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    DDR3 CONNECTOR EIA Search Results

    DDR3 CONNECTOR EIA Result Highlights (6)

    Part ECAD Model Manufacturer Description Download Buy
    ECASD61C107M012KA0 Murata Manufacturing Co Ltd 7343 (7343M)/100μF±20%/16Vdc/12mOhm Visit Murata Manufacturing Co Ltd
    ECASD61A157M010KA0 Murata Manufacturing Co Ltd 7343 (7343M)/150μF±20%/10Vdc/10mOhm Visit Murata Manufacturing Co Ltd
    MP-54RJ45UNNE-002 Amphenol Cables on Demand Amphenol MP-54RJ45UNNE-002 Cat5e Non-Booted Patch Cable with RJ45 Connectors (350MHz) 2ft Datasheet
    CN-AC3MMDZBAU Amphenol Cables on Demand 3-Pin XLR Male Panel Mount Connector - Amphenol AC3MMDZB-AU - Solder Type (Black + Gold Contacts) Datasheet
    MP-54RJ45UNNE-001 Amphenol Cables on Demand Amphenol MP-54RJ45UNNE-001 Cat5e Non-Booted Patch Cable with RJ45 Connectors (350MHz) 1ft Datasheet
    CN-ACPRREDAA0 Amphenol Cables on Demand RCA Male Plug Cable Connector (Red) - Amphenol ACPR-RED - Gold Plated Diecast Shell Datasheet

    DDR3 CONNECTOR EIA Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    ddr3 connector PCB footprint

    Abstract: DDR3 240 PCB Connector Footprint EIA-364-13 DIMM DDR3 DIMM footprint ddr3 connector EIA 240 pin DIMM DDR3 connector 240 pin DIMM DDR3 connector thick DDR3 DIMM DIMM DDR3 thick EIA-364-21
    Text: PRODUCT SPECIFICATION 240 Ckt Vertical Through-Hole DDR3 Dimm 1.0 SCOPE This Product Specification covers the 1.00 mm centerline gold plated DDR3 DIMM edge card connector for 1.27 +/- 0.10 thick memory modules. 2.0 PRODUCT DESCRIPTION 2.1 PRODUCT NAME AND SERIES NUMBER S


    Original     		PDF E29179 LR19980) S2009-0247 240CKTS, PS-78079-002 ddr3 connector PCB footprint DDR3 240 PCB Connector Footprint EIA-364-13 DIMM DDR3 DIMM footprint ddr3 connector EIA 240 pin DIMM DDR3 connector 240 pin DIMM DDR3 connector thick DDR3 DIMM DIMM DDR3 thick EIA-364-21

    ddr3 PCB footprint

    Abstract: EIA-364-13 DIMM DIMM DDR3 thick DDR3 DIMM footprint EIA-364-13 240 pin DIMM DDR3 connector precondition EIA-364-20 EIA-364-21 EIA-364-28
    Text: PRODUCT SPECIFICATION 240 Ckt Vertical Through-Hole DDR3 Dimm 1.0 SCOPE This Product Specification covers the 1.00 mm centerline gold plated DDR3 DIMM edge card connector for 1.27 +/- 0.10 thick memory modules. 2.0 PRODUCT DESCRIPTION 2.1 PRODUCT NAME AND SERIES NUMBER S


    Original     		PDF E29179 LR19980) S2010-0211 260oC 220oC 240CKTS, PS-78079-002 ddr3 PCB footprint EIA-364-13 DIMM DIMM DDR3 thick DDR3 DIMM footprint EIA-364-13 240 pin DIMM DDR3 connector precondition EIA-364-20 EIA-364-21 EIA-364-28

    EIA-364-05

    Abstract: EIA-364-29 EIA-364-65 aisi EIA-TS-364-1000 240 pin DIMM DDR3 through hole EIA-364-52 DDR3 socket Qualification Test Report ddr3 connector EIA EIA-364-13 DIMM
    Text: Product Specification 108-2214 16Feb09 Rev C Fully Buffered and DDR3 DIMM Soldertail Sockets 1. SCOPE 1.1. Content This specification covers perform ance, tests and quality requirem ents for the Tyco Electronics Fully Buffered and DDR3 Dual In-Line Mem ory Module DIMM Soldertail Socket.


