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    DIP PACKAGE DIMENSION Search Results

    DIP PACKAGE DIMENSION Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    DIP PACKAGE DIMENSION Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    TQFP 100 PACKAGE footprint

    Abstract: footprint 24PIN DIP 100L J-10 J-12 J-13 footprint dip 16 AD #0953
    Text: ICS Standard Package Dimensions J-1 DIP Packages 8-Pin DIP Package 14-Pin DIP Package See individual data sheets for more specific ordering information. J-3 DIP Packages 16-Pin DIP Package 20-Pin DIP Package See individual data sheets for more specific ordering information.


    Original     		PDF 14-Pin 16-Pin 20-Pin 24-Pin 28-Pin TQFP 100 PACKAGE footprint footprint 24PIN DIP 100L J-10 J-12 J-13 footprint dip 16 AD #0953

    footprint 24PIN DIP

    Abstract: 1400E AF 239 TQFP 100 PACKAGE footprint dip Package dimension 100L J-10 J-12 J-13 TQFP 80 PACKAGE footprint
    Text: DIP Packages 8-Pin DIP Package 14-Pin DIP Package See individual data sheets for more specific ordering information. J-3 DIP Packages 16-Pin DIP Package 20-Pin DIP Package See individual data sheets for more specific ordering information. J-4 DIP Packages


    Original     		PDF 14-Pin 16-Pin 20-Pin 24-Pin 28-Pin footprint 24PIN DIP 1400E AF 239 TQFP 100 PACKAGE footprint dip Package dimension 100L J-10 J-12 J-13 TQFP 80 PACKAGE footprint

    32-PIN

    Abstract: PD-03 745 diode dimensions PD05 32 PIN
    Text: Package Diagram DIP Modules 32-Pin DIP Module PD02 1.590 1.610 0.600 0.620 0.590 0.610 0.007 0.013 0.315 0.335 0.100 TYP 0.015 0.025 0.125 0.175 0.050 TYP 32-Pin DIP Module PD03 1 DIMENSIONSININCHES MIN. MAX. Package Diagram 32-Pin DIP Module PD05 1.745 1.755


    Original     		PDF 32-Pin 60-Pin 600TYP. PD-03 745 diode dimensions PD05 32 PIN

    smd reed relay

    Abstract: DIP12
    Text: MEDER electronic DIP Series Molded DIP Reed Relays DESCRIPTION The DIP series is a very compact design having a low profile package and a high profile package. This series is compatible with all DIP relays. CHARACTERISTICS • Low profile package • Standard pin configurations


    Original     		PDF

    mercury wetted relay

    Abstract: DIP12 DIP SWITCH 10 PIN smd reed relay 1A72
    Text: MEDER electronic DIP Series Molded DIP Reed Relays DESCRIPTION The DIP series is a very compact design having a low profile package and a high profile package. This series is compatible with all DIP relays. CHARACTERISTICS • Low profile package • Standard pin configurations


    Original     		PDF

    SHEET24

    Abstract: No abstract text available
    Text: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN CERAMIC To Top / Package Lineup / Package Index DIP-24C-A07 EIAJ code :∗DIP024-C-0600-4 24-pin ceramic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Metal seal DIP-24C-A07 24-pin ceramic DIP


    Original     		PDF DIP-24C-A07 DIP024-C-0600-4 24-pin DIP-24C-A07) D24021SC-1-3 SHEET24

    fujitsu

    Abstract: 20p 2.54 DIP-20P-M01
    Text: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 20 PIN PLASTIC To Top / Package Lineup / Package Index DIP-20P-M01 EIAJ code :∗DIP020-P-0300-1 20-pin plastic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Plastic mold DIP-20P-M01 20-pin plastic DIP


    Original     		PDF DIP-20P-M01 DIP020-P-0300-1 20-pin DIP-20P-M01) D20005S-3C-3 fujitsu 20p 2.54 DIP-20P-M01

