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    DIP-TO-SOIC ADAPTER Search Results

    DIP-TO-SOIC ADAPTER Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    AD-CONNPBNCJK-000 Amphenol Cables on Demand Amphenol AD-CONNPBNCJK-000 N Plug to BNC Jack Adapter - Amphenol Connex RF Adapter (N Male / BNC Female) 2 Datasheet
    AD-COSMAJSMBP-000 Amphenol Cables on Demand Amphenol AD-COSMAJSMBP-000 SMA Jack to SMB Plug Adapter - Amphenol Connex RF Adapter (SMA Female / SMB Male) 2 Datasheet
    AD-CSMAJMMCXP-000 Amphenol Cables on Demand Amphenol AD-CSMAJMMCXP-000 SMA Jack to MMCX Plug Adapter - Amphenol Connex RF Adapter (SMA Female / MMCX Male) 2 Datasheet
    AV-3.5MINYRCA-015 Amphenol Cables on Demand Amphenol AV-3.5MINYRCA-015 Stereo Y Adapter Cable - Premium Gold Stereo 3.5mm (Headphone Plug) to Dual RCA Y Adapter Cable - 3.5mm Mini-Stereo Male to Dual RCA Male 15ft Datasheet
    SF-SFP28LPB1W-3DB Amphenol Cables on Demand Amphenol SF-SFP28LPB1W-3DB SFP28 Loopback Adapter Module for SFP28 Port Compliance Testing - 3dB Attenuation & 1W Power Consumption Datasheet

    DIP-TO-SOIC ADAPTER Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: DIP to SOIC Adapter Modules ACCUTEK MICROCIRCUIT CORPORATION DIP to SOIC ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION The Accutek SOIC family of Adapter Modules permit the connection of older Dual-Inline-Packages onto circuit board sites which are designed for standard pitch SOIC devices.


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    AK32WSOIC-D600S AK32WSOIC-D600 PDF

    DIP to SOIC Adapter Modules

    Abstract: No abstract text available
    Text: ACCUTEK DIP to SOIC Adapter Modules MICROCIRCUIT CORPORATION DIP to SOIC ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION The Accutek SOIC family of Adapter Modules permit the connection of older Dual-Inline-Packages onto circuit board sites which are designed for standard pitch SOIC devices.


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    AK32WSOIC-D600S AK32WSOIC-D600 DIP to SOIC Adapter Modules PDF

    14 pin ic dip

    Abstract: 16 soic pcb footprint footprint soic 16 pin DIP socket Accutek Microcircuit 8 soic pcb footprint AK16SOIC-D300S footprint dip 16 16 Pin dip ic AK08SOIC-D300
    Text: Accutek Microcircuit Corporation DIP to SOIC Adapter Modules DIP to SOIC ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION The Accutek SOIC family of Adapter Modules permit the connection of older Dual-Inline-Packages onto circuit board sites which are designed for standard pitch SOIC devices.


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    SOIC04) AK18SOIC-D300S AK18SOIC-D300 AK20SOIC-D300S AK20SOIC-D300 SOIC05) 14 pin ic dip 16 soic pcb footprint footprint soic 16 pin DIP socket Accutek Microcircuit 8 soic pcb footprint AK16SOIC-D300S footprint dip 16 16 Pin dip ic AK08SOIC-D300 PDF

    soj16 package

    Abstract: adaptor ssop56 dip48 W9518 W9512 W9514 SOJ-20 W9524 soj16 soj18 package TSOP14 package
    Text: WINSLOW ADAPTICs - SOIC or SOJ Solder Pads to DIP Adapters SOIC or SOJ Solder Pads to DIP ADAPTICs how to order shipping costs terms & conditions These ADAPTICs have an array of SOP solder pads on the top and male pins on the underside to mate with a DIP socket or solder into a


