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    DIM10 Price and Stock

    Synapse Wireless DIM10-087-06-A

    WIRELESS LIGHTING MODULE DALI2 0
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    DigiKey DIM10-087-06-A Bulk 90 1
    • 1 $111.35
    • 10 $104.99
    • 100 $92.2635
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    Synapse Wireless DIM10-087-00

    SNAP DIM-10 007
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    Synapse Wireless DIM10-250-11

    WIRELESS LIGHTING CONTROL SWITCH
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    DigiKey DIM10-250-11 Box 2
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    • 10 $233.31
    • 100 $221.6444
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    Synapse Wireless DIM10-100-00

    120-277V WIRELESS CONTROLLER, 2A
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    DigiKey DIM10-100-00 Bulk 10
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    Texas Instruments TMDSDIM100CON5PK

    DIM100 CONNECTOR 5PK
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    DigiKey TMDSDIM100CON5PK Bulk 1
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    Perfect Parts Corporation TMDSDIM100CON5PK 43
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    DIM10 Datasheets (4)

    Part ECAD Model Manufacturer Description Curated Type PDF
    DIM10-087-00 Synapse Wireless RF/IF and RFID - RF Receiver, Transmitter, and Transceiver Finished Units - SNAP DIM-10 007 Original PDF
    DIM10-087-06-A Synapse Wireless WIRELESS LIGHTING MODULE DALI2 0 Original PDF
    DIM10-100-00 Synapse Wireless RF/IF and RFID - RF Receiver, Transmitter, and Transceiver Finished Units - 120-277V WIRELESS CONTROLLER, 2A Original PDF
    DIM10-250-11 Synapse Wireless RF/IF and RFID - RF Receiver, Transmitter, and Transceiver Finished Units - WIRELESS LIGHTING CONTROL SWITCH Original PDF

    DIM10 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: Quick Start Guide SPRUGP7 – June 2009 TMS320C28343 Experimenter’s Kit Overview The C28343 Experimenter’s Kit is a quick, easy, and low-cost way to evaluate the TMS320C2834x family of devices. It consists of a DIM100 docking station and a C28343 DIM100 controlCARD. The docking


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    PDF TMS320C28343 C28343 TMS320C2834x DIM100

    DIM100PHM33-F000

    Abstract: No abstract text available
    Text: DIM100PHM33-F000 DIM100PHM33-F000 Half Bridge IGBT Module DS5764-1.2 June 2008 LN26119 FEATURES • Soft Punch Through Silicon ■ 10µs Short Circuit Withstand ■ Isolated MMC Base with AlN Substrates ■ High Thermal Cycling Capability APPLICATIONS ■


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    PDF DIM100PHM33-F000 DS5764-1 LN26119 DIM100PHM33-F000

    DIM100PHM33-F000

    Abstract: DIM100PHM33-F 100a diode bridge DIM100PHM33
    Text: DIM100PHM33-F000 Half Bridge IGBT Module Replaces DS5764-1.2 DS5764-2 October 2011 LN28815 FEATURES KEY PARAMETERS • 10µs Short Circuit Withstand  High Thermal Cycling Capability  Soft Punch Through Silicon VCES VCE(sat) * (typ) IC (max) IC(PK)


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    PDF DIM100PHM33-F000 DS5764-1 DS5764-2 LN28815) DIM100PHM33-F000 DIM100PHM33-F 100a diode bridge DIM100PHM33

    DIM1000XSM33-TS001

    Abstract: No abstract text available
    Text: DIM1000XSM33-TS001 Single Switch IGBT Module DS6126-1 October 2013 LN31016 FEATURES KEY PARAMETERS • 10.2kV Isolation  10µs Short Circuit Withstand  High Thermal Cycling Capability VCES VCE(sat) * (typ) IC (max) IC(PK) (max)  High Current Density Enhanced DMOS SPT


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    PDF DIM1000XSM33-TS001 DS6126-1 LN31016) DIM1000XSM33-TS001

    Untitled

    Abstract: No abstract text available
    Text: DIM100CHS17-A000 DIM100CHS17-A000 Half Bridge IGBT Module PDS5709-1.5 January 2004 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Base Plate KEY PARAMETERS VCES typ VCE(sat) * (max) IC (max) IC(PK) 1700V 2.7V


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    PDF DIM100CHS17-A000 PDS5709-1 DIM100CHS17-A000

    Untitled

    Abstract: No abstract text available
    Text: DIM100CHS17-A000 DIM100CHS17-A000 Half Bridge IGBT Module Replaces February 2004 version, issue PDS5709-1.6 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Base Plate PDS5709-2.1 June 2004 KEY PARAMETERS VCES typ