    DIP032-P-0600-1

    Abstract: No abstract text available
    Text: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 32 PIN PLASTIC To Top / Package Lineup / Package Index DIP-32P-M01 EIAJ code :∗DIP032-P-0600-1 32-pin plastic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Plastic mold DIP-32P-M01 32-pin plastic DIP


    Original     		PDF DIP-32P-M01 DIP032-P-0600-1 32-pin DIP-32P-M01) D32007S-1C-3 DIP032-P-0600-1

    22-Pin

    Abstract: transistor 22p
    Text: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 22 PIN PLASTIC To Top / Package Lineup / Package Index DIP-22P-M03 EIAJ code :∗DIP022-P-0400-1 22-pin plastic DIP Lead pitch 100 mil Row spacing 400 mil Sealing method Plastic mold DIP-22P-M03 22-pin plastic DIP


    Original     		PDF DIP-22P-M03 DIP022-P-0400-1 22-pin DIP-22P-M03) D22010S-4C-3 transistor 22p

    48-pin

    Abstract: d480 DIP048-P-0600-1
    Text: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN PLASTIC To Top / Package Lineup / Package Index DIP-48P-M02 EIAJ code :∗DIP048-P-0600-1 48-pin plastic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Plastic mold DIP-48P-M02 48-pin plastic DIP


    Original     		PDF DIP-48P-M02 DIP048-P-0600-1 48-pin DIP-48P-M02) D48003S-3C-3 d480 DIP048-P-0600-1

    Untitled

    Abstract: No abstract text available
    Text: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 14 PIN CERAMIC To Top / Package Lineup / Package Index DIP-14C-C04 EIAJ code :∗DIP014-G-0300-4 14-pin ceramic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Cerdip DIP-14C-C04 14-pin ceramic DIP


    Original     		PDF DIP-14C-C04 DIP014-G-0300-4 14-pin DIP-14C-C04) DIP-C14-C04) D14006SC-2-3

    24-Pin Ceramic DIP

    Abstract: No abstract text available
    Text: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN CERAMIC To Top / Package Lineup / Package Index DIP-24C-C01 EIAJ code :∗DIP024-G-0600-2 24-pin ceramic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Cerdip DIP-24C-C01 24-pin ceramic DIP


    Original     		PDF DIP-24C-C01 DIP024-G-0600-2 24-pin DIP-24C-C01) D24008SC-3-4 24-Pin Ceramic DIP

    Untitled

    Abstract: No abstract text available
    Text: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 14 PIN PLASTIC To Top / Package Lineup / Package Index DIP-14P-M02 EIAJ code :∗DIP014-P-0300-1 14-pin plastic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Plastic mold DIP-14P-M02 14-pin plastic DIP


    Original     		PDF DIP-14P-M02 DIP014-P-0300-1 14-pin DIP-14P-M02) D14010S-4C-3

    Untitled

    Abstract: No abstract text available
    Text: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 16 PIN CERAMIC To Top / Package Lineup / Package Index DIP-16C-C04 EIAJ code :∗DIP016-G-0300-5 16-pin ceramic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Cerdip DIP-16C-C04 16-pin ceramic DIP


    Original     		PDF DIP-16C-C04 DIP016-G-0300-5 16-pin DIP-16C-C04) D16032SC-4-3

    Untitled

    Abstract: No abstract text available
    Text: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 42 PIN CERAMIC To Top / Package Lineup / Package Index DIP-42C-A01 EIAJ code :∗DIP042-C-0600-1 42-pin ceramic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Metal seal DIP-42C-A01 42-pin ceramic DIP


    Original     		PDF DIP-42C-A01 DIP042-C-0600-1 42-pin DIP-42C-A01) D42005SC-2-3

    48-pin

    Abstract: D4800 d480
    Text: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN CERAMIC To Top / Package Lineup / Package Index DIP-48C-A01 EIAJ code :∗DIP048-C-0600-1 48-pin ceramic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Metal seal DIP-48C-A01 48-pin ceramic DIP


