RGB to MIPI DSI LCD
Abstract: MIPI DSI specification TC3587 mipi dbi lcd panel
Text: TC358762XBG CMOS Digital Integrated Circuit Silicon Monolithic TC358762XBG Mobile Peripheral Devices Overview TC358762XBG chip de-serializes the stream into a parallel one. The parallel output bus can be either a DPI or a DBI bus. The usage of either DPI or DBI
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TC358762XBG
TC358762XBG
P-VFBGA64-0505-0
TC358762XBG.
RGB to MIPI DSI LCD
MIPI DSI specification
TC3587
mipi dbi lcd panel
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VGA ramdac
Abstract: AD12 AF10 AN1217 isa bus schematics 41 md easy pin
Text: $33/,&$7,21 127 Migrating from STPC Consumer-S to STPC Consumer-II 7`ÃUT@DBI@VSD@ÃÉÃEHC@SWe 2YHUYLHZ This document describes how to design for the STPC Consumer-S in a way that it can be replaced by the STPC Consumer-II once silicon becomes available.
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64-Mbitthis
VGA ramdac
AD12
AF10
AN1217
isa bus schematics
41 md easy pin
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AC14
Abstract: AC10 AC12 AD10 AD12 AE10 AE13 AF10 AN1218 STPC
Text: $33/,&$7,21 127 Prototyping with STPC Consumer-S for STPC Elite production 7`ÃUT@DBI@VSD@ÃÉÃEHC@SWe 2YHUYLHZ This document describes how to design for the STPC Elite in a way that it can be prototyped by the STPC Consumer-S. The purpose is to start a STPC Elite design prior to silicon
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64-Mbit
128-Mbit
AC14
AC10
AC12
AD10
AD12
AE10
AE13
AF10
AN1218
STPC
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C27-C36
Abstract: TP5000 M1535 a1 RS200M TP4506 TP5056 TP4721 TP5860 J5027 TP4456
Text: 1 2 3 4 12 3 4 5 6 7 8 9 6 . M 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 DBI# 0:3 K2 K4 L6 K1 L3 M6 L2 M3 M4 N1 M1 N2 N4 N5 T1 R2 P3 P4 R3 T2 U1 P6 U3 T4 V2 R6 W1 T5 U4 V3 W2 Y1 AB1 1 2 3 4 4 12 4 12 B H_ADS# H_BNR# H_BPRI# L5 ADSTB0#
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PAGE45
PAGE47
6870BE
C27-C36
TP5000
M1535 a1
RS200M
TP4506
TP5056
TP4721
TP5860
J5027
TP4456
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TP4506
Abstract: TP5000 AR803 TP6244 thermistor SCK D54 TP5056 R767 TP5310 TP6311 TP4765
Text: 1 2 HD# 0:63 1 1 3 4 N C 5 6 HA#(3:31) C D 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 1,4 29 H_REQ#(0:4) 30 31 1 32 2 33 4 35 1,4 36 DBI#(0:3) 1 38 2 39 3 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 1, 4 1 1, 4 1 4 4 1, 4
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TP4698
TP4699
TP4700
TP4701
TP4702
TP4703
TP4658
TP4659
TP4660
TP4661
TP4506
TP5000
AR803
TP6244
thermistor SCK D54
TP5056
R767
TP5310
TP6311
TP4765
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Untitled
Abstract: No abstract text available
Text: 19-3349; Rev 1; 11/04 5-Output PMIC with DC-DC Core Supply for Low-Cost PDAs Applications Features ♦ Minimum External Components ♦ Efficient Step-Down DC-DC Powers CPU Core ♦ 1V/1.3V Selectable Core Voltage, 250mA ♦ Main LDO 3.3V, 500mA ♦ SD Card Output 3.3V, 500mA
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MAX8594
250mA.
