2N4416A
Abstract: CMPF4416A CP210
Text: PROCESS CP210 Central Small Signal Transistors TM Semiconductor Corp. N - Channel Silicon Amplifer J FET Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 15 x 15 MILS Die Thickness 8.0 MILS Drain Bonding Pad Area 3.2 X 4.0 MILS Source Bonding Pad Area
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CP210
2N4416A
CMPF4416A
100mV
2N4416A
CMPF4416A
CP210
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2N4393
Abstract: 2N4393 DIE CHIP cp206 GEOMETRY 2N4391 2N4391 ADAM transistor 2n4391 2N4392 CMPF4391 CMPF4392
Text: CP206 PROCESS Central Small Signal Transistors TM Semiconductor Corp. N - Channel Switch/Chopper J FET Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 21 x 18 MILS Die Thickness 8.0 MILS Drain Bonding Pad Area 3.8 X 3.8 MILS Source Bonding Pad Area
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CP206
2N4391
2N4392
2N4393
CMPF4391
CMPF4392
CMPF4393
Semicondu000Å
2N4393
2N4393 DIE CHIP
cp206
GEOMETRY 2N4391
2N4391
ADAM
transistor 2n4391
2N4392
CMPF4391
CMPF4392
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BL51
Abstract: G100 P89C660 P89C668
Text: phyCORE-P89C668 QuickStart Instructions Using PHYTEC FlashToolsOCF for on-chip Flash and the µVision2 Software Evaluation Development Tool Chain Note: The PHYTEC Spectrum CD includes the electronic version of the phyCORE-P89C66x English Hardware Manual Hinweis: Die PHYTEC Spectrum CD beinhaltet die elektronische
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phyCORE-P89C668
phyCORE-P89C66x
phyCORE-P89C668
L-562e
D-55135
BL51
G100
P89C660
P89C668
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HV70
Abstract: HV7022-C HV7022DJ-C HV7022PJ-C HV7022X-C M0-112 RBHV7022DJ-C A03160
Text: HV7022-C 34-Channel Symmetric Row Driver Ordering Information Package Options Device 44 J-Lead Quad Ceramic Chip Carrier 44 J-Lead Quad Plastic Chip Carrier Die in waffle pack 44 J-Lead Quad Ceramic Chip Carrier MIL-Std-883 Processed* HV7022DJ-C HV7022PJ-C
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HV7022-C
34-Channel
MIL-Std-883
HV7022DJ-C
HV7022PJ-C
HV7022X-C
RBHV7022DJ-C
HV7022-C
MS-018,
HV70
HV7022DJ-C
HV7022PJ-C
HV7022X-C
M0-112
RBHV7022DJ-C
A03160
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push-pull converter 230V input
Abstract: HV70 HV7022-C HV7022DJ-C HV7022PJ-C HV7022X-C RBHV7022DJ-C
Text: HV7022-C 34-Channel Symmetric Row Driver Ordering Information Package Options Device 44 J-Lead Quad Ceramic Chip Carrier 44 J-Lead Quad Plastic Chip Carrier Die in waffle pack 44 J-Lead Quad Ceramic Chip Carrier MIL-Std-883 Processed* HV7022DJ-C HV7022PJ-C
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HV7022-C
34-Channel
MIL-Std-883
HV7022DJ-C
HV7022PJ-C
HV7022X-C
RBHV7022DJ-C
HV7022-C
44-pin
push-pull converter 230V input
HV70
HV7022DJ-C
HV7022PJ-C
HV7022X-C
RBHV7022DJ-C
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230v to 12v dc circuit diagrams
Abstract: 12v dc to 230v ac CIRCUITS CONVERTER HV70 HV7022-C HV7022DJ-C HV7022PJ-C HV7022X-C RBHV7022DJ-C
Text: HV7022-C HV7022-C 34-Channel Symmetric Row Driver Ordering Information Package Options Device 44 J-Lead Quad Ceramic Chip Carrier 44 J-Lead Quad Plastic Chip Carrier Die in waffle pack 44 J-Lead Quad Ceramic Chip Carrier MIL-Std-883 Processed* HV7022DJ-C
