DAP 08
Abstract: No abstract text available
Text: 44L PLCC Package & DAP Size Standardization Product Change Notice PCN0804 v1.0 June 30, 2008 Overview The purpose of this notification is to announce that Holt Integrated Circuits has standardized the Die Attach Pad (DAP) size configuration for all products which previously used the 300 mil x 300 mil DAP 44L PLCC Package.
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PCN0804
JESD46-C,
QR-8016
DAP 08
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R6094 pmt divider circuit
Abstract: Hamamatsu r6094 741 amplifier schmatic R6094 E7718 pmt active divider circuit C7950 R5929 A7719 C7950-01
Text: HIGH VOLTAGE POWER SUPPLY SOCKET ASSEMBLY WITH WIDE BANDWIDTH AMPLIFIER DAP-TYPE PRELIMINARY DATA C7950 SERIES The C7950 series is a DAP type socket assembly designed for 28 mm (1-1/8") diameter, head-on and side-on photomultiplier tubes (PMT). The C7950
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C7950
C7950
SE-171-41
TACC1034E02
R6094 pmt divider circuit
Hamamatsu r6094
741 amplifier schmatic
R6094
E7718
pmt active divider circuit
R5929
A7719
C7950-01
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AIC331
Abstract: PD3048 TAS1020B TLV320AIC33 SLAA301 AIC33EVM TLV320AIC3x AIC33
Text: Application Report SLAA301 – July 2006 Using TDM Function to Interface Four TLV320AIC33 Codecs With a Single Host Processor Wendy Fang . DAP - Industrial Audio
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SLAA301
TLV320AIC33
TLV320AIC33
AIC331
PD3048
TAS1020B
SLAA301
AIC33EVM
TLV320AIC3x
AIC33
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ECM microphone
Abstract: electret condenser microphone preamplifier block diagram OF CONDENSER MICROPHONE two wire electret microphone AIC33 condenser microphone preamplifier from texas AIC33EVM electret condenser microphone preamplifier from texas microphone filter electret condenser mic 3 pin
Text: Application Report SLAA275 – November 2005 Using the Digital Microphone Function on TLV320AIC33 With AIC33EVM/USB-MODEVM System Wendy Fang and Mark Toth . DAP Group
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SLAA275
TLV320AIC33
AIC33EVM/USB-MODEVM
TLV320AIC33
AIC33
ECM microphone
electret condenser microphone preamplifier
block diagram OF CONDENSER MICROPHONE
two wire electret microphone
condenser microphone preamplifier from texas
AIC33EVM
electret condenser microphone preamplifier from texas
microphone filter
electret condenser mic 3 pin
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DAN801
Abstract: No abstract text available
Text: DAN 801, DAP 801 200mW . power semiconductor power electronics igbt bridge rectifier diode thyristor cib rectifier ipm driver inverter converter " Diode arrays Silicon rectifiers arrays Forward Current: 0,1 A Reverse Voltage: 80 to / V Publish Data
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200mW)
DAN801
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Untitled
Abstract: No abstract text available
Text: HIGH TEMPERATURE HIGH VOLTAGE RADIAL LEADED CAPACITORS RT XHT and NPO DIELECTRIC Consult factory for requirements above 250°C SPECIFICATIONS MECHANICAL: ALSO AVAILABLE High Temperature High Voltage Disc Capacitors Call Factory for More Information DAP up to 220°C
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RT1814
RT1824
RT2225
RT2824
RT3933
RT4844
RT5854
RT6864
RT9650
RT13565
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RT5854
Abstract: No abstract text available
Text: HIGH TEMPERATURE HIGH VOLTAGE RADIAL LEADED CAPACITORS RT XHT and NPO DIELECTRIC Consult factory for requirements above 250°C SPECIFICATIONS MECHANICAL: Case DAP or molded high temperature Vectra Consult factory for packaging above 200°C Leads Solder coated copper clad steel is standard;
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1000ohms
RT1814
RT5854
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Untitled
Abstract: No abstract text available
Text: HIGH TEMPERATURE HIGH VOLTAGE RADIAL LEADED CAPACITORS RT XHT and NPO DIELECTRIC Consult factory for requirements above 250°C SPECIFICATIONS MECHANICAL: Case DAP or molded high temperature Vectra Consult factory for packaging above 200°C Leads Solder coated copper clad steel is standard;