    Original     		PDF 16Feb09 09Feb05. EIA-364-05 EIA-364-29 EIA-364-65 aisi EIA-TS-364-1000 240 pin DIMM DDR3 through hole EIA-364-52 DDR3 socket Qualification Test Report ddr3 connector EIA EIA-364-13 DIMM

    PMIC - LED Drivers

    Abstract: J2/CMX7161
    Text: AXEL LITE Solo / Dual / Quad ARM Cortex-A9 MPCore CPU Module LITE LINE HARDWARE MANUAL DAVE Embedded Systems www.dave.eu info@dave.eu AXEL LITE Hardware Manual v. 0.9.1 <Page intentionally left blank> May, 2014 2/62 AXEL LITE Hardware Manual v. 0.9.1 Table of Contents


    Original     		PDF 28Axel 28SOM PMIC - LED Drivers J2/CMX7161

    Untitled

    Abstract: No abstract text available
    Text: Reference Manual DOC. REV. 10/17/2013 VL-EPICs-36 Komodo Intel Core 2 Duo Based SBC with Ethernet, Video, SUMIT and PC/104 interface WWW.VERSALOGIC.COM 12100 SW Tualatin Road Tualatin, OR 97062-7341 (503) 747-2261 Fax (971) 224-4708 Copyright 2013 VersaLogic Corp. All rights reserved.


    Original     		PDF VL-EPICs-36 PC/104 82574IT 8257IT VL-EPICs-36

    IMX6 security reference

    Abstract: No abstract text available
    Text: Hardware Development Guide for i.MX 6Quad, 6Dual, 6DualLite, 6Solo Families of Applications Processors IMX6DQ6SDLHDG Rev 1 06/2013 How to Reach Us: Information in this document is provided solely to enable system and software Home Page: freescale.com implementers to use Freescale products. There are no express or implied copyright


    Original     		PDF

    Atom N2800

    Abstract: eDP timing control VESA Intel D2550 nm10 atom d2700 N2600 pll lvds to eDP NM10 Express Chipset HSYNC, VSYNC, DE N2850 VR12 INTEL
    Text: Intel Atom Processor D2000 and N2000 Series Datasheet - Volume 1 of 2 Refer to Doc ID 326137-002 for Volume 2 of 2 December 2011 Revision 002 Document Number: 326136-002 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED,


    Original     		PDF D2000 N2000 Atom N2800 eDP timing control VESA Intel D2550 nm10 atom d2700 N2600 pll lvds to eDP NM10 Express Chipset HSYNC, VSYNC, DE N2850 VR12 INTEL

    6 pin sata

    Abstract: ITE 8502 slim power sata pinout slim optical drive connector pinout CATERR slim dvd drive connector pinout serverengines SLIMLINE SATA ISO-11469 pcI diagnostic card codes
    Text: Intel Server System SR1630BC Technical Product Specification Intel order number E44588-003 Revision 1.3 June, 2009 Enterprise Platforms and Services Division - Marketing Revision History Intel® Server System SR1630BC Revision History Date January 2009 Revision


    Original     		PDF SR1630BC E44588-003 S5500BC SC5650 SR1630BC S5500 6 pin sata ITE 8502 slim power sata pinout slim optical drive connector pinout CATERR slim dvd drive connector pinout serverengines SLIMLINE SATA ISO-11469 pcI diagnostic card codes

    new jn8

    Abstract: DDR3 soDIMM pinout 204 pins
    Text: Reference Manual DOC. REV. 10/17/2013 VL-EPM-35 Leopard Intel Dual Core Based Dual Board Computer with Dual Gigabit Ethernet, SATA, PC/104-Plus, Video, Audio, and SPX WWW.VERSALOGIC.COM 12100 SW Tualatin Road Tualatin, OR 97062-7341 (503) 747-2261 Fax (971) 224-4708


    Original     		PDF VL-EPM-35 PC/104-Plus, 82574IT 82541ER LPC47N217 SCH3114 LPCC47N217 SCH3114 new jn8 DDR3 soDIMM pinout 204 pins

    MIPI csi-2 spec

    Abstract: OMAP5432 toshiba emmc 4.4 spec toshiba eMMC DS toshiba 16GB Nand flash emmc 4GB eMMC toshiba ABE 814 toshiba emmc 4.4 emmc pcb layout mipi DSI LCD controller
    Text: Version E EL I M Data Manual IN Multimedia Device Engineering Samples 2.0 AR OMAP5432 Public Version PR ADVANCE INFORMATION concerns new products in the sampling or preproduction phase of development. Characteristic data and other specifications are subject to change without notice.


