DDR3 DIMM 240 pinout
Abstract: DDR3 slot 240 pinout DDR3 DIMM pinout DDR3 DIMM footprint DDR3 DIMM DDR3 impedance N4834A eye-fi "Touch DISPLAY" A13-B13
Text: DDR3 DIMM Probing For Use With the 16900 Series Logic Analyzer Data Sheet Features Agilent offers a wide range of probing • Quick, easy connection between the DIMM connector and Agilent logic analyzers with the interposer or midbus probe solution for DDR3 DIMM measurement. • Compatible with all 240-pin DDR3 SDRAM DIMMs
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240-pin
N4835A
5990-3577EN
DDR3 DIMM 240 pinout
DDR3 slot 240 pinout
DDR3 DIMM pinout
DDR3 DIMM footprint
DDR3 DIMM
DDR3 impedance
N4834A
eye-fi
"Touch DISPLAY"
A13-B13
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K4B2G0846
Abstract: No abstract text available
Text: Data Sheet Rev.1.3 17.09.2012 2048MB DDR3 – SDRAM SO-DIMM 204 Pin SO-DIMM Features: SGN02G64D2BD1SA-xxRT • 2GByte in FBGA Technology • RoHS compliant Options: Data Rate / Latency DDR3 1066 MT/s CL7 DDR3 1333 MT/s CL9 DDR3 1600 MT/s CL11
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2048MB
SGN02G64D2BD1SA-xxRT
CH-9552
SGN0xG64xxxxxxx-xxxx
2002/96/EC
2011/65/EU
K4B2G0846
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DDR3 DIMM
Abstract: 200Pos INNER CARTON LABEL
Text: 107-68838 Packaging Specification 29May09 Rev A DDR3 DIMM ASSY 1. PURPOSE 目的 Define the packaging specifiction and packaging method of DDR3 DIMM ASSY. 订定 DDR3 DIMM ASSY 产品之包装规格及包装方式。 2. APPLICABLE PRODUCT 适用范围 Product
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29May09
200POS.
335LX230WX26
335LX230WX28
335LX230et
QR-ME-030B
DDR3 DIMM
200Pos
INNER CARTON LABEL
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Untitled
Abstract: No abstract text available
Text: Data Sheet Rev.1.3 17.09.2012 2048MB DDR3 – SDRAM SO-DIMM 204 Pin SO-DIMM Features: SGN02G64D2BD1SA-xxRT • 2GByte in FBGA Technology • RoHS compliant Options: Data Rate / Latency DDR3 1066 MT/s CL7 DDR3 1333 MT/s CL9 DDR3 1600 MT/s CL11
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2048MB
SGN02G64D2BD1SA-xxRT
CH-9552
SGN0xG64xxxxxxx-xxxx
2002/96/EC
2011/65/EU
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Untitled
Abstract: No abstract text available
Text: Data Sheet Rev.1.2 23.03.2012 4096MB DDR3 – SDRAM SO-DIMM 204 Pin SO-DIMM Features: SGN04G64E1BD2SA-xxRT • 4GByte in FBGA Technology • RoHS compliant Options: Data Rate / Latency DDR3 1066 MT/s CL7 DDR3 1333 MT/s CL9 DDR3 1600 MT/s CL11
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4096MB
SGN04G64E1BD2SA-xxRT
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Untitled
Abstract: No abstract text available
Text: Data Sheet Rev.1.2 23.03.2012 4096MB DDR3 – SDRAM SO-DIMM 204 Pin SO-DIMM Features: SGN04G64E1BD2SA-xxRT • 4GByte in FBGA Technology • RoHS compliant Options: Data Rate / Latency DDR3 1066 MT/s CL7 DDR3 1333 MT/s CL9 DDR3 1600 MT/s CL11
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4096MB
SGN04G64E1BD2SA-xxRT
