Untitled
Abstract: No abstract text available
Text: Flat panel sensor C9312SK-06 High reliability, energy range: 110 kVp Max., Photodiode size: 124.8 x 115.2 mm The C9312SK-06 is a digital X-ray image sensor developed as a key device for non-destructive inspection, radiography and other real-time X-ray imaging applications requiring high-speed and high image quality.
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Untitled
Abstract: No abstract text available
Text: Flat panel sensor C9312SK-06 High reliability, energy range: 110 kVp Max., Photodiode size: 124.8 x 115.2 mm The C9312SK-06 is a digital X-ray image sensor developed as a key device for non-destructive inspection, radiography and other real-time X-ray imaging applications requiring high-speed and high image quality.
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C9312SK-06
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Abstract: JAE 50
Text: Flat panel sensor C9312SK-06 High reliability, energy range: 110 kVp Max., Photodiode size: 124.8 x 115.2 mm The C9312SK-06 is a digital X-ray image sensor developed as a key device for non-destructive inspection, radiography and other real-time X-ray imaging applications requiring high-speed and high image quality.
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C9312SK-06
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T1247
Abstract: No abstract text available
Text: Flat panel sensor C9311DK High sensitivity, high-speed imaging, Photodiode area: 124.8 x 115.2 mm The C9311DK is a digital X-ray image sensor developed as a key device for real-time imaging applications requiring high resolution Xray images. It operates at a frame rate of 30 frames/s, making it suitable for high-speed X-ray imaging such as cone beam CT.
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C9311DK
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B1247
Abstract: B1248 b1249 LEMO 6 pin DBLC-J25PAF T1247 PHE 280 B-1249 88-SF
Text: Flat panel sensor C9311DK High sensitivity, high-speed imaging, Photodiode area: 124.8 x 115.2 mm The C9311DK is a digital X-ray image sensor developed as a key device for real-time imaging applications requiring high resolution Xray images. It operates at a frame rate of 30 frames/s, making it suitable for high-speed X-ray imaging such as cone beam CT.
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C9311DK
C9311DK
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B1247
B1248
b1249
LEMO 6 pin
DBLC-J25PAF
T1247
PHE 280
B-1249
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B1248
Abstract: 88SF
Text: Flat panel sensor C9311DK High sensitivity, high-speed imaging, Photodiode area: 124.8 x 115.2 mm The C9311DK is a digital X-ray image sensor developed as a key device for real-time imaging applications requiring high resolution Xray images. It operates at a frame rate of 30 frames/s, making it suitable for high-speed X-ray imaging such as cone beam CT.
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C9311DK
C9311DK
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defective pixel correction
Abstract: 2808 eeprom 1501 Dc to Dc converter block diagram of 8283 CN0352P 176x144 cmos defective pixel defective pixel correction test gamma ram table RELAY 4088
Text: CN0352p Pixel Processor and Control Chip The CN0352p Pixel Processor and Control PP&C chip (Figure 1) is one of two components that comprise the Conexant USB Camera System. The PP&C takes 10-bit RGB digital image data from the CN0352 Digital CIF format Imager (DCI) and performs signal processing and rate buffering. This
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CN0352p
CN0352p
10-bit
CN0352
to829
defective pixel correction
2808 eeprom
1501 Dc to Dc converter
block diagram of 8283
176x144 cmos
defective pixel
defective pixel correction test
gamma ram table
RELAY 4088
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B-2495
Abstract: No abstract text available
Text: IMAGE SENSOR Flat panel sensor C9312SK-06 High-speed, High reliability, 110 kV X-ray tube voltage proof Flat panel sensor C9312SK-06 is a digital X-ray image sensor newly developed as a key device for non-destructive inspection, radiography and other real-time X-ray imaging applications requiring high-speed and high image quality.
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C9312SK-06
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lvds 26 pin for jae 30 pin
Abstract: LEMO FFA.OS
Text: IMAGE SENSOR Flat panel sensor C9312SK-06 High-speed, High reliability, 110 kV X-ray tube voltage proof Flat panel sensor C9312SK-06 is a digital X-ray image sensor newly developed as a key device for non-destructive inspection, radiography and other real-time X-ray imaging applications requiring high-speed and high image quality.
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C9312SK-06
C9312SK-06
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lvds 26 pin for jae 30 pin
LEMO FFA.OS
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Untitled
Abstract: No abstract text available
Text: IMAGE SENSOR Flat panel sensor C9312SK-06 High-speed, High reliability, 110 kV X-ray tube voltage proof Flat panel sensor C9312SK-06 is a digital X-ray image sensor newly developed as a key device for non-destructive inspection, radiography and other real-time X-ray imaging applications requiring high-speed and high image quality.
