lqfp 64 Shipping Trays
Abstract: DS310H
Text: LEADFRAME data sheet Multi-Chip & Stacked-Die Leadframe Packages Features: Multi-Chip Package MCP & Stacked-Die Leadframe Package Amkor's multi-chip package and stacked-die leadframe designs enable package level integration in a low cost, leadframe-based form factor. Leveraging
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3w high power white led driver circuit diagram
Abstract: LM3404 LM3404HV psop-8 CMSH2-60 LM3404HVMA LM3404HVMR SLF10145T-470M1R4
Text: National Semiconductor Application Note 1629 Chris Richardson May 2007 Introduction ible PSOP-8 package with an exposed thermal pad also called a die-attach paddle, or DAP will be compared to help the user estimate the die temperature under various conditions, and determine which package is best for their application.
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LM3404HV
AN-1629
3w high power white led driver circuit diagram
LM3404
psop-8
CMSH2-60
LM3404HVMA
LM3404HVMR
SLF10145T-470M1R4
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Multicore 96SC
Abstract: 96SC soldering temperature CR32 recommended reflow profile LPCC2x2 multicore solder paste CR32 JEDEC SMT reflow profile 629002 5988-7963EN multicore solder paste 2C
Text: The LPCC2x2 Package Application Note 1316 1. Introduction Avago’s LPCC2x2 package is a highly thermal efficient leadless package offering improved RF response over a wide operating frequency, DC - 6 GHz. The exposed die-attach paddle acts as a device grounding, heat
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5988-7963EN
Multicore 96SC
96SC soldering temperature
CR32 recommended reflow profile
LPCC2x2
multicore solder paste
CR32
JEDEC SMT reflow profile
629002
multicore solder paste 2C
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SA58670ABS
Abstract: SA58670A 741 IC data sheet IC 741 data sheet pdf of 741 ic portable dvd player schematic diagram of video 8 channel audio amplifier circuit diagram 1 W stereo amplifier class d power amplifier data sheet IC 741
Text: SA58670A 2.1 W/channel stereo class-D audio amplifier Rev. 02 — 23 October 2008 Product data sheet 1. General description The SA58670A is a stereo, filter-free class-D audio amplifier which is available in an HVQFN20 package with the exposed Die Attach Paddle DAP .
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SA58670A
SA58670A
HVQFN20
SA58670ABS
741 IC data sheet
IC 741 data sheet
pdf of 741 ic
portable dvd player schematic diagram of video
8 channel audio amplifier circuit diagram
1 W stereo amplifier
class d power amplifier
data sheet IC 741
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Untitled
Abstract: No abstract text available
Text: SA58670 2.1 W/channel stereo class-D audio amplifier Rev. 03 — 11 June 2009 Product data sheet 1. General description The SA58670 is a stereo, filter-free class-D audio amplifier which is available in an HVQFN20 package with the exposed Die Attach Paddle DAP .
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SA58670
SA58670
HVQFN20
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Untitled
Abstract: No abstract text available
Text: SA58670A 2.1 W/channel stereo class-D audio amplifier Rev. 02 — 23 October 2008 Product data sheet 1. General description The SA58670A is a stereo, filter-free class-D audio amplifier which is available in an HVQFN20 package with the exposed Die Attach Paddle DAP .
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SA58670A
SA58670A
HVQFN20
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jedec package MO-247
Abstract: qfn 88 stencil QN180 IEC-68-2-32 QFN PCB Layout guide QN108 Amkor TSCSP qfn 32 land pattern IPC-TM-650 2.6.9 QN180 outline
Text: Application Note AC322 Assembly and PCB Layout Guidelines for QFN Packages Introduction The dual-row or multi-row QFN package is a near Chip Scale, plastic-encapsulated package with a copper leadframe substrate. The exposed die attach paddle on the bottom efficiently conducts heat to the PCB
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AC322
jedec package MO-247
qfn 88 stencil
QN180
IEC-68-2-32
QFN PCB Layout guide
QN108
Amkor TSCSP
qfn 32 land pattern
IPC-TM-650 2.6.9
QN180 outline
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Untitled
Abstract: No abstract text available
Text: SA58670 2.1 W/channel stereo class-D audio amplifier Rev. 02 — 23 October 2008 Product data sheet 1. General description The SA58670 is a stereo, filter-free class-D audio amplifier which is available in an HVQFN20 package with the exposed Die Attach Paddle DAP .
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SA58670
SA58670
HVQFN20
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SA58670
Abstract: SA58670BS portable dvd player schematic diagram of video HVQFN20 MO-220
Text: SA58670 2.1 W/channel stereo class-D audio amplifier Rev. 03 — 11 June 2009 Product data sheet 1. General description The SA58670 is a stereo, filter-free class-D audio amplifier which is available in an HVQFN20 package with the exposed Die Attach Paddle DAP .
