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Abstract: No abstract text available
Text: Reflow soldering footprint Footprint information for reflow soldering of DFN2520-9 package SOT1333-1 D1 9x C (8x) Ay solder land occupied area P1 DIMENSIONS in mm P1 Ay C D1 0.50 2.30 1.07 0.30 www.nxp.com Dimensions in mm 2010 NXP B.V. 13-05-08 13-05-21
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DFN2520-9
OT1333-1
sot1333-1
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Abstract: No abstract text available
Text: Package outline DFN2520-9: plastic extremely thin small outline package; no leads; 9 terminals; body 2 x 2.5 x 0.5 mm SOT1333-1 X D B A A E A1 c detail X terminal 1 index area e1 terminal 1 index area 1 e C b 3 C A B C v w 5 y1 C y L k 9 6 1 2 Dimensions mm are the original dimensions
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DFN2520-9:
OT1333-1
MO-252
sot1333-1
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NX3008NBKMB
Abstract: IP4303CX4 PCMF2DFN1
Text: Safeguard sensitive ICs - Increase battery life - Save space With NXP key products as recommended in this brochure Interface / Function Description Product type Package NFC antenna protection 18 / 24 V Birectional low capacitance ESD protection diode PESD18VF1BL
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PESD18VF1BL
PESD24VF1BL
PESD18VF1BSF
PESD24VF1BSF
DFN1006
DSN0603
DFN2520
DFN4020
NX3008NBKMB
IP4303CX4
PCMF2DFN1
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circuit diagram wireless spy camera
Abstract: PDTB123Y IP4303CX4 dual cc BAW62 3267 tsop6 PCMF2DFN1 BST60 PUMD4 PDTB123E PDTA143
Text: Discrete Semiconductors Selection Guide 2014 Protection and signal conditioning devices, diodes, bipolar transistors, MOSFETs and thyristors. NXP’s next generation of packaging DFN Discrete Flat No-lead packages – high performance on smallest footprint
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DFN1006D-2
OD882D)
DFN1010D-3
OT1215)
DFN2020MD-6
OT1220)
DFN1608D-2
OD1608)
DSN0603
OD962)
circuit diagram wireless spy camera
PDTB123Y
IP4303CX4
dual cc BAW62
3267 tsop6
PCMF2DFN1
BST60
PUMD4
PDTB123E
PDTA143
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BZA456A
Abstract: PCMF2DFN1
Text: Application guide: ESD protection For automotive and industrial applications: car infotainment, body control modules, video cameras, industrial computers and test&measurement equipment Introduction NXP – your partner for ESD protection ESD protection has been a topic of concern for electronic system design for
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Abstract: No abstract text available
Text: Our broad package range provides maximum flexibility Very small 2 Pins Ultra small DSN0603-2 3 Pins SOT883B (SOT883) 4/5 Pins 1.0 x 0.6 x 0.37 (SOT1215) (SOT1194) Medium power SOD323F SOD323 SOD123F SOD123W SOD128 1.7 x 1.25 x 0.7 1.7 x 1.25 x 0.95 2.6 x 1.6 x 1.1
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DSN0603-2
OT883B)
OT883)
OT1215)
OD323F
OD323
OD123F
OD123W
OD128
OT663
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NX3008NBKMB
Abstract: PCMF2DFN1
Text: 使用本手册推荐的恩智浦主要产品 保护敏感的IC – 延长电池寿命 – 节省空间 接口/功能 说明 产品型号 封装 NFC天线保护 18/24 V双向低电容 ESD保护二极管 PESD18VF1BL PESD24VF1BL PESD18VF1BSF PESD24VF1BSF DFN1006
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PESD18VF1BL
PESD24VF1BL
PESD18VF1BSF
PESD24VF1BSF
DFN1006
DSN0603
DFN2520
DFN4020
NX3008NBKMB
PCMF2DFN1
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DFN4020-14
Abstract: PCMF2DFN1
Text: PCMF2DFN1; PCMF3DFN1 Common-mode EMI filter for differential channels with integrated ESD protection Rev. 2 — 28 April 2014 Product data sheet 1. Product profile 1.1 General description The devices are common-mode ElectroMagnetic Interference EMI filters with integrated
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