DELTABOND 152 Search Results

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Catalog Datasheet	Type	Document Tags	PDF
Wakefield 120-320 Abstract: No abstract text available Text: Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS 120 SERIES The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal resistance of	Original	173-7-220P 173-7-230P 173-7-240P 173-7-1212P 73-7-240A 173-9-210P 173-9-230P 173-9-240P 173-9-1212P 174-9-310P Wakefield 120-320	PDF
Untitled Abstract: No abstract text available Text: Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS 120 SERIES The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal	Original	0-320P 73-7-320A 173-7-330P 173-7-340P 173-7-350P 173-7-410P 173-7-510P 173-7-520P 173-7-610P 173-7-710P	PDF
deltabond Abstract: Wakefield 120-320 152-1B thermal conductivity 175-6-220-P Text: WTS001_p50-68 6/14/07 10:46 AM Page 64 Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS 120 SERIES The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal resistance of	Original	WTS001 p50-68 173-7-220P 173-7-230P 173-7-240P 173-7-1212P 73-7-240A 173-9-210P 173-9-230P 173-9-240P deltabond Wakefield 120-320 152-1B thermal conductivity 175-6-220-P	PDF
Untitled Abstract: No abstract text available Text: WTS001_p50-68 6/14/07 10:46 AM Page 64 Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS 120 SERIES The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal resistance of	Original	WTS001 p50-68 175-6-210P 173-9-210P 173-7-220P 175-6-220P 173-7-230P 173-9-230P 175-6-230P 173-7-240P	PDF
MIL-C-47113 Abstract: t405 6000 e595 Chomerics* T-405 deltabond ARCLAD 8223 T-412 chomerics KS21343 thermal grease Chomerics T710 174-9-250P Text: Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS 120 SERIES The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal	Original	O-220 MIL-C-47113 t405 6000 e595 Chomerics* T-405 deltabond ARCLAD 8223 T-412 chomerics KS21343 thermal grease Chomerics T710 174-9-250P	PDF
l 7251 Abstract: deltabond 152 Text: VED oc ZU 2003 DOCUMENT CONTRO' REVISIONS DESCRIPTION LETTER NO NOTES: 1. CAPACITANCE: 7 3 .8 - 9 0 .2 nF. 2 . DISSIPATION FACTOR: .0 0 5 MAX O 2 5 ’ C, 1 kHZ. DIELECITRIC WITHSTANDING VOLTAGE: 3. 7 .0 kV RATED 10.5 kV BU R N -IN FOR 2 HRS @ 100* C 14.0 kV PROOF FOR 5 SECONDS	OCR Scan	823A702A000 7W970 7000WVDC 251------REYNOLDS l 7251 deltabond 152	PDF
deltabond 152 Abstract: deltabond Text: REUc, vED M Ar 3 1995 DOnJMc NOTES: 1. DISSIPATION FACTOR: .0 0 5 MAX @ 25* C, 1 kHZ. 2 . CAPACITANCE: 45 n F - 5 5 nF. 3. DIELECTRIC WITHSTANDING VOLTAGE: 1.5 kV RATED, 2 .2 5 kV PROCESS FOR 2 HOURS @ 100* C AND 3 kV PROOF FOR 5 SECS. 4. GRIT BLAST FINISH, NO TAPE OVERWRAP.	OCR Scan	7W970 1500WVDC QQW343) 10ENT deltabond 152 deltabond	PDF
Reynolds Abstract: t20nf Text: 1 R E G t. » V E D APR 2 4 1995 DCKW * NOTES: DISSIPATION FACTOR: .0 0 5 MAX @ 25* C, 1 kHZ. t. 2 . CAPACITANCE: 18 n F - 2 2 nF. 3. DIELECTRIC WITHSTANDING VOLTAGE: 1.5 kV RATED, 2 .2 5 kV PROCESS FOR 2 HOURS @ 100* C AND 3 kV PROOF FOR 5 SECS. 4. GRIT BLAST FINISH,	OCR Scan	7W970 QQW343) 7W970 Reynolds t20nf	PDF
657-10ABP Abstract: 667-10ABPP TO220 HEATSINK 637-15ABPE 651b deltabond 152 XX1371 XX1703 657-25ABPNE 657-15ABPE Text: 797-2012.qxp:QuarkCatalogTempNew 9/5/12 7:08 AM Page 797 7 Extrusions, Heat Sinks and Accessories XX1024 XX1371 ᭤ Aluminum Mfr.’s Type Extrusion Type Dimensions WxH×T Inches Nat. Conv. Qsa (°C/W) (1.312) (312) (1.335) (.090) (.190) (.375) (1.000)	Original	XX1024 XX1025 XX1371 XX1703 XX2016 XX5045 XX1024 XX1371 XX2016 152-1B 657-10ABP 667-10ABPP TO220 HEATSINK 637-15ABPE 651b deltabond 152 657-25ABPNE 657-15ABPE	PDF