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    W12109 W9594 W9501 DIP08, W9583 TSSOP10, DIP10, SSOP48, DIP48, W9570 soj16 package adaptor ssop56 dip48 W9518 W9512 W9514 SOJ-20 W9524 soj16 soj18 package TSOP14 package PDF

    ds1480

    Abstract: DS1480S DS1425L-F5 DS1867E-010 DS1775 DS1225Y-200 F5 sot223 DS1023S-100 DS2110 DS1267S-100
    Text: OPERATING TEMP. RANGE CELSIUS ORDERING NUMBER DS0621-SDK SPEED OR VERSION 14-Pin DIP 8-Pin DIP 16-Pin SOIC 16-Pin SOIC T&R 8-Pin SOIC 8-Pin SOIC T&R 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 DS1000-xxx DS1000M-xxx DS1000S-xxx DS1000S-xxx/T&R DS1000Z-xxx


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    DS0621-SDK 14-Pin 16-Pin DS1000-xxx DS1000M-xxx DS1000S-xxx DS1000S-xxx/T DS1000Z-xxx DS1000Z-xxx/T ds1480 DS1480S DS1425L-F5 DS1867E-010 DS1775 DS1225Y-200 F5 sot223 DS1023S-100 DS2110 DS1267S-100 PDF

    SAE AMS-QQ-N-290

    Abstract: AMS-QQ-N-290 SN C5400 ASTM b16 B139 c5400 B545 C17200 IS410 IS410 brass
    Text: Series 647 Universal SOIC-to-DIP 0.600 [15.24] Adapter FEATURES • 44-pin adapter for mounting Aries Series 547 Universal SOIC ZIF Test Socket to 0.600 [15.24] DIP PCB layout. • Consult Data Sheet 10015 for test socket information. GENERAL SPECIFICATIONS


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    44-pin IS410 A4101A/26, C36000 ASTM-B16-00 AMS-QQ-N-290 C17200 ASTM-B194-01 MIL-G-45204 180g/pin; SAE AMS-QQ-N-290 AMS-QQ-N-290 SN C5400 ASTM b16 B139 c5400 B545 IS410 brass PDF

    Untitled

    Abstract: No abstract text available
    Text: Series 647 Universal SOIC to .600 [15.24] DIP Adapter Features: • 44 pin adapter for mounting Aries’ Series 547 Universal SOIC ZIF zero insertion force Test Socket to .600 [15.24] DIP PCB layout. Consult Data Sheet No. 10015 for test socket information.


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    C36000 ASTM-B16-85. MIL-P-81728 QQ-N-290. C17200 ASTM-B194-92. MILG-45204 PDF

    Untitled

    Abstract: No abstract text available
    Text: Series 647 Universal SOIC to .600 [15.24] DIP Adapter Features: • 44 pin adapter for mounting Aries’ Series 547 Universal SOIC ZIF zero insertion force Test Socket to .600 [15.24] DIP PCB layout. Consult Data Sheet No. 10015 for test socket information.


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    C36000 ASTM-B16-85. MIL-P-81728 QQ-N-290. C17200 ASTM-B194-92. MILG-45204 PDF

    Untitled

    Abstract: No abstract text available
    Text: Series 647 Universal SOIC to .600 [15.24] DIP Adapter Features: • 44 pin adapter for mounting Aries’ Series 547 Universal SOIC ZIF zero insertion force Test Socket to .600 [15.24] DIP PCB layout. Consult Data Sheet No. 10015 for test socket information.


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    C36000 ASTM-B16-85. MIL-P-81728 QQ-N-290. C17200 ASTM-B194-92. MILG-45204 PDF

    SAE-AMS-QQN-290

    Abstract: c5400
    Text: Series 647 Universal SOIC to .600 [15.24] DIP Adapter Features: • 44 pin adapter for mounting Aries’ Series 547 Universal SOIC ZIF zero insertion force Test Socket to .600 [15.24] DIP PCB layout. Consult Data Sheet No. 10015 for test socket information.


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    FR-406 IS410 IPCA4101A/26, C36000 ASTM-B16-00. SAE-AMS-QQ-N-290. C17200 ASTM-B194-01. 44-647-10TL SAE-AMS-QQN-290 c5400 PDF

    Untitled

    Abstract: No abstract text available
    Text: Series 647 Universal SOIC to .600 [15.24] DIP Adapter Features: • 44 pin adapter for mounting Aries’ Series 547 Universal SOIC ZIF zero insertion force Test Socket to .600 [15.24] DIP PCB layout. Consult Data Sheet No. 10015 for test socket information.


