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    DIODE A112 - 25 -16 B2 Search Results

    DIODE A112 - 25 -16 B2 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CUZ24V Toshiba Electronic Devices & Storage Corporation Zener Diode, 24 V, USC Visit Toshiba Electronic Devices & Storage Corporation
    XCUZ13V Toshiba Electronic Devices & Storage Corporation Zener Diode, 13.0 V, USC Visit Toshiba Electronic Devices & Storage Corporation
    XCUZ36V Toshiba Electronic Devices & Storage Corporation Zener Diode, 36.0 V, USC Visit Toshiba Electronic Devices & Storage Corporation
    CUZ12V Toshiba Electronic Devices & Storage Corporation Zener Diode, 12 V, USC Visit Toshiba Electronic Devices & Storage Corporation
    MUZ5V6 Toshiba Electronic Devices & Storage Corporation Zener Diode, 5.6 V, USM Visit Toshiba Electronic Devices & Storage Corporation

    DIODE A112 - 25 -16 B2 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    transistor A106

    Abstract: transistor PNP A105 transistor pnp a110 TRANSISTOR A107 a69 156 transistor A94 TRANSISTOR A114 TRANSISTOR a105 A107 capacitor TRANSISTOR A98 motorola mosfet
    Text: N LM2639 Evaluation Board V.2 Test Procedures 4/9/99 The LM2639 evaluation board V.2 is designed to handle 20A output current under room temperature with no air flow. Efficiency is around 80% at 2V, 20A. With very little air flow, such as that provided by a typical ATX power supply Muffin fan, the board can handle 25A to 30A


    Original     		PDF LM2639 T025A2 OT-23 SMDIP-10 SO-24 205Inductor A6S-0104 transistor A106 transistor PNP A105 transistor pnp a110 TRANSISTOR A107 a69 156 transistor A94 TRANSISTOR A114 TRANSISTOR a105 A107 capacitor TRANSISTOR A98 motorola mosfet

    balun 75-ohm to 120-ohm

    Abstract: 500w power amplifier pcb diagram 10 watt amplifier chassis schematic diagram pcb 10 watt power amplifier chassis schematic diagram 135CT050-3D3 1320011 JEDEC-22-A101 T-PLI 200 thermagon equivalent diode for 8724 Thermagon tpli 215
    Text: Application Note ACA0861 - A, B, C, D 750/860 MHz CATV Line Amplifiers Rev 2 Figure 1. A basic cascade circuit topology, shown in Figure 2, is used for each amplifier. This circuit approach meets the demanding performance requirements of low distortion and low noise figure.


    Original     		PDF ACA0861 ACA0861A ACA0861B ACA0861C ACA0861D balun 75-ohm to 120-ohm 500w power amplifier pcb diagram 10 watt amplifier chassis schematic diagram pcb 10 watt power amplifier chassis schematic diagram 135CT050-3D3 1320011 JEDEC-22-A101 T-PLI 200 thermagon equivalent diode for 8724 Thermagon tpli 215

    sc1142

    Abstract: sanyo a75 amplifier IR7811 a106 diode SC1142CSW surface mount A106 diode B85 diode A107 capacitor B91 02 diode A116 diode
    Text: HIGH SPEED SYNCHRONOUS POWER MOSFET SMART DRIVER December 16, 1999 TEL:805-498-2111 FAX:805-498-3804 WEB:http://www.semtech.com DESCRIPTION The SC1405B is a Dual-MOSFET Driver with an internal Overlap Protection Circuit to prevent shoot-through from VIN to GND in the main switching and synchronous MOSFET’s. Each driver is capable of driving


    Original     		PDF SC1405B SC1405B 3000pF IR7811 FDB7030 TSSOP-14 ECN99-773 sc1142 sanyo a75 amplifier a106 diode SC1142CSW surface mount A106 diode B85 diode A107 capacitor B91 02 diode A116 diode

    20n03

    Abstract: surface mount A106 diode 835L DIODE MBRD835 20n03 mosfet DIODE MOTOROLA B34 diode u2 a97 iboc PIN202 D1222
    Text: PROGRAMMABLE, HIGH PERFORMANCE MULTI-PHASE, PWM CONTROLLER Preliminary - July 7, 1999 SC1144 TEL:805-498-2111 FAX:805-498-3804 WEB:http://www.semtech.com DESCRIPTION The SC1144 is a high performance, multi-phase PWM controller designed for high power microprocessors requiring ultra fast transient response, such as