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SA58670
SA58670
HVQFN20
SA58670BS
portable dvd player schematic diagram of video
MO-220
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741 IC data sheet
Abstract: portable dvd player schematic diagram of video class-d amplifier IC 741 data sheet pin diagram of ic 741 AUX0025 HVQFN20 MO-220 SA58670ABS AP-585
Text: SA58670A 2.1 W/channel stereo class-D audio amplifier Rev. 01 — 20 February 2008 Product data sheet 1. General description The SA58670A is a stereo, filter-free class-D audio amplifier which is available in an HVQFN20 package with the exposed Die Attach Paddle DAP .
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SA58670A
SA58670A
HVQFN20
741 IC data sheet
portable dvd player schematic diagram of video
class-d amplifier
IC 741 data sheet
pin diagram of ic 741
AUX0025
MO-220
SA58670ABS
AP-585
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portable dvd player
Abstract: portable dvd player schematic diagram of video HVQFN20 MO-220 SA58670 SA58670BS portable dvd player schematic diagram
Text: SA58670 2.1 W/channel stereo class-D audio amplifier Rev. 01 — 4 January 2008 Product data sheet 1. General description The SA58670 is a stereo, filter-free class-D audio amplifier which is available in an HVQFN20 package with the exposed Die Attach Paddle DAP .
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SA58670
SA58670
HVQFN20
portable dvd player
portable dvd player schematic diagram of video
MO-220
SA58670BS
portable dvd player schematic diagram
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HVQFN20
Abstract: MO-220 SA58670 SA58670BS sot917 portable dvd player power supply
Text: SA58670 2.1 W/channel stereo Class D audio amplifier Rev. 01 — 22 June 2007 Objective data sheet 1. General description The SA58670 is a stereo, filter-free Class D audio amplifier which is available in an HVQFN20 package with the exposed Die Attach Paddle DAP .
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SA58670
SA58670
HVQFN20
MO-220
SA58670BS
sot917
portable dvd player power supply
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30392
Abstract: ALM-1106 stencil Layout JEDEC SMT reflow profile stencil
Text: ALM-1106 MCOB Package Packge Application Note 5282 Introduction PCB Land Pattern and Stencil Design Avago Technologies’s ALM-1106 MCOB 2.0x2.0x1.1mm is an economical , easy to use GaAs MMIC GPS Low Noise Amplifier LNA with bypass and Shutdown mode. The exposed die-attach paddle acts as device grounding,
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ALM-1106
ALM-1106
AV01-0246EN
30392
stencil Layout
JEDEC SMT reflow profile
stencil
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Class-AB
Abstract: Class AB SOT909-1 SA58631 SA58631TK HVSON8
Text: NXP 3-W Class AB, BTL audio amplifier SA58631 Audio amplifier for portable applications This single-channel audio amplifier provides a power output of 3 W with an 8-Ω load using a 9-V supply. Housed in an HVSON8 package with an exposed die-attach paddle, it delivers
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SA58631
Class-AB
Class AB
SOT909-1
SA58631
SA58631TK
HVSON8
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A3P1000
Abstract: 160 e7 Datasheet A3P125 FBGA A3P250 A3P030 FBGA A3P600
Text: ProASIC3 Packaging 3 – Package Pin Assignments 48-Pin QFN Pin 1 48 1 Notes: 1. This is the bottom view of the package. 2. The die attach paddle center of the package is tied to ground GND . Note For Package Manufacturing and Environmental information, visit the Resource Center at
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48-Pin
A3P030
IO82RSB1
IO24RSB0
GEC0/IO73RSB1
IO22RSB0
GEA0/IO72RSB1
A3P1000
160 e7
Datasheet A3P125
FBGA A3P250
FBGA A3P600
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A3P060
Abstract: A3P125 A3P400 A3P030 FBGA A3P600 A3P1000
Text: ProASIC3 Packaging 3 – Package Pin Assignments 48-Pin QFN Pin 1 48 1 Notes: 1. This is the bottom view of the package. 2. The die attach paddle center of the package is tied to ground GND . Note For Package Manufacturing and Environmental information, visit the Resource Center at
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48-Pin
A3P030
IO82RSB1
IO24RSB0
GEC0/IO73RSB1
IO22RSB0
GEA0/IO72RSB1
A3P060
A3P125
A3P400
FBGA A3P600
A3P1000
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actel vqfp
Abstract: IO87RSB1
Text: ProASIC3 nano Packaging 3 – Package Pin Assignments 48-Pin QFN Pin 1 48 1 Notes: 1. This is the bottom view of the package. 2. The die attach paddle of the package is tied to ground GND . Note For Package Manufacturing and Environmental information, visit the Resource Center at