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HV7022-C
34-Channel
MIL-Std-883
HV7022DJ-C
HV7022PJ-C
HV7022X-C
RBHV7022DJ-C
HV7022-C
230v to 12v dc circuit diagrams
12v dc to 230v ac CIRCUITS CONVERTER
HV70
HV7022DJ-C
HV7022PJ-C
HV7022X-C
RBHV7022DJ-C
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HV70
Abstract: HV7022-C HV7022DJ-C HV7022PJ-C HV7022X-C RBHV7022DJ-C 12v dc to 230v ac CIRCUITS CONVERTER 230v AC to 30V dC converter circuit diagram
Text: HV7022-C 34-Channel Symmetric Row Driver Ordering Information Package Options Device 44 J-Lead Quad Ceramic Chip Carrier 44 J-Lead Quad Plastic Chip Carrier Die in waffle pack 44 J-Lead Quad Ceramic Chip Carrier MIL-Std-883 Processed* HV7022DJ-C HV7022PJ-C
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HV7022-C
34-Channel
MIL-Std-883
HV7022DJ-C
HV7022PJ-C
HV7022X-C
RBHV7022DJ-C
HV7022-C
44-pin
HV70
HV7022DJ-C
HV7022PJ-C
HV7022X-C
RBHV7022DJ-C
12v dc to 230v ac CIRCUITS CONVERTER
230v AC to 30V dC converter circuit diagram
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AN3016
Abstract: MAAMGM0002 MAAMGM0002-DIE MAAMGM0002-DIE-SMB MAAMGM0002-SMB MAAMGM-0002
Text: RoHS Compliant Amplifier, Distributed, 0.1W 1.0-18.0 GHz MAAMGM0002-DIE Rev E Features ♦ ♦ ♦ ♦ 0.1 Watt Saturated Output Power Level 4 dB Typical Noise Figure Select-at-Test Biasing MSAG Process Description The MAAMGM0002-Die is a 0.1W Distributed Amplifier with on-chip
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MAAMGM0002-DIE
MAAMGM0002-Die
AN3016
MAAMGM0002
MAAMGM0002-DIE-SMB
MAAMGM0002-SMB
MAAMGM-0002
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AN3019
Abstract: MAAP-000078-PKG001 MAAP-000078-SMB001 MAAP-000078-SMB004 MAAPGM0078-DIE AN3016
Text: Amplifier, Power, 12W 2.0-6.0 GHz MAAPGM0078-DIE Rev B Preliminary Datasheet Features ♦ 12 Watt Saturated Output Power Level ♦ Variable Drain Voltage 8-10V Operation ♦ MSAG Process Description The MAAPGM0078-DIE is a 2-stage 12W power amplifier with on-chip bias
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MAAPGM0078-DIE
MAAPGM0078-DIE
AN3019
MAAP-000078-PKG001
MAAP-000078-SMB001
MAAP-000078-SMB004
AN3016
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MAAP-000070-PKG003
Abstract: AN3016 MAAP-000070-MCH000 MAAP-000070-SMB003
Text: Amplifier, Power, 1.9W 10.0-13.25 GHz MAAPGM0070-DIE Rev B Preliminary Datasheet Features ♦ 1.9 Watt Saturated Output Power Level ♦ Variable Drain Voltage 4-10V Operation ♦ MSAG Process Description The MAAPGM0070-DIE is a 4-stage 1.9 W power amplifier with on-chip
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MAAPGM0070-DIE
MAAPGM0070-DIE
MAAP-000070-PKG003
AN3016
MAAP-000070-MCH000
MAAP-000070-SMB003
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MAAPGM0066-DIE
Abstract: MAAP-000066-PKG003
Text: Amplifier, Power, 2 W 2.5-6.0 GHz MAAPGM0066-DIE Rev B Preliminary Datasheet Features ♦ 2.5 Watt Saturated Output Power Level ♦ Variable Drain Voltage 4-10V Operation ♦ MSAG Process Description The MAAPGM0066-DIE is a 3-stage 2 W power amplifier with on-chip
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MAAPGM0066-DIE
MAAPGM0066-DIE
MAAP-000066-PKG003
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MAAPGM0066-DIE
Abstract: MAAP-000066-PKG003