    Original     		PDF SC1144 SC1144 SC1144EVB SO-24 MS-013AD B17104B 20n03 surface mount A106 diode 835L DIODE MBRD835 20n03 mosfet DIODE MOTOROLA B34 diode u2 a97 iboc PIN202 D1222

    MO-83-AF

    Abstract: PQFP moisture sensitive handling and packaging footprint jedec MS-026 TQFP schematic impulse sealer BGA 11x11 junction to board thermal resistance EIA standards 481 JEDEC MS-026 footprint eftec 64 EFTEC-64 footprint jedec MS-026 TQFP 128
    Text: Packages and Thermal Characteristics  August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336


    Original     		PDF XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 MO-83-AF PQFP moisture sensitive handling and packaging footprint jedec MS-026 TQFP schematic impulse sealer BGA 11x11 junction to board thermal resistance EIA standards 481 JEDEC MS-026 footprint eftec 64 EFTEC-64 footprint jedec MS-026 TQFP 128

    20n03

    Abstract: surface mount A106 diode 835L DIODE DIODE MOTOROLA B34 DIODE B91 MBRD835 DI2220V301R-00 835l A106 Micro Capacitor capacitor 1u 10v
    Text: PROGRAMMABLE, HIGH PERFORMANCE MULTI-PHASE, PWM CONTROLLER Preliminary - August 24, 1999 SC1144 TEL:805-498-2111 FAX:805-498-3804 WEB:http://www.semtech.com DESCRIPTION The SC1144 is a high performance, multi-phase PWM controller designed for high power microprocessors requiring ultra fast transient response, such as


    Original     		PDF SC1144 SC1144 SC1144EVB SO-24 MS-013AD B17104B 20n03 surface mount A106 diode 835L DIODE DIODE MOTOROLA B34 DIODE B91 MBRD835 DI2220V301R-00 835l A106 Micro Capacitor capacitor 1u 10v

    PCB footprint cqfp 132

    Abstract: schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318
    Text: Packages and Thermal Characteristics  August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336


    Original     		PDF XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 PCB footprint cqfp 132 schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318

    footprint jedec MS-026 TQFP 128

    Abstract: schematic impulse sealer footprint jedec MS-026 TQFP JEDEC Package Code MS-026-AED BGA 11x11 junction to board thermal resistance QFP Package 128 lead .5mm .65mm bga land pattern MS-026-BGA Shipping Trays 16x16 XC4010E-PQ208
    Text: Packages and Thermal Characteristics  June 1, 1996 Version 1.1 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336


    Original     		PDF XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 footprint jedec MS-026 TQFP 128 schematic impulse sealer footprint jedec MS-026 TQFP JEDEC Package Code MS-026-AED BGA 11x11 junction to board thermal resistance QFP Package 128 lead .5mm .65mm bga land pattern MS-026-BGA Shipping Trays 16x16 XC4010E-PQ208

    sc1142

    Abstract: a106 diode B118 Mos-fet a106 capacitor surface mount A106 diode B85 diode sanyo a75 amplifier MOSFET A13 IR7811 PIN112
    Text: HIGH SPEED SYNCHRONOUS POWER MOSFET SMART DRIVER March 14, 2000 SC1405B TEL:805-498-2111 FAX:805-498-3804 WEB:http://www.semtech.com DESCRIPTION The SC1405B is a Dual-MOSFET Driver with an internal Overlap Protection Circuit to prevent shoot-through from VIN to GND in the main switching and synchronous MOSFET’s. Each driver is capable of driving


    Original     		PDF SC1405B SC1405B 3000pF IR7811 FDB7030 TSSOP-14 ECN00-924 sc1142 a106 diode B118 Mos-fet a106 capacitor surface mount A106 diode B85 diode sanyo a75 amplifier MOSFET A13 IR7811 PIN112

    sc1142

    Abstract: IR7811 SC1142CSW surface mount A106 diode SC1142-1205 diode b81 a113 FET SANYO 1000uF 16V CA B20 bridge rectifier B40 B2 RECTIFIER
    Text: HIGH SPEED SYNCHRONOUS POWER MOSFET DRIVER PRELIMINARY - December 7, 1999 SC1205 TEL:805-498-2111 FAX:805-498-3804 WEB:http://www.semtech.com DESCRIPTION FEATURES The SC1205 is a cost effective Dual MOSFET Driver designed for switching High and Low side Power