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    C36000 ASTM-B16-85. MIL-P-81728 QQ-N-290. C17200 ASTM-B194-92. MILG-45204 PDF

    Untitled

    Abstract: No abstract text available
    Text: Series 647 Universal SOIC to .600 [15.24] DIP Adapter Features: • 44 pin adapter for mounting Aries’ Series 547 Universal SOIC ZIF zero insertion force Test Socket to .600 [15.24] DIP PCB layout. Consult Data Sheet No. 10015 for test socket information.


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    FR-406 IS410 IPCA4101A/26, C36000 ASTM-B16-00. SAE-AMS-QQ-N-290. C17200 ASTM-B194-01. 44-647-10TL PDF

    IPC4101A/26

    Abstract: C17200 IS410
    Text: Series 354000 RoHS/WEEE-Compliant DIP-to-SOIC Adapter FEATURES • Convenient, cost-effective means of converting DIP-to-SOIC PC board layouts GENERAL SPECIFICATIONS • SOCKET BODY: black, UL 94V-0 glass-filled 4/6 Nylon 170°C continuous use temperature


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    IS410 IPC4101A/26 C36000 ASTM-B16-00 MIL-G-45204 SAE-AMS-QQ-N-290 18009RC C17200 PDF

    ASTM B194

    Abstract: c5400 ASTM-B16-85 C17200 MILG-45204 ASTM-B139-90
    Text: Series 647 Universal SOIC to .600 [15.24] DIP Adapter Features: • 44 pin adapter for mounting Aries’ Series 547 Universal SOIC ZIF zero insertion force Test Socket to .600 [15.24] DIP PCB layout. Consult Data Sheet No. 10015 for test socket information.


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    C36000 ASTM-B16-85. MIL-P-81728 QQ-N-290. C17200 ASTM-B194-92. MILG-45204 ASTM B194 c5400 ASTM-B16-85 ASTM-B139-90 PDF

    Untitled

    Abstract: No abstract text available
    Text: Series 354000 DIP to SOIC Adapters RoHS/ WEEE Compliant FEATURES: • Convenient, cost-effective means of converting DIP style packaging to SOIC PC board layouts. SPECIFICATIONS: • Socket body is black, UL 94V-0 Glass-filled 4/6 Nylon 170°C continuous use temp.


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    FR406 IS410 IPC4101A/26 C36000 ASTM-B16-85. MIL-G-45204 QQ-N-290. PDF

    SAE AMS-QQ-N-290

    Abstract: AMS-QQ-N-290 FR406 IPC4101A/26 ASTM b16 ASTM B194 C17200 IS410 ASTM-B16-00 C36000
    Text: Series 354000 DIP to SOIC Adapters RoHS/ WEEE Compliant FEATURES: • Convenient, cost-effective means of converting DIP style packaging to SOIC PC board layouts. SPECIFICATIONS: • Socket body is black, UL 94V-0 Glass-filled 4/6 Nylon 170°C continuous use temp.


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    FR406 IS410 IPC4101A/26 C36000 ASTM-B16-00. MIL-G-45204 SAE-AMS-QQ-N-290. C36000 SAE AMS-QQ-N-290 AMS-QQ-N-290 ASTM b16 ASTM B194 C17200 ASTM-B16-00 PDF

    Untitled

    Abstract: No abstract text available
    Text: Series 354000 DIP to SOIC Adapters FEATURES: • Convenient, cost-effective means of converting DIP style packaging to SOIC PC board layouts. SPECIFICATIONS: • Socket body is black, UL 94V-0 Glass-filled Thermoplastic Polyester PET . • PCB is black FR-4, .062 [1.58] thick.


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    C36000 ASTM-B16-85. MIL-P-81728 QQ-N-290. MIL-G-45204 C17200 ASTM-B194-92. PDF

    ASTM b16

    Abstract: ASTM B194 ASTM-B16-85 C17200 ASTM-B-194
    Text: Series 354000 DIP to SOIC Adapters FEATURES: • Convenient, cost-effective means of converting DIP style packaging to SOIC PC board layouts. SPECIFICATIONS: • Socket body is black, UL 94V-0 Glass-filled Thermoplastic Polyester PET . • PCB is black FR-4, .062 [1.58] thick.