Text: Amplifier, Power, 2 W 2.5-6.0 GHz MAAPGM0066-DIE Rev C Preliminary Datasheet Features ♦ 2.5 Watt Saturated Output Power Level ♦ Variable Drain Voltage 4-10V Operation ♦ MSAG Process Description The MAAPGM0066-DIE is a 3-stage 2 W power amplifier with on-chip
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MAAPGM0066-DIE
MAAPGM0066-DIE
MAAP-000066-PKG003
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AN3016
Abstract: MAAP-000072-PKG003 MAAP-000072-SMB003
Text: Amplifier, Power, 1 W 17.7-19.7 GHz MAAPGM0072-DIE Rev B Preliminary Datasheet Features ♦ 1 Watt Saturated Output Power Level ♦ Variable Drain Voltage 4-10V Operation ♦ MSAG Process Description The MAAPGM0072-DIE is a 4-stage 1 W power amplifier with on-chip
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MAAPGM0072-DIE
MAAPGM0072-DIE
AN3016
MAAP-000072-PKG003
MAAP-000072-SMB003
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MAAPGM0073-DIE
Abstract: No abstract text available
Text: Amplifier, Power, 1.2W 4.0-8.5 GHz MAAPGM0073-DIE 903275 A Preliminary Datasheet Features ♦ 1.2 Watt Saturated Output Power Level ♦ Variable Drain Voltage 6-10V Operation ♦ MSAG Process Description The MAAPGM0073-DIE is a 3-stage 1.2 W power amplifier with on-chip
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MAAPGM0073-DIE
MAAPGM0073-DIE
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74hc4000
Abstract: STK089 MAX354 MAX355 MAX383 MAX4530 MAX4555 MAX4614 74CD40 reed relais PHILIPS
Text: MUX & SWITCH Datenblätter • e nftig Zukü ukte d o r P ANALOG DESIGN GUIDE Kostenlose Muster Anwendungsbeispiele • 1 e sgab u A . 14 Weltweit erster Analogschalter im Ultra-Chip-Scale-Gehäuse Die Bausteine MAX4684–MAX46881 sind die leistungsfähigsten und kleinsten Analogschalter auf
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MAX4684
MAX46881)
MAX46861
/MAX46871
/MAX46881)
74hc4000
STK089
MAX354
MAX355
MAX383
MAX4530
MAX4555
MAX4614
74CD40
reed relais PHILIPS
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MAAPGM0066-DIE
Abstract: AN3016 DM4030LD DM6030HK RG-90
Text: MAAPGM0066-DIE Amplifier, Power, 2W 2.5—6.0 GHz M/A-COM Products Rev D Features ♦ 2 Watt Saturated Output Power Level ♦ Variable Drain Voltage 6-10V Operation ♦ No air bridges Description The MAAPGM0066-DIE is a 3-stage 2 W power amplifier with on-chip
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MAAPGM0066-DIE
MAAPGM0066-DIE
AN3016
DM4030LD
DM6030HK
RG-90
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7416a
Abstract: chip bonding die DIE BONDER
Text: HSXAWAVS Power FET Chip Handling Instruction Hexawave, Inc. Die Bonding Procedure Equipments and Tools 1. Die Bonder 2. Tweezers Type SS 3. Thermometer Procedure I. Perform all steps in a forcing N2gas environment. 2 Control the heated stage temperature within 310
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M45A-HW-1513-S-F
27NC/30NC:
26YC/26NC/34NC:
7416a
chip bonding die
DIE BONDER
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ha 11122
Abstract: No abstract text available
Text: HV70 inc. 34-Channel Symmetric Row Driver Ordering Information_ Package Options Device 44 J-Lead Quad Ceramic Chip Carrier 44 J-Lead Quad Plastic Chip Carrier Die in waffle pack 44 J-Lead Quad Ceramic Chip Carrier MIL-Std-883 Processed*
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34-Channel
HV7022DJ
