alternator diode 1776 B
Abstract: 2az marking transistor sot-23 SMD SOT23 transistor MARK Y2 ic mb4213 NEC 12F triac F10P048 ktc3114 equivalent SMD TRANSISTOR MARKING 02N DIODE PJ 57 ss14 BC517 equivalent
Text: Transistors Transistors Diodes Diodes Thyristors Thyristors SAW SAW Device Device Dielectric Dielectric Device Device Integrated Integrated Circuit Circuit Table of Contents Index 5 SMD Transistors Line-up PNP Transistors Transistors Line-up (NPN Transistors)
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Hig86-755-3679515
alternator diode 1776 B
2az marking transistor sot-23
SMD SOT23 transistor MARK Y2
ic mb4213
NEC 12F triac
F10P048
ktc3114 equivalent
SMD TRANSISTOR MARKING 02N
DIODE PJ 57 ss14
BC517 equivalent
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MOTOROLA SCR 1725
Abstract: 732 160 16 capactor for video card matsushita compressor capacitor MATSUSHITA compressor codes sansui tv diagram manhattan CATV arm cc 1800 39p MRF373 PUSH PULL IC 741 OPAMP DATASHEET MPS901
Text: DL110/D REV 12 Wireless RF, IF and Transmitter Device Data Contents at a Glance Wireless RF, IF and Transmitter Device Data Device Index Alphanumeric . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ix Chapter One Selector Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.1–1
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DL110/D
MOTOROLA SCR 1725
732 160 16 capactor for video card
matsushita compressor capacitor
MATSUSHITA compressor codes
sansui tv diagram
manhattan CATV
arm cc 1800 39p
MRF373 PUSH PULL
IC 741 OPAMP DATASHEET
MPS901
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JMK107BBJ226MA-T
Abstract: JMK107BBJ226MA LMK107BBJ106MALT RN5T617
Text: RN5T617 POWER MANAGEMENT SYSTEM DEVICE POWER MANAGEMENT SYSTEM DEVICE RN5T617x Product Specifications Rev. 1.4 2012.08.30 RICOH COMPANY, LTD. Electronic Devices Company This specification is subject to change without notice. 2010-2012 Rev. 1.4 Page 1 RN5T617 POWER MANAGEMENT SYSTEM DEVICE
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RN5T617
RN5T617x
JMK107BBJ226MA-T
JMK107BBJ226MA
LMK107BBJ106MALT
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RN5T614
Abstract: RN5T614G RN5T614E RN5T614C
Text: RN5T614 POWER MANAGEMENT SYSTEM DEVICE POWER MANAGEMENT SYSTEM DEVICE RN5T614x Product Specifications Rev. 1.1 2012.06.05 RICOH COMPANY, LTD. Electronic Devices Company This specification is subject to change without notice. 2010 - 2012 Rev. 1.1 Page 1 RN5T614 POWER MANAGEMENT SYSTEM DEVICE
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RN5T614
RN5T614x
RN5T614G
RN5T614E
RN5T614C
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RN5T614C
Abstract: RN5T614 RN5T614x ovp 29h PWM Cotroller IC RN5T614f 0113H
Text: RN5T614 POWER MANAGEMENT SYSTEM DEVICE POWER MANAGEMENT SYSTEM DEVICE RN5T614x Product Specifications Rev. 1.0 2011.10.06 RICOH COMPANY, LTD. Electronic Devices Company This specification is subject to change without notice. 2010-2011 Rev. 1.0 Page 1 RN5T614 POWER MANAGEMENT SYSTEM DEVICE
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RN5T614
RN5T614x
12clk
DCDCEN12
120ms
32kHz
DCDCEN12
720mA.
500mA.