Wakefield Thermal Solutions TYPE 120 Abstract: Thermagon deltabond 152 ABLESTIK 84-1LMIT deltabond intel 8052 84-1LMIT EL75XX EL7556C EL7560C Text: Application Note EL75XX Thermal Design Considerations Thermal Design Considerations EL75XX by Vijay Soman 1 0 Introduction The typical power applications requirement for microprocessors is either a VRM Voltage Regulator Module or a direct mother board solution	Original	EL75XX EL75XX 28-pin 28ccessfully Wakefield Thermal Solutions TYPE 120 Thermagon deltabond 152 ABLESTIK 84-1LMIT deltabond intel 8052 84-1LMIT EL7556C EL7560C	PDF
deltabond 152 Abstract: ABLESTIK 84-1LMIT deltabond Wakefield Thermal Solutions TYPE 120 84-1LMIT heatsink catalogue intel 8052 laptop mother board Pentium "Voltage Regulator Module" POWERSOP2 Text: Thermal Design Considerations—EL75XX Application Note March 20, 1998 AN1096 Author: Vijay Soman Typical Applications Power Requirement Elantec's EL7560/EL7561/EL7556 series of voltage regulators are highly integrated, simple to use and the most effective switching mode designs to power microprocessors	Original	Considerations--EL75XX AN1096 EL7560/EL7561/EL7556 EL7560/EL7561 EL7556 Solutions--1994 deltabond 152 ABLESTIK 84-1LMIT deltabond Wakefield Thermal Solutions TYPE 120 84-1LMIT heatsink catalogue intel 8052 laptop mother board Pentium "Voltage Regulator Module" POWERSOP2	PDF
T405R Abstract: Bergquist BP-108 T410R Chomerics* T405 658-35AB T405 T410 T411 T412 i960CF Text: WTS001_p1-25 6/14/07 10:53 AM Page 2 Thermal Management Solutions for BGAs BGA THERMAL SOLUTIONS MATRIX The following table represents Wakefield’s recommendations for a variety of standard BGA sizes. However, this is by no means a complete list of components that can be used with these heat sinks. To determine suitability for your particular component, request a BGA heat sink	Original	WTS001 p1-25 220486SX I860XR I960CA, I960CF AM486DX2, AM486DX4 669-32AG 669-32AG T405R Bergquist BP-108 T410R Chomerics* T405 658-35AB T405 T410 T411 T412	PDF
T405R Abstract: Chomerics* T405 BERGQUIST softface T410R intel 82495 Bergquist BP-108 intel 80486sx Intel 82495 Cache Controller 651b thermal printer 2 inch Text: Thermal Interface THERMAL INTERFACE MATERIAL PART NUMBER GUIDE All of the heat sinks shown in this catalog are available with any of the following thermal tape and interface materials, pre-applied at the factory. Use the “T” series, thermally enhanced, pressure sensitive adhesives to attach the heat sink to the electronic package and provide	Original	0486SX I860XR I960CA, I960CF AM486DX2, AM486DX4 669-32AG 669-32AG 669-33AB 669-40AB T405R Chomerics* T405 BERGQUIST softface T410R intel 82495 Bergquist BP-108 intel 80486sx Intel 82495 Cache Controller 651b thermal printer 2 inch	PDF
FR10300N0200J Abstract: UT-085 BLF645 2861002402 deltabond 152 UT-085C-15 transistor C103 c103 TRANSISTOR AN10953 C5750X7S2A106M Text: AN10953 BLF645 10 MHz to 600 MHz 120 W amplifier Rev. 1 — 3 March 2011 Application note Document information Info Content Keywords BLF645, broadband Abstract The BLF645 is a 100 W, 32 V LDMOS RF power push-pull transistor for broadcast transmitter and industrial applications from HF to 1.4 GHz. This	Original	AN10953 BLF645 BLF645, FR10300N0200J UT-085 2861002402 deltabond 152 UT-085C-15 transistor C103 c103 TRANSISTOR AN10953 C5750X7S2A106M	PDF