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Maxim PMIC
Abstract: 3525 PWM max8593
Text: 19-3349; Rev 0; 8/04 5-Output PMIC with DC-DC Core Supply for Low-Cost PDAs Applications Features ♦ Minimum External Components ♦ Efficient Step-Down DC-DC Powers CPU Core ♦ 1V/1.3V Selectable Core Voltage, 250mA ♦ Main LDO 3.3V, 500mA ♦ SD Card Output 3.3V, 500mA
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250mA
500mA
MAX8594
Maxim PMIC
3525 PWM
max8593
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Untitled
Abstract: No abstract text available
Text: 19-3349; Rev 2; 4/05 5-Output PMICs with DC-DC Core Supply for Low-Cost PDAs Applications PDAs Organizers Cellular and Cordless Phones MP3 Players Handheld Devices Features ♦ Minimum External Components ♦ Efficient Step-Down DC-DC Powers CPU Core ♦ 1V/1.3V Selectable Core Voltage, 400mA
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400mA
MAX8594)
MAX8594A)
500mA
MAX8594
MAX8594A
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838v
Abstract: 3525 PWM 3.7v battery charger circuit diagram
Text: 19-3349; Rev 2; 4/05 5-Output PMICs with DC-DC Core Supply for Low-Cost PDAs Applications PDAs Organizers Cellular and Cordless Phones MP3 Players Handheld Devices Features ♦ Minimum External Components ♦ Efficient Step-Down DC-DC Powers CPU Core ♦ 1V/1.3V Selectable Core Voltage, 400mA
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400mA
MAX8594)
MAX8594A)
500mA
MAX8594
MAX8594A
838v
3525 PWM
3.7v battery charger circuit diagram
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Untitled
Abstract: No abstract text available
Text: ArcticLink III BX6 Solution Platform Data Sheet •••••• I2C Client Platform Highlights Serial Peripheral Interface SPI Master • CPU interface for configuring and controlling internal registers and look-up tables (LUT). NOTE: The MIPI interface can also be used instead
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120-ball,
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MIPI SCI-2
Abstract: MIPI 1 lane
Text: ArcticLink III VX3 Solution Platform Data Sheet •••••• High Definition Visual Enhancement Engine VEE HD+ and Display Power Optimizer (DPO HD+) Solution Platform Highlights High Definition Visual Enhancement Engine • VEE HD+ compensates for different viewing
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M30621MCP-XXXGP
Abstract: M30622MEP-XXXFP M30622MEP M30622F8PGP M16C M30626FHPFP M30622M6P-XXXFP M30622M6P-XXXGP M30622M8P-XXXFP M30623M6P-XXXGP M30624MGP-XXXFP
Text: M16C/62 Group M16C/62P, M16C/62PT SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER REJ03B0001-0210Z Rev.2.10 Nov. 07, 2003 1. Overview The M16C/62 group (M16C/62P, M16C/62PT) of single-chip microcomputers are built using the high-performance silicon gate CMOS process using a M16C/60 Series CPU core and are packaged in a 80-pin,
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M16C/62
M16C/62P,
M16C/62PT)
16-BIT
REJ03B0001-0210Z
M16C/60
80-pin,
M30621MCP-XXXGP
M30622MEP-XXXFP
M30622MEP
M30622F8PGP
M16C M30626FHPFP
M30622M6P-XXXFP
M30622M6P-XXXGP
M30622M8P-XXXFP
M30623M6P-XXXGP
M30624MGP-XXXFP
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SIM900 S2-1040S-Z1K18
Abstract: sim900 s2-1040s-z SIM900D SIM900 S2-1040S-Z0927 ME431MP SIM900 SIM900 S2-1040S-Z0912 SIM900 S2-1040S-Z093K sim5216 SIM5320E
Text: Wireless Technologies GSM/UMTS/CDMA GPS/GALILEO/GLONASS RFID Bluetooth ISM ZigBee/WiFi Antennas & accessories www.microdis.net 1 no More Wires Microdis Electronics acts as a high-tech distributor for many years, collecting experience in wireless communication devices. We offer not only the latest technology
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M30622F8PGP
Abstract: M16C/62P M30622F8PFP M16C M30626FHPFP hardware manual op amp marking P3 M30622M6P-XXXFP M30622M6P-XXXGP M30622M8P-XXXFP M30622M8P-XXXGP M30623M6P-XXXGP
Text: M16C/62P Group M16C/62P, M16C/62PT SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER REJ03B0001-0230Z Rev.2.30 Sep 01, 2004 1. Overview The M16C/62P Group (M16C/62P, M16C/62PT) of single-chip microcomputers are built using the highperformance silicon gate CMOS process using a M16C/60 Series CPU core and are packaged in a 80-pin,
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M16C/62P
M16C/62P,
M16C/62PT)
16-BIT
REJ03B0001-0230Z
M16C/60
80-pin,
M30622F8PGP
M30622F8PFP
M16C M30626FHPFP hardware manual
op amp marking P3
M30622M6P-XXXFP
M30622M6P-XXXGP
M30622M8P-XXXFP
M30622M8P-XXXGP
M30623M6P-XXXGP
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TC358762 De-serializer Display Bridge
Abstract: Product Brief DSI DBI RGB666
Text: Product Brief Highlights • De-serializer display bridge for connectivity of panels using legacy parallel interface to the Baseband or Application Processors with MIPI Display Serial Interface. • Solutions are based on the latest versions of industry standard MIPI
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TC358762
TC358762XBG
TC358762 De-serializer Display Bridge
Product Brief
DSI DBI
RGB666
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m30622
Abstract: M30624FGPFP M30622F8PGP M30620FCPFP M16C/62P M30622MHP-XXXGP M30622F8PFP M30624FGPGP M30626FHPGP REJ03B0001-0241
Text: M16C/62P Group M16C/62P, M16C/62PT SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER 1. REJ03B0001-0241 Rev.2.41 Jan 10, 2006 Overview The M16C/62P Group (M16C/62P, M16C/62PT) of single-chip microcomputers are built using the high performance silicon gate CMOS process using a M16C/60 Series CPU core and are packaged in a 80-pin, 100-pin and 128-pin
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M16C/62P
M16C/62P,
M16C/62PT)
16-BIT
REJ03B0001-0241
M16C/60
80-pin,
m30622
M30624FGPFP
M30622F8PGP
M30620FCPFP
M30622MHP-XXXGP
M30622F8PFP
M30624FGPGP
M30626FHPGP
REJ03B0001-0241
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MIPI HDMI bridge
Abstract: No abstract text available
Text: ArcticLink III BX6 Solution Platform Data Sheet •••••• Platform Highlights Applications Overview Serial Peripheral Interface SPI Master The ArcticLink III BX6 solution platform is a display interface bridge device enabling the connection of a
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MIPI HDMI bridge
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ILI9481
Abstract: ili94
Text: MULTI-INNO TECHNOLOGY CO., LTD. LCD MODULE SPECIFICATION Model : MI0347AT-1 Revision Engineering Date Our Reference 1.0 MODULE NO.: MI0347AT-1 Ver 1.0 Table of Contents Coversheet. 1
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MI0347AT-1
ILI9481
ili94
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ir530
Abstract: ir530 Mosfet C1005C0G1H470JT DBI CPU C1005X5R0J105M C3216X7R1E105K MAX8594 MAX8594EVKIT MBR0530 MAXIM label
Text: 19-3537; Rev 0; 1/05 MAX8594 Evaluation Kit The MAX8594 evaluation kit EV kit is a fully assembled and tested circuit board that evaluates the MAX8594 5output PMIC with DC-DC core supply for low-cost PDAs. The MAX8594 COR1 4MHz step-down DC-DC converter supplies a pin-selectable 1V or 1.3V output at
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MAX8594
250mA.