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C9312SK-06
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LEMO FFA.OS
Abstract: LEMO DBLC-J25PAF-10L6 B249 C9312SK-06 PCS-E80LMD B2495 x-ray tube B2497 image sensor x-ray
Text: IMAGE SENSOR Flat panel sensor C9312SK-06 High-speed, High reliability, 110 kV X-ray tube voltage proof Flat panel sensor C9312SK-06 is a digital X-ray image sensor newly developed as a key device for non-destructive inspection, radiography and other real-time X-ray imaging applications requiring high-speed and high image quality.
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C9312SK-06
C9312SK-06
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SE-171
KACC1137E03
LEMO FFA.OS
LEMO
DBLC-J25PAF-10L6
B249
PCS-E80LMD
B2495
x-ray tube
B2497
image sensor x-ray
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defective pixel
Abstract: SKY STAR Fuga15d defective pixel correction
Text: Missing pixel correction algorithm for image sensors B. Dierickx, Guy Meynants IMEC Kapeldreef 75 B-3001 Leuven tel. +32 16 281492 fax. +32 16 281501 dierickx@imec.be Paper or poster submitted for Europto-SPIE / AFPAEC May 18-21 98 Zurich, CH Version 9-Apr-98
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B-3001
9-Apr-98
defective pixel
SKY STAR
Fuga15d
defective pixel correction
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samsung CMOS image sensor
Abstract: camera interface samsung S5C7323X S5K* CMOS vga camera module samsung image signal processor cmos camera module defective pixel samsung camera module VGA camera
Text: 1/4 INCH VGA CIS CAMERA MODULE PRELIMINARY SX5437M21X-X0B0 SX5437M21X-X0B0 1/4 ” VGA C IS Camera Module PRELIMINARY Preliminary Specification Revision 1.3 May. 2004 1 SX5437M21X-X0B0 PRELIMINARY 1/4 VGA CIS CAMERA MODULE DOCUMENT TITLE 1/4” Optical Size 640x480(VGA) CIS Camera Module
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SX5437M21X-X0B0
640x480
S5X437CX03-20R0
SX5437M21X-X0B0)
samsung CMOS image sensor
camera interface samsung
S5C7323X
S5K* CMOS
vga camera module
samsung image signal processor
cmos camera module
defective pixel
samsung camera module
VGA camera
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Linear Image sensor IC for CIS
Abstract: samsung image signal processor RGB565 cis Linear Image Sensor FAH 37 datasheet CMOS DIGITAL CAMERA 640x480 t1d6 samsung CMOS image sensor camera edge horizontal vertical enhancement FAH10
Text: 1/4 INCH VGA CIS CAMERA MODULE SX5433M14X-X0B0 SX5433M14X-X0B0 1/4” VGA CIS Camera Module PRELIMINARY Revision 1.3 May. 2004 1 SX5433M14X-X0B0 1/4” VGA CIS CAMERA MODULE DOCUMENT TITLE 1/4” Optical Size 640x480 (VGA) CIS Camera Module REVISION HISTORY
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SX5433M14X-X0B0
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Linear Image sensor IC for CIS
samsung image signal processor
RGB565
cis Linear Image Sensor
FAH 37 datasheet
CMOS DIGITAL CAMERA 640x480
t1d6
samsung CMOS image sensor
camera edge horizontal vertical enhancement
FAH10
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LEMO
Abstract: EN-61326-1 scintillator scintillator amplifier C9728DK-10 C9730DK-10 CLAD56 EN61326-1 x-ray cmos image sensor CMOS Camera Module CSI
Text: Flat panel sensor C9730DK-10 For soft X-ray imaging, cassette type with USB 2.0 interface Photodiode area: 52.8 x 52.8 mm The C9730DK-10 is two-dimensional CMOS image sensor module designed for X-ray imaging which requires high resolution, large area and wide dynamic range. A target material of X-ray source and X-ray energy adequate for the sensor is Mo and 17 keV. The device shape is thin cassette which incorporates on-chip high-resolution scintillator and a control board. An on-board USB 2.0 interface
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scintillator
scintillator amplifier
C9728DK-10
CLAD56
EN61326-1
x-ray cmos image sensor
CMOS Camera Module CSI
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Untitled
Abstract: No abstract text available
Text: Flat panel sensor C9730DK-10 For soft X-ray imaging, cassette type with USB 2.0 interface Photodiode area: 52.8 x 52.8 mm The C9730DK-10 is two-dimensional CMOS image sensor module designed for X-ray imaging which requires high resolution, large area and wide dynamic range. A target material of X-ray source and X-ray energy adequate for the sensor is Mo and 17 keV. The device shape is thin cassette which incorporates on-chip high-resolution scintillator and a control board. An on-board USB 2.0 interface
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Untitled
Abstract: No abstract text available
