TC240D
Abstract: "embedded dram" and Graphics and Toshiba embedded dram timing Edison time delay 0.25um TOSHIBA standard cell library toshiba ASIC
Text: TOSHIBA TC240DC/DE Embedded DRAM SLI ASIC 0.25µm dRAMASIC Description • Byte Write data control The TC240D is Toshiba’s 0.25µm Embedded DRAM System-Level Integration SLI ASIC family. The TC240D is targeted at applications requiring high bandwidth.
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TC240DC/DE
TC240D
TC240D
166MHz
128Mbits
"embedded dram" and Graphics and Toshiba
embedded dram timing
Edison time delay
0.25um TOSHIBA standard cell library
toshiba ASIC
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"embedded dram" and Graphics and Toshiba
Abstract: DRAM 4114 dram verilog model "embedded dram" dram structure embedded dram timing TC240D piano vhdl TOSHIBA Logic
Text: Embedded DRAM Cores SLI ASICs with Embedded DRAM for High-Performance, High-Density and Low-Power Applications The ever-increasing ASIC complexity and the drive for systemlevel integration SLI demand the capability to integrate memory blocks, IP cores and random logic on a single chip. We see
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TC280
Abstract: toshiba sram data 1 gate toshiba logic
Text: TOSHIBA TC280 SLI ASIC Family with Embedded DRAM 0.11µm/1.5V Description TC280 is Toshiba’s 0.11µm System Level Integration SLI ASIC family. TC280 is designed specifically for high-performance applications requiring low power dissipation in highly integrated dense circuits.
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TC280
206Kg/mm2
toshiba sram data
1 gate toshiba logic
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DRAM "deep trench" capacitor
Abstract: IC 64256 RAM embedded dram timing TC260 TOSHIBA standard cell library TC260 TOSHIBA GATE ARRAY 1 gate toshiba logic 64256
Text: TOSHIBA TC260 SLI ASIC Family with Embedded DRAM 0.14µm/1.5V Description The TC260 family of System-Level Integration SLI ASICs are designed for applications needing the highest performance with the smallest die size. The TC260 employs the highest-density interconnects,
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TC260
TC260C/DC
TC260E/DE
150MHz
DRAM "deep trench" capacitor
IC 64256 RAM
embedded dram timing
TC260 TOSHIBA standard cell library
TOSHIBA GATE ARRAY
1 gate toshiba logic
64256
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TOSHIBA TC260
Abstract: TC260 TOSHIBA standard cell library CMOS GATE ARRAYs toshiba TC260 1 gate toshiba logic asic flow
Text: TOSHIBA TC260 SLI ASIC Family with Embedded DRAM 0.14µm/1.5V Description The TC260 family of System-Level Integration SLI ASICs are designed for applications needing the highest performance with the smallest die size. The TC260 employs the highest-density interconnects,
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TC260
TC260C/DC
TC260E/DE
150MHz
TOSHIBA TC260
TC260 TOSHIBA standard cell library
CMOS GATE ARRAYs toshiba
1 gate toshiba logic
asic flow
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dram structure
Abstract: STACK ORGANISATION siemens capacitors embedded dram embedded system ic tester C163 edram
Text: A Modular Embedded DRAM Core Concept in 0.24 µm Technology Konrad Schönemann SIEMENS AG Semiconductor Group Balanstr. 73 D - 81617 München, Germany konrad.schoenemann@hl.siemens.de Copyright 1998 IEEE. Published in the Proceedings of MTDT ‘98, 24 - 25 August 1998 at San Jose, California.
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08855concept.