RN5T614C
RN5T614x
ovp 29h
PWM Cotroller IC
RN5T614f
0113H
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Device-List
Abstract: cf745 04 p 24LC211 lattice im4a3-32 CF775 MICROCHIP 29F008 im4a3-64 ks24c01 ep320ipc ALL-11P2
Text: Device List Adapter List Converter List for ALL-11 JUL. 2000 Introduction T he Device List lets you know exactly which devices the Universal Programmer currently supports. The Device List also lets you know which devices are supported directly by the standard DIP socket and which
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ALL-11
Z86E73
Z86E83
Z89371
ADP-Z89371/-PL
Z8E000
ADP-Z8E001
Z8E001
Device-List
cf745 04 p
24LC211
lattice im4a3-32
CF775 MICROCHIP
29F008
im4a3-64
ks24c01
ep320ipc
ALL-11P2
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Device-List
Abstract: CF775 MICROCHIP 24LC211 ae29F2008 im4a3-32 CNV-PLCC-MPU51 ep320ipc cf745 04 p ALL-11P3 29lv640
Text: Device List Adapter List Converter List for ALL-11 JUL. 2000 Introduction T he Device List lets you know exactly which devices the Universal Programmer currently supports. The Device List also lets you know which devices are supported directly by the standard DIP socket and which
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ALL-11
Z8E000
ADP-Z8E001
Z8E001
Z90231
ADP-Z90259-SD
Z90241
ADP-Z90241-SD
Device-List
CF775 MICROCHIP
24LC211
ae29F2008
im4a3-32
CNV-PLCC-MPU51
ep320ipc
cf745 04 p
ALL-11P3
29lv640
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Untitled
Abstract: No abstract text available
Text: RC5T616 POWER MANAGEMENT SYSTEM DEVICE POWER MANAGEMENT SYSTEM DEVICE RC5T616x Development Specifications Rev. 1.0 2012.06.05 RICOH COMPANY, LTD. Electronic Devices Company This specification is subject to change without notice. 2010 - 2012 Rev. 1.0 Page 1
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RC5T616
RC5T616x
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Agilent 3070 Manual
Abstract: 64 bit carry-select adder verilog code 32 bit carry-select adder verilog code 24c02sc Holtek Semiconductor isp Agilent 3070 Tester 8051 interfacing to EEProm S93C56 EPM570 EPM1270
Text: MAX II Device Handbook 101 Innovation Drive San Jose, CA 95134 www.altera.com MII5V1-3.2 Copyright 2008 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the stylized Altera logo, specific device designations, and all other
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Untitled
Abstract: No abstract text available
Text: Data Sheet ESD protection device TVS RSA30L Applications For terminal protection device Dimensions (Unit : mm) 30 Features 1) Small power mold type. (PMDS) 2) High reliability Land size figure (Unit : mm) L PMDS Construction Silicon epitaxial planar
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RSA30L
OD-106
1000us)
R1120A
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IC ax 2008 USB FM PLAYER
Abstract: ATMEL 118 93C66A ax 2008 USB FM PLAYER free transistor equivalent book 2sc Agilent 3070 Tester 24C08A Agilent 3070 Manual atmel 93c66A BGA PACKAGE OUTLINE rohm cross
Text: MAX II Device Handbook 101 Innovation Drive San Jose, CA 95134 www.altera.com MII5V1-3.3 Copyright 2009 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the stylized Altera logo, specific device designations, and all other
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2SB1051K
Abstract: 750H ST-100S VMN3 TSST8 lpts 2sb1051
Text: Design Support Document RECOMMENDABLE CONDITION OF SOLDERING SURFACE MOUNTED DEVICE CONDITION OF SOLDERING FOR SURFACE MOUNTED DEVICE DISCRETE TRANSISTOR LEAD FREE (Sn-3Ag-0.5Cu) VERSION CONTENTS RECOMMENDABLE CONDITION OF REFLOW SOLDERING 2/5 RECOMMENDABLE CONDITION OF FLOW SOLDERING
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R1010A
2SB1051K
750H
ST-100S
VMN3
TSST8
lpts
2sb1051
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ic printer inkjet
Abstract: PHOTO GAP DETECTOR DVD laser head "Infrared LED" sewing motor infrared detecting object motion DETECTOR CIRCUIT DIAGRAM for light Inkjet head photo transistor photo devices
Text: Sensors（Photointerrupters）Bits Of Knowledge Photo-interrupter is a optical switch consisting of photo-emitting device and photo-receiving device, designed to detect existence/ absence of an object by sensing discontinuation of light intercepted by such object passing
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VZ-31
Abstract: No abstract text available
Text: Data Sheet ESD protection device TVS RSA30L Dimensions (Unit : mm) Applications For terminal protection device Land size figure (Unit : mm) 2.0 L ② 0.1±0.02 0.1 4.2 PMDS 2.0±0.2 1.5±0.2 Construction Silicon epitaxial planar 5.0±0.3
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RSA30L
OD-106
1000us)
300us
200pF
100pF
R1120A
VZ-31