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Untitled
Abstract: No abstract text available
Text: Data Sheet Rev.1.2 23.03.2012 1024MB DDR3 – SDRAM SO-DIMM 204 Pin SO-DIMM Features: SGN01G64D2BG1SA-xxRT • 1GByte in FBGA Technology • RoHS compliant Options: Data Rate / Latency DDR3 1066 MT/s CL7 DDR3 1333 MT/s CL9 DDR3 1600 MT/s CL11
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1024MB
SGN01G64D2BG1SA-xxRT
204-pin
64-bit
CH-9552
SGN01G64D2BG1SA-xxxRT
2002/96/EC
2011/65/EU
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Untitled
Abstract: No abstract text available
Text: 240PIN DDR3 1333 Unbuffered DIMM JM1333KLN-8GK 8GB Kit With 256Mx8 CL9 Description Placement The JM1333KLN-8GK, a dual channel kit, consists of 2 pcs 4GB DDR3 SDRAM module. The 4GB module is a 512M x 64bits DDR3-1333 Unbuffered DIMM. The 4GB module consists of 16pcs 256Mx8 bits DDR3 SDRAMs in
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240PIN
JM1333KLN-8GK
256Mx8
JM1333KLN-8GK,
64bits
DDR3-1333
16pcs
240-pin
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H5TQ2G
Abstract: No abstract text available
Text: 240pin DDR3 SDRAM Registered DIMM DDR3 SDRAM Registered DIMM Based on 2Gb B-die HMT325R7BFR8C HMT351R7BFR8C HMT351R7BFR4C HMT31GR7BFR8C HMT31GR7BFR4C HMT42GR7BMR4C *Hynix Semiconductor reserves the right to change products or specifications without notice.
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240pin
HMT325R7BFR8C
HMT351R7BFR8C
HMT351R7BFR4C
HMT31GR7BFR8C
HMT31GR7BFR4C
HMT42GR7BMR4C
010mm
2Gx72
HMT42GR7BMR4C
H5TQ2G
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H5TQ2G83BFR
Abstract: No abstract text available
Text: 240pin DDR3 SDRAM Registered DIMM DDR3 SDRAM Registered DIMM Based on 2Gb B-die HMT325R7BFR8C HMT351R7BFR8C HMT351R7BFR4C HMT31GR7BFR8C HMT31GR7BFR4C HMT42GR7BMR4C *Hynix Semiconductor reserves the right to change products or specifications without notice.
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240pin
HMT325R7BFR8C
HMT351R7BFR8C
HMT351R7BFR4C
HMT31GR7BFR8C
HMT31GR7BFR4C
HMT42GR7BMR4C
work50
010mm
2Gx72
H5TQ2G83BFR
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Untitled
Abstract: No abstract text available
Text: 240PIN DDR3 1333 Registered DIMM 2GB With 128Mx8 CL9 TS256MKR72V3UL Description Placement The TS256MKR72V3UL is a 256M x 72bits DDR3-1333 VLP Registered DIMM. The TS256MKR72V3UL consists of 18pcs 128Mx8bits DDR3 SDRAMs in FBGA packages, 1 pcs register in 177 ball TFBGA package and
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240PIN
128Mx8
TS256MKR72V3UL
TS256MKR72V3UL
72bits
DDR3-1333
18pcs
128Mx8bits
240-pin
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H5TQ2G83
Abstract: H5TQ4G43 H5TQ2G HMT35 HMT351R7BFR4C H5TQ2G83BFR H5TQ4G HMT31GR HMT325R7BFR8C H5TQ2G43BFR
Text: 240pin DDR3 SDRAM Registered DIMM DDR3 SDRAM Registered DIMM Based on 2Gb B-die HMT325R7BFR8C HMT351R7BFR8C HMT351R7BFR4C HMT31GR7BFR8C HMT31GR7BFR4C HMT42GR7BMR4C *Hynix Semiconductor reserves the right to change products or specifications without notice.