    Original     		PDF OMAP5432 SWPS051E MIPI csi-2 spec OMAP5432 toshiba emmc 4.4 spec toshiba eMMC DS toshiba 16GB Nand flash emmc 4GB eMMC toshiba ABE 814 toshiba emmc 4.4 emmc pcb layout mipi DSI LCD controller

    MCIMX535

    Abstract: emmc DDR3 pcb layout samsung eMMC 4.5 eMMC 4.4 eMMC rja rjc emmc Pin assignment samsung NAND Flash DIE i.mx53 samsung eMMC 5.0 SCIMX
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX53CEC Rev. 6, 03/2013 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA 12 x 12 mm PoP, 0.4 mm pitch


    Original     		PDF IMX53CEC MCIMX53xD MX53xD MCIMX535 emmc DDR3 pcb layout samsung eMMC 4.5 eMMC 4.4 eMMC rja rjc emmc Pin assignment samsung NAND Flash DIE i.mx53 samsung eMMC 5.0 SCIMX

    SCIMX

    Abstract: No abstract text available
    Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53CEC Rev. 4.1, 2/2012 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA 12 x 12 mm PoP, 0.4 mm pitch


    Original     		PDF IMX53CEC MCIMX53xD MX53xD SCIMX

    "ESP"

    Abstract: RGMII SGMII
    Text: Freescale Semiconductor Technical Data Document Number: MPC8572EEC Rev. 3, 03/2010 MPC8572E PowerQUICC III Integrated Processor Hardware Specifications 1 Overview This section provides a high-level overview of the features of the MPC8572E processor. Figure 1 shows the major


    Original     		PDF MPC8572EEC MPC8572E "ESP" RGMII SGMII

    DDR3 DIMM 240 pinout

    Abstract: 240 pin DIMM DDR3 connector AM3 Processor Functional Data Sheet DDR2 sdram pcb layout guidelines DDR3 "application note" DDR3 DIMM footprint PCI-Express 2.0 X8 connector Pinout vtr 275 k20 CRC-32 MPC8548
    Text: Freescale Semiconductor Technical Data Document Number: MPC8572EEC Rev. 2, 06/2009 MPC8572E PowerQUICC III Integrated Processor Hardware Specifications 1 Overview This section provides a high-level overview of the features of the MPC8572E processor. Figure 1 shows the major


    Original     		PDF MPC8572EEC MPC8572E MPC8572E. MPC8572E 32-bit MPC8548 32-Kbyte DDR3 DIMM 240 pinout 240 pin DIMM DDR3 connector AM3 Processor Functional Data Sheet DDR2 sdram pcb layout guidelines DDR3 "application note" DDR3 DIMM footprint PCI-Express 2.0 X8 connector Pinout vtr 275 k20 CRC-32

    pin vga CRT pinout

    Abstract: samsung* lpddr2 LPDDR2-800 i.MX53 PCIMX535DVV1C emmc DDR pcb layout Samsung eMMC 4.41 LPDDR2 PoP JESD209-2 flexcan2
    Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53CEC Rev. 3, 7/2011 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA PoP 12 x 12 mm


    Original     		PDF IMX53CEC MCIMX53xD MX53xD pin vga CRT pinout samsung* lpddr2 LPDDR2-800 i.MX53 PCIMX535DVV1C emmc DDR pcb layout Samsung eMMC 4.41 LPDDR2 PoP JESD209-2 flexcan2

    SCIMX538DZK1C

    Abstract: samsung eMMC 4.5 MCIMX535 emmc pcb layout lpddr2 pcb layout LPDDR2 PoP samsung* lpddr2* pop package N7U2 Freescale i.MX53 Quick Start Board AMBA AXI
    Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53CEC Rev. 4.1, 2/2012 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA 12 x 12 mm PoP, 0.4 mm pitch


    Original     		PDF IMX53CEC MCIMX53xD MX53xD SCIMX538DZK1C samsung eMMC 4.5 MCIMX535 emmc pcb layout lpddr2 pcb layout LPDDR2 PoP samsung* lpddr2* pop package N7U2 Freescale i.MX53 Quick Start Board AMBA AXI

    MCIMX535

    Abstract: MCIMX535DVV1C MCIMX535DVV IMX53CEC mc33902 tepbga-2 MCIMX538DZK1C H.263 *IMX53 emmc pcb layout
    Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53CEC Rev. 4, 11/2011 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA 12 x 12 mm PoP, 0.4 mm pitch


    Original     		PDF IMX53CEC MCIMX53xD MX53xD MCIMX535 MCIMX535DVV1C MCIMX535DVV mc33902 tepbga-2 MCIMX538DZK1C H.263 *IMX53 emmc pcb layout

    eMMC "thermal impedance"

    Abstract: PCIMX535DVV1C emmc Card connector 062N n78c 4.712 eMMC PoP emmc pcb layout 100KPD diode 4.7-16
    Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53CEC Rev. 2, 5/2011 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA PoP 12 x 12 mm