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1000ohms
RT1814
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RT6864
Abstract: No abstract text available
Text: HIGH TEMPERATURE HIGH VOLTAGE RADIAL LEADED CAPACITORS RT XHT and NPO DIELECTRIC Consult factory for requirements above 250°C SPECIFICATIONS L MECHANICAL: DAP up to 220°C Code B PEEK up to 240°C Code P Leads: Solder coated copper clad steel is standard;
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RT1814
RT6864
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TSC2301SPI
Abstract: AT91RM9200 PXA250 TSC2301
Text: Application Report SLAA187 - December 2003 TSC2301 WinCE Generic Drivers Yannick Chammings—WinCE Consultant, ADESET Inc., France ychammings@adeset.com Wendy X. Fang —Application Engineer, DAP Group, Texas Instruments, Dallas, TX, USA ABSTRACT This application report presents the basic concept and methodology to develop the TSC2301
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SLAA187
TSC2301
TSC2301
TSC2301SPI
AT91RM9200
PXA250
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SWT-1MS4T2B1M53QES-5
Abstract: No abstract text available
Text: 1 2 3 4 5 6 7 8 9 A A B B C C SPECIFICATIONS Case Material: Actuator: Bushing: Housing: Terminal: Mechanical Life: Contact Resistance: Diallyl Phthalate DAP UL94V-0 Brass, Chrome Plated Brass, Nickel Plating Stainless Steel Brass 40,000 make and break cycles
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UL94V-0
100mA
SWT-1MS4T2B1M53QES-5
SWT-1MS4T2B1M53QES-5
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MIL-C-55302
Abstract: Hypertac connector hypertac MILC55302 HYPERTAC CONNECTORS MIL-C-55302 CRIMP male contact solder pins hypertac HYPERTAC CONTACT PIN CHC HYPERTRONICS HYPERTAC PIN
Text: Impa opuscoli 1° 17-11-2000 14:54 Pagina 13 HYPERTAC INTERCONNECT WORLDWIDE PRESENCE TECHNICAL CHARACTERISTICS SPECIFICATION DAP per MIL-M-14 MATERIAL Insulator In excess of 2000 operations Brass Nickel plated brass or stainless steel 0.7 N 2.5 oz nominal per contact
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MIL-C-55302
AWG22
AWG30
Hypertac connector
hypertac
MILC55302
HYPERTAC CONNECTORS
MIL-C-55302 CRIMP
male contact solder pins hypertac
HYPERTAC CONTACT PIN
CHC HYPERTRONICS
HYPERTAC PIN
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RT3933
Abstract: No abstract text available
Text: HIGH TEMPERATURE 225°C HIGH VOLTAGE RADIAL LEADED CAPACITORS XHT and NPO DIELECTRIC Consult factory for requirements above 225°C SPECIFICATIONS MECHANICAL: Case DAP or molded high temperature Vectra Consult factory for packaging above 200°C Leads Solder coated copper clad steel is standard;
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1000ohms
RT3933
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DAP 08
Abstract: dap 010
Text: Plastic Packages for Integrated Circuits Package Outline Drawing L32.5x5C 32 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE Rev 0, 09/08 3.50 5.00 28X 0.50 A B 6 6 PIN 1 INDEX AREA 24 1 3.50 5.00 3.10 Exp. DAP 8 17 4X PIN #1 INDEX AREA 32 25 0.15 32X 0.25 4
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5m-1994.
DAP 08
dap 010
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SWT-1MS5T1B2M53QES
Abstract: No abstract text available
Text: 1 2 3 4 5 6 7 8 9 A A B B C C D D SPECIFICATIONS Case Material: Actuator: Bushing: Housing: Terminal: Mechanical Life: Contact Resistance: Diallyl Phthalate DAP UL94V-0 Brass, Chrome Plated Brass, Nickel Plating Stainless Steel Brass 40,000 make and break cycles
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UL94V-0
100mA
SWT-1MS5T1B2M53QES
SWT-1MS5T1B2M53QES
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DAP 08
Abstract: No abstract text available
Text: Plastic Packages for Integrated Circuits Package Outline Drawing L68.10x10B 68 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE Rev 0, 11/08 PIN 1 INDEX AREA 6 10.00 A 4X 8.00 B 52 PIN 1 INDEX AREA 6 68 51 1 35 17 64X 0.50 Exp. DAP 7.70 Sq. 10.00 0.15 4X 34 18 68X 0.55
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10x10B
AMSEY14
5m-1994.