    Original     		PDF SC1205 SC1205 3000pF MS-012AA ECN99-742 sc1142 IR7811 SC1142CSW surface mount A106 diode SC1142-1205 diode b81 a113 FET SANYO 1000uF 16V CA B20 bridge rectifier B40 B2 RECTIFIER

    IC951

    Abstract: stm diode C818 smd diode mx c321 ic501 smd diode ge r803 pin diagram of optical detector IC501 R435 RF receiver MODULE CIRCUIT DIAGRAM LDR 03 PHOTO RESISTOR 2222A SMD transistor C458
    Text: APPLICATION NOTE Fiber optic transceiver demo board STM16 OM5801 AN96051 Philips Semiconductors Philips Semiconductors OM5801 Application Note AN96051 2 Philips Semiconductors Fiber optic transceiver demo board STM16 Application Note AN96051 APPLICATION NOTE


    Original     		PDF STM16 OM5801 AN96051 IC951 stm diode C818 smd diode mx c321 ic501 smd diode ge r803 pin diagram of optical detector IC501 R435 RF receiver MODULE CIRCUIT DIAGRAM LDR 03 PHOTO RESISTOR 2222A SMD transistor C458

    SM800PCX

    Abstract: SM800 ELAN520 SMP5PC SM520PC ibm usa 2001 P6 MOTHERBOARD SERVICE MANUAL dell lcd 17 power supply diagram d15 b80 rec PC104 SOT-23 PE1
    Text: Detailed Technical USER MANUAL FOR: smartModule SM800PC/X Nordstrasse 11/F CH - 4542 Luterbach Tel.: +41 0 32 681 58 00 Fax: +41 (0)32 681 58 01 Email: support@digitallogic.com Homepage: http://www.digitallogic.com DIGITAL-LOGIC AG SM800PC/X Detailed Technical Manual V0.9


    Original     		PDF SM800PC/X SM800PC/X SM800PCX \HANDBUCH\smart\SM800\SM800PCX SM800 ELAN520 SMP5PC SM520PC ibm usa 2001 P6 MOTHERBOARD SERVICE MANUAL dell lcd 17 power supply diagram d15 b80 rec PC104 SOT-23 PE1

    ibm usa 2001 P6 MOTHERBOARD SERVICE MANUAL

    Abstract: ibm usa 2001 P6 MOTHERBOARD SMP5PC i1a r9 diode SM800 avr ps2 keyboard circuit LX800 PC104 AMD 133MHz ELAN 520 MSM586
    Text: Detailed Technical USER MANUAL FOR: smartModule SM800PC/X SM900PC/X Nordstrasse 11/F CH - 4542 Luterbach Tel.: +41 0 32 681 58 00 Fax: +41 (0)32 681 58 01 Email: support@digitallogic.com Homepage: http://www.digitallogic.com DIGITAL-LOGIC AG SM800PC/X & SM900PC/X Detailed Technical Manual V1.0


    Original     		PDF SM800PC/X SM900PC/X SM900PC/X SM800-900PCX \HANDBUCH\smart\SM800-900\SM800-900PCX smart480 ibm usa 2001 P6 MOTHERBOARD SERVICE MANUAL ibm usa 2001 P6 MOTHERBOARD SMP5PC i1a r9 diode SM800 avr ps2 keyboard circuit LX800 PC104 AMD 133MHz ELAN 520 MSM586

    Untitled

    Abstract: No abstract text available
    Text: 22B-UM001.book Page 1 Wednesday, January 22, 2014 11:04 AM Adjustable Frequency AC Drive FRN 1.xx - 6.xx User Manual www.abpowerflex.com 22B-UM001.book Page 2 Wednesday, January 22, 2014 11:04 AM Important User Information Solid state equipment has operational characteristics differing from those of


    Original     		PDF 22B-UM001 22B-UM001H-EN-E 22B-UM001G-EN-E

    schematic impulse sealer

    Abstract: qfp 64 0.4 mm pitch land pattern Rotron pk100 power supply XC4013E-PQ240 EFTEC-64 XC4010E-PQ208 MO-151-AAN-1 PK100 land pattern for TSOP 2 86 PIN
    Text: Packages and Thermal Characteristics: High-Reliability Products R 0 5 PK100 v1.0 June 15, 2000 Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or 0.100").