    Original     		PDF IMX53CEC MCIMX53xD MX53xD DDR2/LVDDR2-800, eMMC "thermal impedance" PCIMX535DVV1C emmc Card connector 062N n78c 4.712 eMMC PoP emmc pcb layout 100KPD diode 4.7-16

    DDR3 phy 100 pin diagram

    Abstract: No abstract text available
    Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53CEC Rev. 1, 3/2011 MCIMX53xD This document contains information on a new product. Specifications and information herein are subject to change without notice. i.MX53xD Applications


    Original     		PDF IMX53CEC MCIMX53xD MX53xD DDR3 phy 100 pin diagram

    SONY VTR M15 DIAGRAM

    Abstract: SAHA Freescale i.MX53 Quick Start Board "eMMC" Thermal Impedance sahara lcd monitor circuit diagram free samsung lpddr2 imx53 MCIMX537CVV8C emmc operation ver 4.41 samsung eMMC 4.5
    Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53IEC Rev. 4, 11/2011 MCIMX53xC i.MX53 Applications Processors for Industrial Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Ordering Information


    Original     		PDF IMX53IEC MCIMX53xC DDR2/LVDDR2-800, LPDDR2-800, DDR3-800 SONY VTR M15 DIAGRAM SAHA Freescale i.MX53 Quick Start Board "eMMC" Thermal Impedance sahara lcd monitor circuit diagram free samsung lpddr2 imx53 MCIMX537CVV8C emmc operation ver 4.41 samsung eMMC 4.5

    78121001

    Abstract: No abstract text available
    Text: 10 -66.80 +0.05- -76.00 MAX LATCH OPENEXTRACTION F 24.00 MAX MODULE 12.00 2 X UNLOCK © 4 ) LOCK CONNECTOR SEATING PLANE MATE: © _ ©4) MATE AND UNMATE GUIDE UNMATE: g ) - 5.20±0.25 — 3.30 ±0.25- SECTION Z-Z NOTE \© F m o d u le 1. MATERIAL:


    OCR Scan     		PDF UL94V-0, EADM00HN/2 50PIN/1 SD-78121-001 78121001

    204 pin so-DIMM DDR3 connector

    Abstract: DDR3 sodimm pcb layout DDR3 pcb layout SD-78194-001 DDR3 layout DDR3 pcb design ddr3 so-dimm 204 DDR3 layout TI SODIMM ddr3 204 DDR3 Drawing
    Text: 10 [O F MODULE 2.100.25 SECTION Z -Z CONNECTOR SEA TIN G PLANE NOTE N A T E R IA L: LCP - U L 9 4 V -0 , COLOR: BLACK HOUSING CO N TA C TS : C O PPER ALLO Y LOCK L E V E R : S T A IN L E S S S T E E L .FINISH ES: CO NTACT A R E A : REFER TABLE. SO LD ER TA IL A R E A :


    OCR Scan     		PDF SD-78194-001 2006/0A/15 204 pin so-DIMM DDR3 connector DDR3 sodimm pcb layout DDR3 pcb layout DDR3 layout DDR3 pcb design ddr3 so-dimm 204 DDR3 layout TI SODIMM ddr3 204 DDR3 Drawing

    Untitled

    Abstract: No abstract text available
    Text: 10 24.00 MAX 0.40 PEG CENTER TO MODULE SEATING FACE SEATING PLANE NOTE 3 .3 0 * 0 . SECTION Z-Z 1. MATERIAL: HOUSING CONTACTS : LCP - UL94V-0, COLOR: BLACK : COPPER ALLOY LOCK LEVER 3TAINLES — (A REFER TABLE IN SHT 6 LOCK LEVER SOLDER PAD: 100 MICROINCH 72.54 MICROMETER MATTE TIN OVER


    OCR Scan     		PDF MO-268 SD-78121-001

    204 pin so-DIMM DDR3 connector

    Abstract: ddr3 connector EIA MO-268 DDR3 layout 30Hn SD-78195-001 ddr3 sodimm
    Text: 10 - 6 6 .8 0 *0.05- - 3.9 0 M A X M O D U LE S E A T IN G I— 0 0 .9 5 DEPTH 0.8 0 *0.10 2.10*0.25 S E C T IO N Z - Z 5.10 M A X 2.00 4 .0 0 * NO TE PART 1.M A T E R IA L : H O USING LC R - U L 9 4 V - 0 , COLOR: B L A C K


    OCR Scan     		PDF UL94V-0, 50HN/1 100MIN/2 PS-78195-001 PS-78195-003 ZQQ7/08/07 SD-78195-001 204 pin so-DIMM DDR3 connector ddr3 connector EIA MO-268 DDR3 layout 30Hn ddr3 sodimm