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    PDF DIM100CHS17-A000 PDS5709-1 PDS5709-2 DIM100CHS17-A000

    Untitled

    Abstract: No abstract text available
    Text: DIM100CHS17-E000 DIM100CHS17-E000 Half Bridge IGBT Module PDS5728-1.0 February 2004 FEATURES • Trench Gate Field Stop Technology ■ Low Conduction Losses ■ Low Switching Losses ■ 10µs Short Circuit Withstand KEY PARAMETERS VCES typ VCE(sat) (max)


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    PDF DIM100CHS17-E000 PDS5728-1 DIM100CHS17-E000

    Untitled

    Abstract: No abstract text available
    Text: DIM100CHS17-A000 DIM100CHS17-A000 Half Bridge IGBT Module PDS5709-1.6 February 2004 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Base Plate KEY PARAMETERS VCES typ VCE(sat) * (max) IC (max) IC(PK) 1700V 2.7V


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    PDF DIM100CHS17-A000 PDS5709-1 DIM100CHS17-A000

    Untitled

    Abstract: No abstract text available
    Text: DIM1000ECM33-TL000 IGBT Chopper Module DS6105-1 June 2013 LN30633 FEATURES KEY PARAMETERS • Low VCE(sat) Device  10µs Short Circuit Withstand  High Thermal Cycling Capability VCES VCE(sat) * (typ) IC (max) IC(PK) (max)  High Current Density Enhanced DMOS SPT


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    PDF DIM1000ECM33-TL000 DS6105-1 LN30633)

    Untitled

    Abstract: No abstract text available
    Text: DIM1000NSM33-TL000 Single Switch IGBT Module DS6109-1 June 2013 LN30637 FEATURES KEY PARAMETERS • Low VCE(sat) Device  10µs Short Circuit Withstand  High Thermal Cycling Capability VCES VCE(sat) * (typ) IC (max) IC(PK) (max)  High Current Density Enhanced DMOS SPT


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    PDF DIM1000NSM33-TL000 DS6109-1 LN30637)

    Untitled

    Abstract: No abstract text available
    Text: DIM100CHS12-A000 DIM100CHS12-A000 Half Bridge IGBT Module Replace February 2004 version, issue DS5734-1.0 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Baseplate DS5734-2.1 June 2004 KEY PARAMETERS VCES typ


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    PDF DIM100CHS12-A000 DS5734-1 DS5734-2 DIM100CHS12-A000

    half bridge circuit diagram

    Abstract: No abstract text available
    Text: DIM100CHS12-H000 DIM100CHS12-H000 Fast Half Bridge IGBT Module Target Infomation DS5632-1.3 August 2003 FEATURES • Non Punch Through Silicon ■ 10µs Short Circuit Withstand ■ fsw for Applications > 20kHz ■ Isolated Copper Baseplate KEY PARAMETERS VCES


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    PDF DIM100CHS12-H000 DS5632-1 20kHz DIM100CHS12-H000 half bridge circuit diagram

    Untitled

    Abstract: No abstract text available
    Text: DIM100CHS12-E000 DIM100CHS12-E000 Half Bridge IGBT Module PDS5682-1.2 January 2004 FEATURES • Trench Gate Field Stop Technology ■ Low Conduction Losses ■ Low Switching Losses ■ 10µs Short Circuit Withstand KEY PARAMETERS VCES typ VCE(sat) (max)


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    PDF DIM100CHS12-E000 PDS5682-1 DIM100CHS12-E000

    DIM100WHS12-A000

    Abstract: dynex
    Text: DIM100WHS12-A000 DIM100WHS12-A000 Half Bridge IGBT Module Replaces February 2004 version, issue DS5735-1.0 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Baseplate DS5735-2.0 May 2004 KEY PARAMETERS VCES typ


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    PDF DIM100WHS12-A000 DS5735-1 DS5735-2 DIM100WHS12-A000 dynex

    Untitled

    Abstract: No abstract text available
    Text: DIM1000ECM33-TS000 IGBT Chopper Module DS6091-1 April 2013 LN30401 FEATURES KEY PARAMETERS • 10µs Short Circuit Withstand  High Thermal Cycling Capability  High Current Density Enhanced DMOS SPT VCES VCE(sat) * (typ) IC (max) IC(PK) (max)  Isolated AlSiC Base with AlN Substrates