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48-Pin
A3PN010
GEC0/IO37RSB1
IO06RSB0
IO36RSB1
GDA0/IO05RSB0
GEA0/IO34RSB1
actel vqfp
IO87RSB1
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G43-87
Abstract: AN9207 G42-88
Text: Temperature Considerations Application Note January 1994 AN9207 Junction Temperature Once the designer has selected an IC and calculated the clock frequency that meets the needs of the application, the operating temperature of the die junction temperature must
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AN9207
G43-87
AN9207
G42-88
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land pattern for DFN
Abstract: "exposed pad" PCB via QFN PACKAGE Junction to PCB thermal resistance "thermal via" qfn44 QFN PACKAGE thermal resistance AN-121 QFN footprint DFN PACKAGE thermal resistance QFN44-24
Text: AN-121 Application Note Mounting Considerations for Exposed-Paddle Packages Introduction Many of AnalogicTech's products incorporate exposed paddles in their packages. The exposed paddle or exposed pad packages operationally decrease the thermal resistance, thereby providing superior heat dissipation from the die. The packages fall into two main categories: quad LLP leadless lead frame package QFN
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AN-121
AN-121
land pattern for DFN
"exposed pad" PCB via
QFN PACKAGE Junction to PCB thermal resistance
"thermal via"
qfn44
QFN PACKAGE thermal resistance
QFN footprint
DFN PACKAGE thermal resistance
QFN44-24
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QFN-6x6 0.5mm
Abstract: QFN-6x6 48 qfn 6x6 foot print qfn 44 PACKAGE footprint qfn stencil AN3111
Text: AN3111 Rev 3, 07/2008 Freescale Semiconductor Application Note Soldering the QFN Stacked Die Sensors to a PC Board by: Dave Mahadevan, Russell Shumway, Thomas Koschmieder, Cheol Han, Kimberly Tuck, John Dixon Sensor and Actuator Solutions Division Tempe, Arizona
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AN3111
QFN-6x6 0.5mm
QFN-6x6 48
qfn 6x6 foot print
qfn 44 PACKAGE footprint
qfn stencil
AN3111
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mark AT0
Abstract: 676-Pin B27 QFN ACTEL FBGA 144 R13NC IO30PDB1V1 IO06PDB0V1 IO10PDB0V1 AFS090
Text: Actel Fusion Mixed-Signal FPGAs 4 – Package Pin Assignments 108-Pin QFN A44 A56 B41 B52 Pin A1 Mark A1 A43 B40 B1 B13 A14 B27 A29 B26 B14 A28 A15 Note: The die attach paddle center of the package is tied to ground GND . Note For Package Manufacturing and Environmental information, visit the Resource Center at
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108-Pin
AFS090
GCB1/IO35PDB1V0
GAA2/IO52PDB3V0
mark AT0
676-Pin
B27 QFN
ACTEL FBGA 144
R13NC
IO30PDB1V1
IO06PDB0V1
IO10PDB0V1
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IO01
Abstract: mark AT0 IO30PDB1V1 IO06PDB0V1 IO10PDB0V1
Text: Actel Fusion Mixed-Signal FPGAs 4 – Package Pin Assignments 108-Pin QFN A44 A56 B41 B52 Pin A1 Mark A1 A43 B40 B1 B13 A14 B27 A29 B26 B14 A28 A15 Note: The die attach paddle center of the package is tied to ground GND . Note For Package Manufacturing and Environmental information, visit the Resource Center at
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108-Pin
AFS090
GCB1/IO35PDB1V0
GAA2/IO52PDevice
IO01
mark AT0
IO30PDB1V1
IO06PDB0V1
IO10PDB0V1
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IR 423f
Abstract: 30392 stencil Layout AV01-0210EN stencil MGA-635T6 JEDEC SMT reflow profile solder powder a/IR 423f
Text: MGA-635T6 UTSLP Package Application Note 5278 Introduction PCB Land Pattern and Stencil Design Avago Technologies's MGA-635T6 UTSLP 2x1.3x0.4 is an economical ,easy to use GaAs MMIC GPS Low Noise Amplifier LNA with bypass and Shutdown mode. The exposed die-attach
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MGA-635T6
AV01-0210EN
IR 423f
30392
stencil Layout
stencil
JEDEC SMT reflow profile
solder powder
a/IR 423f
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aws duplexer
Abstract: 12M05019A73 019 triquint TQP4M3019 laser diode marking code
Text: TQP4M3019 Data Sheet SP3T High Power 2.6V 2x2 mm CDMA Antenna Switch Functional Block Diagram Features • • • • • • • • • • Product Description pHEMT GaAs MMIC Die Excellent Cross-Modulation Performance 108 dBm Typ @Cellular 106 dBm @AWS
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TQP4M3019
TQP4M3019
aws duplexer
12M05019A73
019 triquint
laser diode marking code
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