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72V70800PFG
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Renesas Electronics Corporation
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512 x 512 TSI, 4 I/O at 8Mbps, 3.3V |
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DA14708-00000HZ2
|
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Renesas Electronics Corporation
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Highly Integrated Advanced Bluetooth® 5.2 SoC |
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DA14708-00HZDB-P
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Renesas Electronics Corporation
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SmartBond™ DA14708 Bluetooth® Low Energy Daughter Board |
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72V70800TFG
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Renesas Electronics Corporation
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512 x 512 TSI, 4 I/O at 8Mbps, 3.3V |
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54121-102070800LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 7 Positions, 2.54mm (0.100in) Pitch. |
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