DAP 08
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DAP 08
Abstract: DAP 015 L8 Package 200a6 dap 010
Text: Plastic Packages for Integrated Circuits Package Outline Drawing L8.2x2B 8 LEAD MICRO THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE µTDFN WITH E-PAD Rev 0, 04/08 2.00 A 6 PIN #1 INDEX AREA B 6 PIN 1 INDEX AREA 8 1 0.50 2.00 1.60±0.050 EXP. DAP (4X) 0.15 0.10 M C A B 0.25±0.050
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5m-1994.
DAP 08
DAP 015
L8 Package
200a6
dap 010
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DAP 08
Abstract: No abstract text available
Text: Plastic Packages for Integrated Circuits Package Outline Drawing L28.4x5A 28 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE Rev 2, 06/08 2.50 4.00 B 22 5.00 PIN #1 INDEX AREA 28 23 6 PIN 1 INDEX AREA 4X 6 24X 0.50 A 1 3.50 Exp. DAP 3.50 0.10 M C A B 4 28X 0.25 0.15
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DAP 08
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Untitled
Abstract: No abstract text available
Text: Plastic Packages for Integrated Circuits Package Outline Drawing L28.4x5C 28 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE Rev 0, 9/08 2.50 4.00 B 22 5.00 PIN #1 INDEX AREA 28 23 6 PIN 1 INDEX AREA 4X 6 24X 0.50 A 1 3.50 Exp. DAP 3.50 0.10 M C A B 4 28X 0.25
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5m-1994.
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DAP 08
Abstract: No abstract text available
Text: Plastic Packages for Integrated Circuits Package Outline Drawing L8.2x2A 8 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE TDFN WITH E-PAD Rev 0, 04/08 2.00 6 PIN #1 INDEX AREA A B 6 PIN 1 INDEX AREA 8 1 0.50 2.00 1.60±0.050 EXP. DAP (4X) 0.15 0.10 M C A B 0.25±0.050
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5m-1994.
DAP 08
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L2208
Abstract: No abstract text available
Text: MICRO LINEAR 25E D • bGH341A 0000331 5 ■ October 1989 7T<7 ^ Micro Linear PRELIMINARY ML2200, ML2208 Data Acquisition Peripheral GENERAL DESCRIPTION FEATURES The ML2200 and ML2208 Data Acquisition Peripherals DAP are monolithic CMOS data acquisition subsystems. These
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bGH341A
ML2200,
ML2208
16-Bit
L2200BCJ
L2200BIJ
L2200CC
L2200CIJ
L2208
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capacitor 100-10L
Abstract: L2208B L2200 "100-10l" L2208
Text: October 1994 PRELIM INARY Micro Linear ML2200, ML2208 12-Bit Plus Sign Data Acquisition Peripheral GENERAL DESCRIPTION FEATURES The M L2200 and M L2208 Data Acquisition Peripherals DAP are monolithic CM O S data acquisition subsystems. These data acquisition peripherals feature an input
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L2200
L2208
12-bit
16-bit
L2200B
L2208B
L2200C,
L2200D
capacitor 100-10L
"100-10l"
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capacitor 100-10L
Abstract: 100-10L SCX15DNC 100-10L WD SENSYM scx15dnc 100-10L AD DD118 ML2208 ML2200 ML2208CCP
Text: October 1994 PRELIM IN ARY Micro Linear ML2200, ML2208 12-Bit Plus Sign Data Acquisition Peripheral GENERAL DESCRIPTION FEATURES The M L2200 and M L2208 Data Acquisition Peripherals DAP are monolithic CM O S data acquisition subsystems. These data acquisition peripherals feature an input
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ML2200,
ML2208
12-Bit
ML2200
ML2208
16-bit
ML2200B
capacitor 100-10L
100-10L
SCX15DNC
100-10L WD
SENSYM scx15dnc
100-10L AD
DD118
ML2208CCP
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dap 001
Abstract: DAP 011 dap 002 DAP 015 dap 010 DAP 018 DAP+015
Text: • Highly reliable dual-metal PV contact. • Available in a variety of spring thick nesses and platings. • For right-angle p.c. board mounting. • Two different housing materials: DAP and polyester. • Connectors made of polyester are stackable end-to-end.
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MIL-M-14,
dap 001
DAP 011
dap 002
DAP 015
dap 010
DAP 018
DAP+015
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