500mA.
500mA,
MAX8594
ir530
ir530 Mosfet
C1005C0G1H470JT
DBI CPU
C1005X5R0J105M
C3216X7R1E105K
MAX8594EVKIT
MBR0530
MAXIM label
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Untitled
Abstract: No abstract text available
Text: 19-3089; Rev 4; 4/09 KIT ATION EVALU E L B A AVAIL High-Efficiency, Low-IQ PMICs with Dynamic Core for PDAs and Smart Phones Features The MAX1586/MAX1587 power-management ICs are optimized for devices using Intel XScale microprocessors, including Smart Phones, PDAs, internet appliances, and other portable devices requiring substantial
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MAX1586/MAX1587
MAX1586
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ON4521
Abstract: 1586C MAX1587AETL MAX1587CETL MAX1586 MAX1586AETM MAX1586B MAX1586BETM MAX1586CETM MAX1587
Text: 19-3089; Rev 3; 12/08 KIT ATION EVALU E L B AVAILA High-Efficiency, Low-IQ PMICs with Dynamic Core for PDAs and Smart Phones Features The MAX1586/MAX1587 power-management ICs are optimized for devices using Intel XScale microprocessors, including Smart Phones, PDAs, internet appliances, and other portable devices requiring substantial
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MAX1586/MAX1587
MAX1586
ON4521
1586C
MAX1587AETL
MAX1587CETL
MAX1586AETM
MAX1586B
MAX1586BETM
MAX1586CETM
MAX1587
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MAX1586CETM
Abstract: ON4521 MAX1586 MAX1586AETM MAX1586B MAX1586BETM MAX1587 MAX1587AETL MAX1587CETL IN4527
Text: 19-3089; Rev 4; 4/09 KIT ATION EVALU E L B A AVAIL High-Efficiency, Low-IQ PMICs with Dynamic Core for PDAs and Smart Phones Features The MAX1586/MAX1587 power-management ICs are optimized for devices using Intel XScale microprocessors, including Smart Phones, PDAs, internet appliances, and other portable devices requiring substantial
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MAX1586/MAX1587
MAX1586
MAX1586CETM
ON4521
MAX1586AETM
MAX1586B
MAX1586BETM
MAX1587
MAX1587AETL
MAX1587CETL
IN4527
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1N4148
Abstract: MAX1724 MAX8588 MAX8588ETM
Text: 19-3527; Rev 0; 3/05 High-Efficiency, Low-IQ PMIC with Dynamic Core for PDAs and Smartphones Features The MAX8588 power-management IC is optimized for devices using Intel X-Scale microprocessors, including smartphones, PDAs, internet appliances, and other
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MAX8588
MAX8588
1N4148
MAX1724
MAX8588ETM
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9ROM
Abstract: as db2 hf nu ATFB mwsj NJU6623A NJU6623AFG1 TQFP100 ZZ1SB350 ZZISEG52
Text: NJU6623A 15 «ri K'V h 7 i l h ' J 7 ^ X L C D a > h n - 7 K7^A* m s NJU6623AltJ51fj1 frayiWMtLCDTAn-jyW U t , fl 0 ttli» * » Œ a t> /W * i'Ay 7<ía* . ¡JUBA*' -YMîW/ i^U-ÍROM/ ram, * * f ->ram, i - m m m j y m v m . ftísm mx-mmztizto » » Œ a t V W m y Mn* lis
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OCR Scan
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NJU6623A
15tfr1
75fi5Ii7
32fi3iÃ
15XBfÃ
15X5t*
15iffTl
9ROM
as db2 hf nu
ATFB
mwsj
NJU6623A
NJU6623AFG1
TQFP100
ZZ1SB350
ZZISEG52
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PDF
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