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    Untitled

    Abstract: No abstract text available
    Text: □PM Dense-Pac Microsystems, Inc. DPS16X16 16K X 16 C M O S SRAM M O D U LE o D ESC R IP TIO N : The D PS16X16 is part of a new family of high speed S tatic RA M m odules d e velo p e d by D ense-Pac Microsystems, Inc. The DPS16X16 uses advanced packaging concepts which mount four LC C memory


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    PDF DPS16X16 PS16X16 DPS16X16 125-C

    Untitled

    Abstract: No abstract text available
    Text: □PM Dense-Pac Microsystems, Inc. D PS16X16 16KX 16 C M O S SRAM M O D U LE O D ESCRIPTIO N: The D P S ! 6X16 is part of a new family of high speed Static R A M m odules developed by Dense-Pac Microsystems, Inc. The DPS16X16 uses advanced packaging concepts which mount four LCC memory


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    PDF PS16X16 DPS16X16 PS16X16

    Untitled

    Abstract: No abstract text available
    Text: < f v D P S16X 16 16K X 16 CMOS SRAM MODULE DESCRIPTION: The DPS 16X16 is part o f a new family of high speed S tatic RAM m odules d e ve lo p e d by Dense-Pac Microsystems, Inc. The DPS16X16 uses advanced packaging concepts which mount four LCC memory devices on a single multilayer ceramic substrate. The


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    PDF 16X16 DPS16X16 30A017-00 DPS16X16 30A017-00