    Original     		PDF DIP-48C-A01 DIP048-C-0600-1 48-pin DIP-48C-A01) D48001SC-3-3 D4800 d480

    fujitsu

    Abstract: No abstract text available
    Text: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 18 PIN PLASTIC To Top / Package Lineup / Package Index DIP-18P-M04 EIAJ code :∗DIP018-P-0300-3 18-pin plastic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Plastic mold DIP-18P-M04 18-pin plastic DIP


    Original     		PDF DIP-18P-M04 DIP018-P-0300-3 18-pin DIP-18P-M04) D18015S-4C-3 fujitsu

    Untitled

    Abstract: No abstract text available
    Text: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 16 PIN PLASTIC To Top / Package Lineup / Package Index DIP-16P-M03 EIAJ code :∗DIP016-P-0300-1 16-pin plastic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Plastic mold DIP-16P-M03 16-pin plastic DIP


    Original     		PDF DIP-16P-M03 DIP016-P-0300-1 16-pin DIP-16P-M03) D16030S-3C-3

    18-Pin

    Abstract: d1801 DUAL transistor M03 DIP-18P-M03 D18011
    Text: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 18 PIN PLASTIC To Top / Package Lineup / Package Index DIP-18P-M03 EIAJ code :∗DIP018-P-0300-2 18-pin plastic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Plastic mold DIP-18P-M03 18-pin plastic DIP


    Original     		PDF DIP-18P-M03 DIP018-P-0300-2 18-pin DIP-18P-M03) D18011S-3C-3 d1801 DUAL transistor M03 DIP-18P-M03 D18011

    dip 24 dimension

    Abstract: No abstract text available
    Text: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN CERAMIC To Top / Package Lineup / Package Index DIP-24C-A04 EIAJ code :∗DIP024-C-0600-2 24-pin ceramic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Metal seal DIP-24C-A04 24-pin ceramic DIP


    Original     		PDF DIP-24C-A04 DIP024-C-0600-2 24-pin DIP-24C-A04) D24013SC-2-3 dip 24 dimension

    28-pin

    Abstract: No abstract text available
    Text: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC To Top / Package Lineup / Package Index DIP-28P-M05 EIAJ code :∗DIP028-P-0600-2 28-pin plastic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Plastic mold DIP-28P-M05 28-pin plastic DIP


    Original     		PDF DIP-28P-M05 DIP028-P-0600-2 28-pin DIP-28P-M05) D28013S-3C-2

    18-Pin

    Abstract: No abstract text available
    Text: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 18 PIN CERAMIC To Top / Package Lineup / Package Index DIP-18C-C01 EIAJ code :∗DIP018-G-0300-2 18-pin ceramic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Cerdip DIP-18C-C01 18-pin ceramic DIP


    Original     		PDF DIP-18C-C01 DIP018-G-0300-2 18-pin DIP-18C-C01) D18005SC-4-3

    Untitled

    Abstract: No abstract text available
    Text: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 18 PIN PLASTIC To Top / Package Lineup / Package Index DIP-18P-M02 EIAJ code :∗DIP018-P-0300-1 18-pin plastic DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Plastic mold DIP-18P-M02 18-pin plastic DIP


    Original     		PDF DIP-18P-M02 DIP018-P-0300-1 18-pin DIP-18P-M02) D18009S-3C-3

    Untitled

    Abstract: No abstract text available
    Text: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 36 PIN PLASTIC To Top / Package Lineup / Package Index DIP-36P-M01 EIAJ code :∗DIP036-P-0600-1 36-pin plastic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Plastic mold DIP-36P-M01 36-pin plastic DIP


    Original     		PDF DIP-36P-M01 DIP036-P-0600-1 36-pin DIP-36P-M01) D36001S-1C-2