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    30A10

    Abstract: H1163
    Text: DENSE-PAC 8 Megabit CMOS DRAM MICROSYSTEMS DPD512X16M2H3 PRELIMINARY D E S C R IP T IO N : The D PD 5 1 2X16M2H3 "S T A C K " module is a re vo lu tio n ary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC stacked and leaded for surface


    OCR Scan     		PDF DPD512X16M2H3 DPD51 100ns 40-PiN 3QA108-13 DDD13S4 30A10 H1163

    Untitled

    Abstract: No abstract text available
    Text: DENSE-PAC 8 Megabit CMOS DRAM D P D 512X 16M 2 H 3 M ICRO SYSTEM S PRELIM IN ARY D E S C R IP T IO N : T he D P D 5 1 2 X 1 6 M 2 H 3 “ S T A C K " m odule is a re v o lu tio n a r y n e w m e m o ry subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless


    OCR Scan     		PDF 100ns 30A108-13

    DP5Z

    Abstract: No abstract text available
    Text: n INDEX GENERAL PRODUCT INFORMATION Dense-Pac Memory Module and Monolithic E merging T echnology / Products. Quality and R e lia b ilit y . Warranty . . 6 . 7 . 8 14 SRAM PRODUCTS


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