600FSM12-A000 DIM1600FSM12-A000 Single Switch IGBT Module Preliminary Information Replaces issue May 2002, version DS5533-1.2 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates


    Original     		DIM1600FSM12-A000 DS5533-1 DS5533-2 DIM1600FSM12-A000 PDF

    DIM200MHS12-A000

    Abstract: No abstract text available
    Text: DIM200MHS12-A000 DIM200MHS12-A000 Half Bridge IGBT Module Preliminary Information Replaces issue May 2002, version DS5535-1.4 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Baseplate DS5535-2.1 June 2002 KEY PARAMETERS


    Original     		DIM200MHS12-A000 DS5535-1 DS5535-2 DIM200MHS12-A000 PDF

    DIM2400ESM12-A000

    Abstract: No abstract text available
    Text: DIM2400ESM12-A000 DIM2400ESM12-A000 Single Switch IGBT Module Preliminary Information Replaces issue May 2002, version DS5536-1.3 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates


    Original     		DIM2400ESM12-A000 DS5536-1 DS5529-2 DIM2400ESM12-A000 PDF

    Untitled

    Abstract: No abstract text available
    Text: DIM400DDM12-A000 Dual Switch IGBT Module Replaces DS5532-3.1 FEATURES 10µs Short Circuit Withstand High Thermal Cycling Capability Non Punch Through Silicon Isolated AlSiC Base with AlN Substrates DS5532-4 November 2009 LN26754 KEY PARAMETERS VCES VCE(sat) * (typ)


    Original     		DIM400DDM12-A000 DS5532-3 DS5532-4 LN26754) PDF

    vqg44

    Abstract: No abstract text available
    Text: XA2C64A CoolRunner-II Automotive CPLD R DS553 v1.0 October 31, 2006 Features • • • • • • AEC-Q100 device qualification and full PPAP support available in both I-grade and extended temperature Q-grade Guaranteed to meet full electrical specifications over


    Original     		XA2C64A DS553 AEC-Q100 44-pin XAPP784: XAPP375: XAPP376: XAPP378: XAPP382: XAPP389: vqg44 PDF