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749022016
Abstract: 749022017 SMBJ58A
Text: DEMO MANUAL DC2093A LT4275/LT4321 LTPoE+/IEEE 802.3at/ IEEE 802.3af Compliant Powered Device Interface Description Demonstration circuit 2093A features the LT 4275, a fourth generation powered device PD controller and the LT4321, an ideal diode bridge controller for Power over
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DC2093A
LT4275/LT4321
LT4321,
DC2093A
DC2093A-A,
DC2093A-B,
DC2093A-C
DC2093A-A
LT4275A
dc2093af
749022016
749022017
SMBJ58A
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UMT6 SC-88
Abstract: SOT-363 marking ROHM 23marking Transistor code iz sot363
Text: Data Sheet POWER SUPPLY MONITOR DEVICES EML22/UML23N Dimensions Unit : mm Features 1) Packaging Zener diode and small-signal amplifier transistor EMT6 2) Using outside connection able to use Power supply monitor device 3) When use Power supply monitor device,
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EML22/UML23N
SC-88)
OT-363>
EML22
UML23N
155ppm/
R1120A
UMT6 SC-88
SOT-363 marking ROHM
23marking
Transistor code iz sot363
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Untitled
Abstract: No abstract text available
Text: RSA30L Data Sheet ESD protection device TVS RSA30L Dimensions (Unit : mm) Applications For terminal protection device Land size figure (Unit : mm) 2.0 L ② 0.1±0.02 0.1 4.2 PMDS 2.0±0.2 1.5±0.2 Construction Silicon epitaxial planar
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RSA30L
OD-106
1000us)
300us
200pF
100pF
R1120A
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Untitled
Abstract: No abstract text available
Text: Data Sheet AEC-Q101 Qualified ESD protection device TVS RSA30LTF Applications For terminal protection device Land size figure (Unit : mm) Dimensions (Unit : mm) 2.0 L ② 0.1±0.02 0.1 4.2 PMDS 2.0±0.2 1.5±0.2 Construction Silicon epitaxial planar
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AEC-Q101
RSA30LTF
OD-106
200pF
100pF
R1120A
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murata REEL label lot number
Abstract: No abstract text available
Text: PREPARED BY: DATE Reference SPEC NO. FILE No. ISSUE CHECKED BY: DATE ELECTRONIC COMPOMENTS AND DEVICES GROUP APPROVED BY: DATE PAGE Dec. 4, 2012 1/22 REPRESENTATIVE DIVISION SHARP CORPORATION SPECIFICATION SYSTEM DEVICE DIVISION DEVICE SPECIFICATION FOR 2.4GHz Wireless LAN Front-End IC
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QM2A1UB028
QM2A1UB028/EL/
murata REEL label lot number
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murata REEL label lot number
Abstract: No abstract text available
Text: PREPARED BY: DATE SPEC NO. FILE No. ISSUE CHECKED BY: DATE ELECTRONIC COMPOMENTS AND DEVICES GROUP APPROVED BY: DATE PAGE Dec. 4, 2012 1/22 REPRESENTATIVE DIVISION U SHARP CORPORATION SPECIFICATION SYSTEM DEVICE DIVISION DEVICE SPECIFICATION FOR 5GHz Wireless LAN Front-End IC
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QM2A1UB029
QM2A1UB029/EL/
murata REEL label lot number
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33608
Abstract: No abstract text available
Text: SURFBOARDS THE BREADBOARDING MEDIUM FOR R SURFACE MOUNT TM 33000 SERIES APPLICATION SPECIFIC ADAPTERS MODEL 33608 ACCEPTS DEVICE LEAD WIDTHS 1.9, 2.0, 2.8, To Max 3.8 MM SINGLE-IN-LINE SIP PINS ON .100 in. CENTERS EXAMPLE DEVICES (J) MAX DEVICE WIDTH (I)
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IDS33608
OT-23-8,
OT-28,
TSOT-23-8
020in.
33608
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Untitled
Abstract: No abstract text available
Text: Introduction Precautions for use The factors which determine the reliability of a semiconductor device include the reliability of the device itself and the conditions under which the customer uses it. In order to further increase the reliability of a semiconductor device, the following precautions should be followed
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Untitled
Abstract: No abstract text available
Text: F3recautions For Use • Semiconductor Selection Semiconductor device reliability depends largely on conditions of use. Pay careful attention to any changes in conditions ard be thoroughly aware of device specifications. Maximum ratings and the precautions given below are to help users
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OT323)
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Untitled
Abstract: No abstract text available
Text: 1C thermal design IC characteristics are greatly affected by operating temperature. If the maximum junction temperature is exceeded, the device performance will deteriorate and the device may fail prematurely. Temperature must be considered in the design of an IC from both the standpoint
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