HV7022PJ
HV7022X
MIL-Std-883
RBHV7022DJ
HV7022
44-lead
l39ll3Sll37lf36ll3
HVour29/6
ha 11122
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Untitled
Abstract: No abstract text available
Text: HV70 LJàSupertex me. 34-Channel Symmetric Row Driver Ordering Information_ Package Options Device 44 J-Lead Quad Plastic Chip Carrier 44 J-Lead Quad Ceramic Chip Carrier Die in waffle pack 44 J-Lead Quad Ceramic Chip Carrier MIL-STD-883 Processed*
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34-Channel
MIL-STD-883
HV7022
HV7022DJ
HV7022PJ
HV7022X
RBHV7022DJ
44-pin
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chips F8680
Abstract: F8680A crt terminal interfacing in 8086 F8680 support chips of 8086 TL08 015 s79 SPDT switch MR25 resistor 22 NEB 063 T32 Chips and Technologies
Text: Product Overview • F8680A PC/CHIP F8680A PC/CHIP Product Overview A mie single-chip PC, the F8680A PC/CHIP™ features die SuperState R management system, low power consumption, high performance, direct support of PCMCIA 2.0 memory and I/O cards, and flexible memory support
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F8680A
theF8680A
160-Pin
chips F8680
crt terminal interfacing in 8086
F8680
support chips of 8086
TL08 015
s79 SPDT switch
MR25 resistor
22 NEB 063 T32
Chips and Technologies
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FET 2N5434
Abstract: 2N5432 2N5434 E-41
Text: ^ /o u t r a CHIP NUMBER CONTACT METALLIZATION Top Contact: > 12,000 A Aluminum Backside Contact: 3,000 A Gold ASSEMBLY RECOMMENDATIONS .030" 0.762mm It is advisable that: a) the die be eutectically mounted with gold silicon preform 98/2%. Die Sis«: 30 x 32
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762mm)
0254mm)
FET 2N5434
2N5432
2N5434
E-41
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Untitled
Abstract: No abstract text available
Text: Supertexinc. HV7022-C 34-Channel Symmetric Row Driver Ordering Information Package Options Device 44 J-Lead Quad Ceramic Chip Carrier 44 J-Lead Quad Plastic Chip Carrier Die in waffle pack 44 J-Lead Quad Ceramic Chip Carrier MIL-Std-883 Processed* HV7022-C
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HV7022-C
34-Channel
MIL-Std-883
HV7022DJ-C
HV7022PJ-C
HV7022X-C
RBHV7022DJ-C
HV7022-C
HVOUT1/34
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Untitled
Abstract: No abstract text available
Text: HV7022-C 34-Channel Symmetric Row Driver Ordering Information Package Options Device 44 J-Lead Quad Ceramic Chip Carrier 44 J-Lead Quad Plastic Chip Carrier Die in waffle pack 44 J-Lead Quad Ceramic Chip Carrier MIL-Std-883 Processed* HV7022-C HV7022DJ-C
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HV7022-C
34-Channel
MIL-Std-883
HV7022-C
HV7022DJ-C
HV7022PJ-C
HV7022X-C
RBHV7022DJ-C
44-lead
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2N2609
Abstract: 2n2844 9TSS
Text: P -C H A N N E L J U N C T IO N FET CHIP NUMBER [Ft? CONTACT METALLIZATION Top Contact: > 12,000 A Aluminum . 020 " 0.508mm} Backside Contact: 3,000 A Gold ASSEMBLY RECOMMENDATIONS V It is advisable that: Die Size: Pad Sim: a the die be eutectically mounted with gold silicon preform 98/2%.
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508mm}
381mm)
0-S08
0254mm)
2N2609
2n2844
9TSS
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