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UPD48011318FF-FH16-FF1-A
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Renesas Electronics Corporation
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Low Latency DRAM, T-LBGA, /Tray |
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76745-113-18LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 18 Positions, 2.54mm (0.100in) Pitch. |
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77315-113-18LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 18 Positions 2.54mm (0.100in) Pitch, Right Angle |
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54122-113182400LF
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Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 18 position, 2.54mm (0.100in) pitch |
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SN65LVDS050PW
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Texas Instruments
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Dual LVDS Transceiver 16-TSSOP |
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