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    Untitled

    Abstract: No abstract text available
    Text: Reflow soldering footprint Footprint information for reflow soldering of DFN2520-9 package SOT1333-1 D1 9x C (8x) Ay solder land occupied area P1 DIMENSIONS in mm P1 Ay C D1 0.50 2.30 1.07 0.30 www.nxp.com Dimensions in mm 2010 NXP B.V. 13-05-08 13-05-21


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    PDF DFN2520-9 OT1333-1 sot1333-1

    Untitled

    Abstract: No abstract text available
    Text: Package outline DFN2520-9: plastic extremely thin small outline package; no leads; 9 terminals; body 2 x 2.5 x 0.5 mm SOT1333-1 X D B A A E A1 c detail X terminal 1 index area e1 terminal 1 index area 1 e C b 3 C A B C v w 5 y1 C y L k 9 6 1 2 Dimensions mm are the original dimensions


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    PDF DFN2520-9: OT1333-1 MO-252 sot1333-1

    NX3008NBKMB

    Abstract: IP4303CX4 PCMF2DFN1
    Text: Safeguard sensitive ICs - Increase battery life - Save space With NXP key products as recommended in this brochure Interface / Function Description Product type Package NFC antenna protection 18 / 24 V Birectional low capacitance ESD protection diode PESD18VF1BL


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    PDF PESD18VF1BL PESD24VF1BL PESD18VF1BSF PESD24VF1BSF DFN1006 DSN0603 DFN2520 DFN4020 NX3008NBKMB IP4303CX4 PCMF2DFN1

    circuit diagram wireless spy camera

    Abstract: PDTB123Y IP4303CX4 dual cc BAW62 3267 tsop6 PCMF2DFN1 BST60 PUMD4 PDTB123E PDTA143
    Text: Discrete Semiconductors Selection Guide 2014 Protection and signal conditioning devices, diodes, bipolar transistors, MOSFETs and thyristors. NXP’s next generation of packaging DFN Discrete Flat No-lead packages – high performance on smallest footprint


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    PDF DFN1006D-2 OD882D) DFN1010D-3 OT1215) DFN2020MD-6 OT1220) DFN1608D-2 OD1608) DSN0603 OD962) circuit diagram wireless spy camera PDTB123Y IP4303CX4 dual cc BAW62 3267 tsop6 PCMF2DFN1 BST60 PUMD4 PDTB123E PDTA143

    BZA456A

    Abstract: PCMF2DFN1
    Text: Application guide: ESD protection For automotive and industrial applications: car infotainment, body control modules, video cameras, industrial computers and test&measurement equipment Introduction NXP – your partner for ESD protection ESD protection has been a topic of concern for electronic system design for


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    Untitled

    Abstract: No abstract text available
    Text: Our broad package range provides maximum flexibility Very small 2 Pins Ultra small DSN0603-2 3 Pins SOT883B (SOT883) 4/5 Pins 1.0 x 0.6 x 0.37 (SOT1215) (SOT1194) Medium power SOD323F SOD323 SOD123F SOD123W SOD128 1.7 x 1.25 x 0.7 1.7 x 1.25 x 0.95 2.6 x 1.6 x 1.1


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    PDF DSN0603-2 OT883B) OT883) OT1215) OD323F OD323 OD123F OD123W OD128 OT663

    NX3008NBKMB

    Abstract: PCMF2DFN1
    Text: 使用本手册推荐的恩智浦主要产品 保护敏感的IC – 延长电池寿命 – 节省空间 接口/功能 说明 产品型号 封装 NFC天线保护 18/24 V双向低电容 ESD保护二极管 PESD18VF1BL PESD24VF1BL PESD18VF1BSF PESD24VF1BSF DFN1006


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    PDF PESD18VF1BL PESD24VF1BL PESD18VF1BSF PESD24VF1BSF DFN1006 DSN0603 DFN2520 DFN4020 NX3008NBKMB PCMF2DFN1

    DFN4020-14

    Abstract: PCMF2DFN1
    Text: PCMF2DFN1; PCMF3DFN1 Common-mode EMI filter for differential channels with integrated ESD protection Rev. 2 — 28 April 2014 Product data sheet 1. Product profile 1.1 General description The devices are common-mode ElectroMagnetic Interference EMI filters with integrated


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