Text: Flat panel sensor C9730DK-10 For soft X-ray imaging, cassette type with USB 2.0 interface Photodiode area: 52.8 x 52.8 mm The C9730DK-10 is two-dimensional CMOS image sensor module designed for X-ray imaging which requires high resolution, large area and wide dynamic range. A target material of X-ray source and X-ray energy adequate for the sensor is Mo and 17 keV. The device shape is thin cassette which incorporates on-chip high-resolution scintillator and a control board. An on-board USB 2.0 interface
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OV10633
Abstract: OV10633-C96A-Z OV10133-C96A-Z ISP Products OV10633-C96A defective pixel defective pixel correction 14 pin image sensor image processing free omnivision yuv 720p
Text: OV10633 lead free available in a lead-free package 720p wide-dynamic range WDR image sensor product brief Single Chip Wide-Dynamic Range (WDR) Solution with Embedded Image Signal Processor The OV10633 raises the bar in security imaging with a single-chip SOC sensor that combines 720p
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OV10633
OV10633
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OV10133-C96A-Z
ISP Products
OV10633-C96A
defective pixel
defective pixel correction
14 pin image sensor
image processing free
omnivision yuv 720p
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THOMSON-CSF CCD
Abstract: pixel clock generator ttl THOMSOM
Text: • lOEbû?^ 0002351 TS3 ■ - TH 7993 PIXEL CORRECTOR CIRCUIT DESCRIPTION The TH 7993 operates in association with the memory deli vered with the image sensor to manage the pixel defect cor rection functions. The correction is made by replacing the signal of the defec
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21125kHz
000S3Sb
THOMSON-CSF CCD
pixel clock generator ttl
THOMSOM
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usb pre amplifier circuit diagram
Abstract: conexant USB
Text: CN0352p Pixel Processor and Control Chip The CN0352p Pixel Processor and Control PP&C chip (Figure 1) is one of two components that comprise the Conexant USB Camera System. The PP&C takes 10-bit RGB digital image data from the CN0352 Digital CIF format Imager (DCI) and performs signal processing and rate buffering. This
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CN0352p
CN0352p
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CN0352
SS12REF
fll0406
Q0630REF
80-Pin
usb pre amplifier circuit diagram
conexant USB
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Abstract: CN0352P ADR11 ADR14 CN0352 320X240 u0237
Text: rer C O N X A IM T ' CN0352p Pixel Processor and Control Chip The CN0352p Pixel Processor and Control PP&C chip (Figure 1) is one of two components that comprise the Conexant USB Camera System. The PP&C takes 10-bit RGB digital image data from the CN0352 Digital CIF
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CN0352p
10-bit
CN0352
6003DS
0SS12REF
80-Pin
CD 40138
ADR11
ADR14
320X240
u0237
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CD 40138
Abstract: defective pixel correction test 352x288 defective pixel CN0352 CN0352P ADR11 ADR14 defective pixel correction gain conexant USB
Text: rer C O N X A IM T ' CN0352p Pixel Processor and Control Chip The CN0352p Pixel Processor and Control PP&C chip (Figure 1) is one of two components that comprise the Conexant USB Camera System. The PP&C takes 10-bit RGB digital image data from the CN0352 Digital CIF
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CN0352p
CN0352p
10-bit
CN0352
CN03522
0SS12REF
80-Pin
6003DS
CD 40138
defective pixel correction test
352x288
defective pixel
ADR11
ADR14
defective pixel correction gain
conexant USB
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AUTOMATIC STREET LIGHT CONTROLLER using IR sensor
Abstract: gm* pip
Text: Rockwell Rp0352 Pixel Processor and Control Chip INTRODUCTION FEATURES The Rp0352 Pixel Processor and Control PP&C chip (Figure 1 ) is one of two components that comprise the Rockwell USB Camera System. The PP&C takes 10-bit RGB digital image data from the RÌ0352 Digital CIF format
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Rp0352
10-bit
FL34619
AUTOMATIC STREET LIGHT CONTROLLER using IR sensor
gm* pip
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Untitled
Abstract: No abstract text available
Text: *1* R o c k w e ll Semiconductor Systems Rp0352 Pixel Processor and Control Chip INTRODUCTION FEATURES The Rp0352 Pixel Processor and Control PP&C chip (Figure 1) is one of two components that comprise the Rockwell USB Camera System. The PP&C takes 10-bit
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Rp0352
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3034CH4
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