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    C36000 ASTM-B16-85. MIL-P-81728 QQ-N-290. C36000 MIL-G-45204 C17200 ASTM b16 ASTM B194 ASTM-B16-85 C17200 ASTM-B-194 PDF

    SAE 0700

    Abstract: sae 0800 SAE 700 AMS-QQ-N-290 C17200 SAE AMS-QQ-N-290
    Text: Series 354000 DIP-to-SOIC Adapter FEATURES • Convenient, cost-effective means of converting DIP-to-SOIC PC board layouts. GENERAL SPECIFICATIONS • SOCKET BODY: black, UL 94V-0 glass-filled 4/6 Nylon 170°C continuous use temp • PCB: FR-4, 0.062 [1.58] thick


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    C36000, B16/B16M B579-73 AMS-QQ-N-290 MIL-G-45204 SAE 0700 sae 0800 SAE 700 AMS-QQ-N-290 C17200 SAE AMS-QQ-N-290 PDF

    SAE 0700

    Abstract: sae 0800 Brass 360 B194-08
    Text: Series 354000 DIP-to-SOIC Adapter FEATURES • Convenient, cost-effective means of converting DIP-to-SOIC PC board layouts. GENERAL SPECIFICATIONS • SOCKET BODY: black, UL 94V-0 glass-filled 4/6 Nylon 170°C continuous use temp • PCB: FR-4, 0.062 [1.58] thick


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    C36000, B16/B16M B579-73 AMS-QQ-N-290 MIL-G-45204 C17200, B194-08 SAE 0700 sae 0800 Brass 360 B194-08 PDF

    c36000

    Abstract: ASTM b16 ASTM-B16-85 C17200 MIL-G45204 MIL-T-10727
    Text: Series 354000 DIP to SOIC Adapters FEATURES: • Convenient, cost-effective means of converting DIP style packaging to SOIC PC board layouts. SPECIFICATIONS: • Socket body is black, UL 94V-0 Glass-filled 4/6 Nylon 170°C continuous use temp. • PCB is FR-4, .062 [1.58] thick.


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    C36000 ASTM-B16-85. MIL-T-10727 MIL-P-81728 QQ-N-290. C36000 MIL-G-45204 ASTM b16 ASTM-B16-85 C17200 MIL-G45204 MIL-T-10727 PDF

    Untitled

    Abstract: No abstract text available
    Text: Series 354000 DIP to SOIC Adapters FEATURES: • Convenient, cost-effective means of converting DIP style packaging to SOIC PC board layouts. SPECIFICATIONS: • Socket body is black, UL 94V-0 Glass-filled 4/6 Nylon 170°C continuous use temp. • PCB is FR-4, .062 [1.58] thick.


    Original
    C36000 ASTM-B16-85. MIL-T-10727 MIL-P-81728 QQ-N-290. MIL-G-45204 C17200 PDF

    Untitled

    Abstract: No abstract text available
    Text: Series 354000 DIP to SOIC Adapters FEATURES: • Convenient, cost-effective means of converting DIP style packaging to SOIC PC board layouts. SPECIFICATIONS: • Socket body is black, UL 94V-0 Glass-filled 4/6 Nylon 170°C continuous use temp. • PCB is FR-4, .062 [1.58] thick.


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    C36000 ASTM-B16-00. SAE-AMS-QQ-N-290. MIL-G-45204 PDF

    Untitled

    Abstract: No abstract text available
    Text: Series 354000 DIP to SOIC Adapters FEATURES: • Convenient, cost-effective means of converting DIP style packaging to SOIC PC board layouts. SPECIFICATIONS: • Socket body is black, UL 94V-0 Glass-filled 4/6 Nylon 170°C continuous use temp. • PCB is FR-4, .062 [1.58] thick.


    Original
    C36000 ASTM-B16-85. MIL-T-10727 MIL-P-81728 QQ-N-290. MIL-G-45204 PDF