dram structure
STACK ORGANISATION
siemens capacitors
embedded dram
embedded system ic tester
C163
edram
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dram verilog model
Abstract: "embedded dram" 438B TC260 TC280 TC280C TOSHIBA TC260 70409 "embedded dram" and Graphics and Toshiba
Text: Embedded DRAM Cores PRODUCT GUIDE Embedded DRAM Cores With high memory data transfer rates and low power consumption, EDRAM SoCs Enable High-Performance and High-Value-Added Systems. EDRAM SoCs Also Reduce System Board Area. -SoCs with Synchronous DRAMs and FastThe ever-increasing design complexity and the drive for system-on-chips
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45125C-0203
dram verilog model
"embedded dram"
438B
TC260
TC280
TC280C
TOSHIBA TC260
70409
"embedded dram" and Graphics and Toshiba
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embedded dram timing
Abstract: B165H siemens capacitors te 4017 plc siemens ELETRONICOS "embedded dram"
Text: s Global PartnerChip for Systems on Silicon Embedded DRAM A Siemens AG Österreich Erdberger Lände 26 1030 Wien ట +43 -1-1707-35611 Fax (+43)-1-1707-55973 Email: elisabeth.schwarz@ siemens.at Innovations that fit by Siemens Semiconductors AUS 2nd Edition 1997
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B-1060
400net
embedded dram timing
B165H
siemens capacitors
te 4017
plc siemens
ELETRONICOS
"embedded dram"
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27e transistor
Abstract: IBM "embedded dram" SA-27E SA-27 epbga ibm sram
Text: Standard cell/gate array value ASIC for high-function, high-density applications Blue Logic SA-27E ASIC Highlights Embedded DRAM with integrated built-in self test and redundancy Copper metallurgy for price/ performance in sub-0.18 µm logic process 0.11 µm effective channel length
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SA-27E
SA-27
07SA14218301*
SA14-2183-01
27e transistor
IBM "embedded dram"
epbga
ibm sram
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SECDED
Abstract: No abstract text available
Text: Fault Tolerance Decision in Memory . Application Note Fault Tolerance Decision in Memory Introduction 1. Hard fails, in which the nature of the fail repeats, and is basically permanent. Fixing these fails permanently may require replacement of some part of the memory hardware. Hard error rates are
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32-bit
SECDED
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ibm ASIC SRAM
Abstract: IBM "embedded dram" IBM supports ccga
Text: Standard cell/gate array ASIC for high-function, high-density applications Blue Logic Cu-11 ASIC Highlights 0.11-µm L drawn enables designs of up to 40 million gates Advanced technologies include copper metallurgy and low-k dielectric Choice of packaging options
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Cu-11
07SA14245100*
SA14-2451-00
ibm ASIC SRAM
IBM "embedded dram"
IBM supports ccga
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TC260C
Abstract: TC260 TOSHIBA standard cell library TC240 TC240C PCI 16f IEEE1284 TC260 TC260E types of transistors 1 gate toshiba logic
Text: 0.14 m CMOS ASIC TC260 Family PRODUCT GUIDE SLI ASIC for High-Function, Low-Power Applications TC260 Family The TC260 family of System-Level Integration SLI ASICs are designed for applications needing the highest performance with the smallest die size and lowest power.
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TC260
TC260C
TC260E
TC260
TC260 TOSHIBA standard cell library
TC240
TC240C
PCI 16f
IEEE1284
types of transistors
1 gate toshiba logic
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"embedded dram"
Abstract: types of transistors CMOS GATE ARRAYs toshiba 1 gate toshiba logic TC240 TC260C 0.25um TOSHIBA standard cell library TOSHIBA Logic
Text: 0.14 m CMOS ASIC TC260 Family PRODUCT GUIDE SLI ASIC for High-Function, Low-Power Applications TC260 Family The TC260 family of System-Level Integration SLI ASICs are designed for applications needing the highest performance with the smallest die size and lowest power.