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240pin
HMT325R7BFR8C
HMT351R7BFR8C
HMT351R7BFR4C
HMT31GR7BFR8C
HMT31GR7BFR4C
HMT42GR7BMR4C
2Gx72
HMT42GR7BMR4C
010mm
H5TQ2G83
H5TQ4G43
H5TQ2G
HMT35
H5TQ2G83BFR
H5TQ4G
HMT31GR
H5TQ2G43BFR
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DDR3 DIMM 240 pinout
Abstract: No abstract text available
Text: M2Y2G64CB8HC5N / M2Y2G64CB8HC9N 2GB: 256M x 64 Unbuffered DDR3 SDRAM DIMM 240pin Unbuffered DDR3 SDRAM MODULE Based on 128Mx8 DDR3 SDRAM C Die Features • Performance: Speed Sort DIMM Latency fCK Clock Frequency PC3-8500 PC3-10600 -BE -CG 7 9 533
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M2Y2G64CB8HC5N
M2Y2G64CB8HC9N
240pin
128Mx8
PC3-8500
PC3-10600
240-pin
256Mx64
533MHz
DDR3 DIMM 240 pinout
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Untitled
Abstract: No abstract text available
Text: 240PIN DDR3 1066 Registered DIMM TS1GKR72V1N 8GB With 256Mx8 CL7 Description Placement The TS1GKR72V1N is a 1G x 72bits DDR3-1066 Registered DIMM. The TS1GKR72V1N consists of 36pcs 256Mx8bits DDR3 SDRAM in FBGA package, 1 pcs register in 176 ball TFBGA package and a 2048 bits
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240PIN
TS1GKR72V1N
256Mx8
TS1GKR72V1N
72bits
DDR3-1066
36pcs
256Mx8bits
240-pin
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Untitled
Abstract: No abstract text available
Text: 240PIN DDR3 1333 Registered DIMM TS512MKR72V3N 4GB With 256Mx8 CL9 Description Placement The TS512MKR72V3N is a 512M x 72bits DDR3-1333 Registered DIMM. The TS512MKR72V3N consists of 18pcs 256Mx8bits DDR3 SDRAMs in FBGA packages, 1 pcs register in 177 ball TFBGA package and a 2048 bits
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240PIN
TS512MKR72V3N
256Mx8
TS512MKR72V3N
72bits
DDR3-1333
18pcs
256Mx8bits
240-pin
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Untitled
Abstract: No abstract text available
Text: 204PIN DDR3 1333 SO-DIMM 1024MB With 128Mx8 CL9 TS128MSK64V3U Description Placement The TS128MSK64V3U is a 128M x 64bits DDR3-1333 SO-DIMM. The TS128MSK64V3U consists of 8pcs 128Mx8bits DDR3 SDRAMs FBGA packages and a 2048 bits serial EEPROM on a 204-pin printed circuit board.
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204PIN
1024MB
128Mx8
TS128MSK64V3U
TS128MSK64V3U
64bits
DDR3-1333
128Mx8bits
204-pin
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Untitled
Abstract: No abstract text available
Text: preliminary Data Sheet Rev.0.9 15.11.2011 8192MB DDR3 – SDRAM SO-DIMM 204 Pin SO-DIMM Features: SGN08G64B3BB2SA-xxRT • 8GByte in FBGA Technology • RoHS compliant Options: Data Rate / Latency DDR3 1333 MT/s CL9 DDR3 1600 MT/s CL11
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8192MB
SGN08G64B3BB2SA-xxRT
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Untitled
Abstract: No abstract text available
Text: Data Sheet Rev.1.2 26.04.2011 2048MB DDR3 – SDRAM SO-DIMM 204 Pin SO-DIMM Features: SGN02G64E1BG2MT-xxRT • 2GByte in FBGA Technology • RoHS compliant Options: Data Rate / Latency DDR3 1066 MT/s CL7 DDR3 1333 MT/s CL9 module density
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2048MB
SGN02G64E1BG2MT-xxRT
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TS256MSK64V1N
Abstract: No abstract text available
Text: 204PIN DDR3 1066 SO-DIMM TS256MSK64V1N 2048MB With 256Mx8 CL7 Description Placement The TS256MSK64V1N is a 256M x 64bits DDR3-1066 SO-DIMM. The TS256MSK64V1N consists of 8pcs 256Mx8bits DDR3 SDRAMs FBGA packages and a 2048 bits serial EEPROM on a 204-pin printed circuit board.