    Original     		PDF PK100 060ROM schematic impulse sealer qfp 64 0.4 mm pitch land pattern Rotron pk100 power supply XC4013E-PQ240 EFTEC-64 XC4010E-PQ208 MO-151-AAN-1 PK100 land pattern for TSOP 2 86 PIN

    footprint jedec MS-026 TQFP

    Abstract: JEDEC MS-026 footprint qfp 64 0.5 mm pitch land pattern fine BGA thermal profile schematic impulse sealer HQ208 PQ100 land pattern QFP 208 PQ208 TQ100
    Text: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF

    schematic impulse sealer

    Abstract: XC4010E-PQ208 JEDEC Package Code MS-026-AED XC4013E-PQ240 JEDEC MS-026 footprint MS-026-ACB footprint jedec MS-026 TQFP 128 XC4013E-BG225 PG299-XC4025E bav 21 diode
    Text: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF

    JEDEC Package Code MS-026-AED

    Abstract: EFTEC-64 schematic impulse sealer footprint jedec MS-026 TQFP PQ-208 footprint jedec MS-026 TQFP 128 QFP PACKAGE thermal resistance die down EIA standards 481 ipc-sm-786A VQ44
    Text: • Packages and Thermal Characteristics  November 20, 1997 Version 2.0 10* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF

    footprint jedec MS-026 TQFP 128

    Abstract: schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228
    Text: 08 001-022_pkg.fm Page 1 Tuesday, March 14, 2000 2:15 PM Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF FG860 FG900 FG1156 footprint jedec MS-026 TQFP 128 schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228

    schematic impulse sealer

    Abstract: leadframe C7025 MO-151-BAR PG223-XC4013E XC4010E-PQ208 BGA 31 x 31 mm footprint jedec MS-026 TQFP 128 footprint jedec mo-067 XC4013E-PQ240 EIA standards 481
    Text: Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF FG860 FG900 FG1156 schematic impulse sealer leadframe C7025 MO-151-BAR PG223-XC4013E XC4010E-PQ208 BGA 31 x 31 mm footprint jedec MS-026 TQFP 128 footprint jedec mo-067 XC4013E-PQ240 EIA standards 481

    celeron B121

    Abstract: celeron MOTHERBOARD CIRCUIT diagram 440EX 440LX AP-585 AP-589 243658 SCHEMATIC DIAGRAM OF intel 8086 243335 OA47
    Text: Intel Celeron Processor at 266 MHz Datasheet Product Features • ■ ■ ■ ■ ■ Available at 266 MHz core frequency Binary compatible with applications running on previous members of the Intel microprocessor line Dynamic execution micro architecture


    Original     		PDF 32-bit celeron B121 celeron MOTHERBOARD CIRCUIT diagram 440EX 440LX AP-585 AP-589 243658 SCHEMATIC DIAGRAM OF intel 8086 243335 OA47

    B14 diode

    Abstract: celeron B121 AP-585 440EX 440LX AP-589 243658 celeron MOTHERBOARD CIRCUIT diagram OA47 DIODE B36
    Text: Intel Celeron Processor at 266 MHz and 300 MHz Datasheet Product Features • ■ ■ ■ ■ Available at 266 MHz and 300 MHz core frequencies Binary compatible with applications running on previous members of the Intel microprocessor line Dynamic execution micro architecture


    Original     		PDF 32-bit B14 diode celeron B121 AP-585 440EX 440LX AP-589 243658 celeron MOTHERBOARD CIRCUIT diagram OA47 DIODE B36

    b78 motherboard sheet

    Abstract: 440EX 440LX AP-585 AP-589 243658 schematic diagram for ac line voltage monitor vrm pentium 4 OA47 Intel AP-586
    Text: Intel Celeron Processor at 266 MHz, 300 MHz, 300A MHz, and 333 MHz Datasheet Product Features • ■ ■ ■ ■ Available at 266 MHz and 300 MHz core frequencies without cache; 300 MHz and 333 MHz core frequencies with cache Binary compatible with applications


    Original     		PDF 32-bit b78 motherboard sheet 440EX 440LX AP-585 AP-589 243658 schematic diagram for ac line voltage monitor vrm pentium 4 OA47 Intel AP-586

    B92 62 diode

    Abstract: atom MOTHERBOARD schematic
    Text: Intel Celeron Processor at 266 MHz, 300 MHz, 300A MHz, and 333 MHz Datasheet Product Features ss Available at 266 M Hz and 300 MHz core frequencies without cache; 300 MHz and 333 M Hz core frequencies with cache ¡88 Binary compatible with applications


    OCR Scan     		PDF 32-bit B92 62 diode atom MOTHERBOARD schematic