Untitled
Abstract: No abstract text available
Text: DPS832V Dense-Pac Microsystems, Inc. ^ CMOS SRAM VERSAPAC MODULE DESCRIPTION: The DPS832V is a 66-pin Pin Grid Array PGA consisting of four 8K X 8 SRAM devices in ceramic LCC packages surface mounted on a co-fired c e ra m ic su b stra te w ith m a tc h in g th erm al
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DPS832V
DPS832V
66-pin
128KX32
256KX32
30A014-13
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Untitled
Abstract: No abstract text available
Text: □PM DPS832V Dense-Pac Microsystems, I n a , CMOS SRAM VERSAPAC MODULE DESCRIPTION: The DPS832V is a 66-pin Pin Grid Array PGA consisting of four 8K X 8 SRAM devices in ceramic LC C packages surface mounted on a co-fired ceram ic substrate with m atching thermal
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OCR Scan
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PDF
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DPS832V
DPS832V
66-pin
128KX32
256KX32
16Kx16.
A014-13
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lz 02 1068
Abstract: No abstract text available
Text: □PM DPS832V V rC M O S Dense-Pac Microsystems, Inc. ^ SRAM VERSAPAC MODULE D E S C R IP T IO N : The D P S 8 3 2 V is a 66-pin Pin Grid Array PG A consisting of four 8 K X 8 S R A M devices in ceramic L C C p acka ge s surface m oun te d on a co-fired
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OCR Scan
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PDF
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DPS832V
DPS832V
66-pin
32Kx8,
16Kx16,
lz 02 1068
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Untitled
Abstract: No abstract text available
Text: □P M z Dense-Pac Microsystems, Inc. ^ DPS832V C M O S SRAM VERSAPAC MODULE DESCRIPTION: The D P S 8 3 2 V is a 66-pin Pin Grid Array PGA consisting of four 8K X 8 S R A M devices in ceramic LC C packages surface mounted on a co-fired c e ra m ic su b stra te w ith m a tc h in g therm al
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OCR Scan
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PDF
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DPS832V
DPS832V
66-pin
128KX32
256KX32
30A014-13
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