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204PIN
TS256MSK64V1N
2048MB
256Mx8
TS256MSK64V1N
64bits
DDR3-1066
256Mx8bits
204-pin
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Untitled
Abstract: No abstract text available
Text: 240PIN DDR3 1333 Registered DIMM TS1GKR72V3Y 8GB With 512Mx4 CL9 Description Placement The TS1GKR72V3Y is a 1024M x 72bits DDR3-1333 Registered DIMM. The TS1GKR72V3Y consists of 36pcs 512Mx4bits DDR3 SDRAM in FBGA package, 1 pcs register in 176 ball TFBGA package and a 2048 bits
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240PIN
TS1GKR72V3Y
512Mx4
TS1GKR72V3Y
1024M
72bits
DDR3-1333
36pcs
512Mx4bits
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Untitled
Abstract: No abstract text available
Text: 240PIN DDR3 1333 Registered DIMM 2GB With 128Mx8 CL9 TS256MKR72V3U Description Placement The TS256MKR72V3U is a 256M x 72bits DDR3-1333 Registered DIMM. The TS256MKR72V3U consists of 18pcs 128Mx8bits DDR3 SDRAMs in FBGA packages, 1 pcs register in 177 ball TFBGA package and a 2048 bits
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240PIN
128Mx8
TS256MKR72V3U
TS256MKR72V3U
72bits
DDR3-1333
18pcs
128Mx8bits
240-pin
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Untitled
Abstract: No abstract text available
Text: 204PIN DDR3 1333 SO-DIMM 4096MB With 256Mx8 CL9 TS512MSK64V3N Description Placement The TS512MSK64V3N is a 512M x 64bits DDR3-1333 SO-DIMM. The TS512MSK64V3N consists of 16pcs 256Mx8bits DDR3 SDRAMs FBGA packages and a 2048 bits serial EEPROM on a 204-pin printed circuit board.
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204PIN
4096MB
256Mx8
TS512MSK64V3N
TS512MSK64V3N
64bits
DDR3-1333
16pcs
256Mx8bits
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Untitled
Abstract: No abstract text available
Text: 204PIN DDR3 1333 SO-DIMM TS256MSK64V3N 2048MB With 256Mx8 CL9 Description Placement The TS256MSK64V3N is a 256M x 64bits DDR3-1333 SO-DIMM. The TS256MSK64V3N consists of 8pcs 256Mx8bits DDR3 SDRAMs FBGA packages and a 2048 bits serial EEPROM on a 204-pin printed circuit board.
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204PIN
TS256MSK64V3N
2048MB
256Mx8
TS256MSK64V3N
64bits
DDR3-1333
256Mx8bits
204-pin
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GS-14-899
Abstract: MO-269 DDR3 memory DDR3 sodimm socket DDR3 rDIMM DDR3 pcb design GS-12-486 ddr3 dimm connector sc007
Text: BOARD-TO-BOARD CONNECTORS FCÎ, DDR3 MEMORY MODULE SOCKETS DESCRIPTION Memory module sockets from FCI are designed to accept most industry standard memory types DDR, DDR2, DDR3 and form factors such as DIMM, SO-DIMM or VLP DIMM. The sockets allow convenient memory
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OCR Scan
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240-posltlon
MO-269.
UL94V-0
GS-12-486
S0-009
MO-269
GS-14-899
MO-269
DDR3 memory
DDR3 sodimm socket
DDR3 rDIMM
DDR3 pcb design
ddr3 dimm connector
sc007
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