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10083113-108LF
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Amphenol Communications Solutions
|
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Press Fit, Single Row, 8 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318 in.) Mating, 4.82 mm (0.19 in.) Tail. |
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10114828-13108LF
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Amphenol Communications Solutions
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1.25mm Wire to Board Wafer,Vertical, Surface Mount, 8 Positions |
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10114829-13108LF
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Amphenol Communications Solutions
|
1.25mm Wire to Board Wafer, Vertical, Through Hole, 8 Positions |
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SN65LVDS050PW
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Texas Instruments
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Dual LVDS Transceiver 16-TSSOP |
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SN65LVDS051PWR
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Texas Instruments
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400 Mbps LVDS Dual High-Speed Differential Transceiver 16-TSSOP -40 to 85 |
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