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TC260
TC260C
TC260E
TC260
"embedded dram"
types of transistors
CMOS GATE ARRAYs toshiba
1 gate toshiba logic
TC240
0.25um TOSHIBA standard cell library
TOSHIBA Logic
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DRAM "deep trench" capacitor
Abstract: edram
Text: S ie m e ns Embedded DRAMs und Ihre Anwendung Dr.-Ing. Jörg Schönfeld, Siemens AG, München q q q q Technologie- und Marktanforderungen angepaßte Systemarchitektur mit eDRAMs Modulares Core-Konzept Anwendungen S ie m e ns Dr.-Ing. J. Schönfeld HL DC PE MC 5
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electronic passive components catalog
Abstract: "Angle Sensors" siemens photo sensor Hall sensors Siemens
Text: SPECTRUM Regensburg chip plant extended On May 5, Hall 15 – the new chip fabrication building at the Semiconductor Group’s Regensburg facility – was officially opened when Bavarian Premier Dr. Edmund Stoiber pressed the button to start production of the
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16M-bit
64M-bit
256M-bit
electronic passive components catalog
"Angle Sensors"
siemens photo sensor
Hall sensors Siemens
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SA-27E
Abstract: IBM PCI Express serdes architecture
Text: Standard cell/gate array ASIC for mainstream and cost-sensitive applications requiring fast time-to-market SA-27E ASIC Highlights Integration and performance deliver exceptional value. The IBM SA-27E ASIC is a dense, • Gate delay: 33 picoseconds
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SA-27E
SA14-2183-03
IBM PCI Express serdes architecture
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DRAM "deep trench" capacitor
Abstract: No abstract text available
Text: Embedded DRAMs und ihre Anwendung Dr.-Ing. Jörg Schönfeld, Siemens AG, HL DC PE MC, Postfach 80 17 09, D-81617 München email: joerg.schoenfeld@hl.siemens.de 1. Abstract 3. Stand der Technik Dieser Beitrag diskutiert zuerst allgemeine Aspekte von embedded DRAMs [eDRAMs]
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D-81617
DRAM "deep trench" capacitor
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ARM1136J-S
Abstract: ELDEC TOSHIBA TC160 ARM1136J TOSHIBA cmos image 1995 tc190c CMOS GATE ARRAYs toshiba TC190G TC280 Celaro
Text: 2007-3 PRODUCT GUIDE CMOS ASICs To ensure competitiveness in the marketplace, you will need to produce more sophisticated, more technology-intensive and higher value-added products, using a process of technological innovation and systematic marketing. Toshiba's application-specific
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BCE0032A
S-167
BCE0032B
ARM1136J-S
ELDEC
TOSHIBA TC160
ARM1136J
TOSHIBA cmos image 1995
tc190c
CMOS GATE ARRAYs toshiba
TC190G
TC280
Celaro
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code voltage regulator vhdl
Abstract: No abstract text available
Text: Memory Products Modular embedded DRAM DRM256 Version 1.1 PRODUCT OVERVIEW 07.97 DRM256 Revision History 07.97 Previous Releases: versions 1.0 and 0.9 of this document. Only editorial changes have been done in the current release of this document, no changes to the silicon occured
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DRM256
code voltage regulator vhdl
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TC260
Abstract: TC280 0.13um standard cell library 1 gate toshiba logic
Text: AN IDEAL SYSTEM-LEVEL INTEGRATION SLI PLATFORM TO ENABLE THE BROADBAND AGE Premium ASIC for high-performance and ultra-low power applications TC280 Family Broadband Internet access is rapidly reaching a huge number of people. With worldwide Internet traffic projected to
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TC280
TC260
0.13um standard cell library
1 gate toshiba logic
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Siemens Multibank DRAM
Abstract: No abstract text available
Text: SIEMENS 1 DRM256 Introduction Modular embedded DRAM is the core of a new service provided by the SIEMENS Memory Products group. Custom logic can be combined with the latest SIEMENS dynamic memory technology providing application specific embedded DRAM solutions manufactured by SIEMENS . Modular
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DRM256
Siemens Multibank DRAM
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Untitled
Abstract: No abstract text available
Text: Application N ote Fault Tolerance Decision in Memory Introduction Although small, there is some likelihood that DRAMbased memory in a computer can fail. These fails are of two basic categories: 1. Hard fails, in which the nature of the fail repeats, and is basically permanent. Fixing these fails
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Untitled
Abstract: No abstract text available
Text: IBM Microelectronics ? Standard cell/gate array value ASIC for high-function, high-density applications H ig h lig h ts ¥ Embedded DRAM, fully supported by IBM Blue Logic11 Design Methodology, with integrated built-in self test and redundancy ¥ C opper metallurgy for price/perfor
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SA-27Es
SA14-2183-00
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Untitled
Abstract: No abstract text available
Text: Philips Semiconductors Product specification TrenchMOS transistor Logic level FET FEATURES • • • • • • PHP37N06LT, PHB37N06LT SYMBOL QUICK REFERENCE DATA V,d s s ~ 5 5 V ’Trench’ technology Very low on-state resistance Fast switching Stable off-state characteristics
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PHP37N06LT,
PHB37N06LT
PHP37N06LT
T02ge
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