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    PDF DIM1000ECM33-TS000 DS6091-1 LN30401) DIM1000ECM33-TS000

    bi-directional switches IGBT

    Abstract: DIM100PHM33-F000
    Text: DIM100PHM33-F000 DIM100PHM33-F000 Half Bridge IGBT Module PDS5764-1.1 April 2004 FEATURES • Soft Punch Through Silicon ■ 10µs Short Circuit Withstand ■ Isolated MMC Base with AlN Substrates ■ High Thermal Cycling Capability APPLICATIONS ■ High Reliability Inverters


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    PDF DIM100PHM33-F000 PDS5764-1 DIM100PHM33-F000 bi-directional switches IGBT

    87630-1001

    Abstract: DIM-100 DIMM100 TMDSDIM100CON5PK DIM100 DIMM-100 876-3010
    Text: DIM100 Connector 5 Pack - DIM100CON5PK - TI Tool Folder Samples & Purchase Cart | Contact Us | TI Worldwide: United States | my.TI Login All Searches Search by Keyword GO Search by Part Number TI Home > Semiconductors > Microcontrollers > DIM100 Connector 5 Pack


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    PDF DIM100 TMDSDIM100CON5PK TMDSDIM100CON5PK DIM100 TMDSDIM100CON5PK: 87630-1001 DIM-100 DIMM100 DIMM-100 876-3010

    DIM1000ECM33-TS000

    Abstract: DIM1000ECM33-TS
    Text: DIM1000ECM33-TS000 IGBT Chopper Module Replaces DS6091-2 DS6091-3 September 2014 LN31962 FEATURES KEY PARAMETERS • 10µs Short Circuit Withstand  High Thermal Cycling Capability  High Current Density Enhanced DMOS SPT VCES VCE(sat) * (typ) IC (max)


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    PDF DIM1000ECM33-TS000 DS6091-2 DS6091-3 LN31962) DIM1000ECM33-TS000 DIM1000ECM33-TS

    DIM100

    Abstract: C28346 ADS7865 SPRUG01 DIM-100 C2000 DIM168 C2834
    Text: Quick Start Guide SPRUG01 – March 2009 Delfino C28343 controlCARD ™ Overview The Delfino C28343 controlCARD is based on the standard DIM100 controlCARD form factor and is compatible with existing C2000 controlCARD based application development boards. It is based around


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    PDF SPRUG01 C28343 DIM100 C2000 179-pin TMS302C28343ZHH C28346 DIM168 ADS7865 SPRUG01 DIM-100 C2834

    Untitled

    Abstract: No abstract text available
    Text: DIM100WHS17-A000 DIM100WHS17-A000 Half Bridge IGBT Module PDS5715-1.0 Febuary 2004 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Base Plate KEY PARAMETERS VCES typ VCE(sat) * (max) IC (max) IC(PK) 1700V 2.7V


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    PDF DIM100WHS17-A000 PDS5715-1 DIM100WHS17-A000

    Untitled

    Abstract: No abstract text available
    Text: DIM100CHS12-A000 DIM100CHS12-A000 Half Bridge IGBT Module DS5734-1.0 Fbruary 2004 FEATURES • 10µs Short Circuit Withstand ■ Non Punch Through Silicon ■ Isolated Copper Baseplate KEY PARAMETERS VCES typ VCE(sat)* (max) IC (max) IC(PK) 1200V 2.2V 100A


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    PDF DIM100CHS12-A000 DS5734-1 DIM100CHS12-A000

    Untitled

    Abstract: No abstract text available
    Text: DIM100WHS12-E000 DIM100WHS12-E000 Half Bridge IGBT Module PDS5710-1.1 January 2004 FEATURES • Trench Gate Field Stop Technology ■ Low Conduction Losses ■ Low Switching Losses ■ 10µs Short Circuit Withstand KEY PARAMETERS VCES typ VCE(sat) (max)


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    PDF DIM100WHS12-E000 PDS5710-1 DIM100WHS12-E000

    Untitled

    Abstract: No abstract text available
    Text: DIM100


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    PDF DIM100

    copper heatsink

    Abstract: LM 949
    Text: DIM100WHS12-H000 DIM100WHS12-H000 Fast Half Bridge IGBT Module Target Infomation DS5650-1.0 August 2003 FEATURES • Non Punch Through Silicon ■ 10µs Short Circuit Withstand ■ fsw for Applications > 20kHz ■ Isolated Copper Baseplate APPLICATIONS ■


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    PDF DIM100WHS12-H000 DS5650-1 20kHz DIM100WHS12-H000 copper heatsink LM 949