ASTM D374
Abstract: ASTM D2240, D412 ASTM D412 ASTM d412 ASTM D2240 D2240 ASTM d792 ASTM-D-257 ASTM-D-374
Text: TG2030 Ultra Soft Thermal Conductive Pad Features Superior thermal conductivity Highly compressible Naturally tacky Low Shore OO hardness Low oil bleed Electrically insulating Applications Electronic components: IC - CPU - MOS LED - M/B - P/S - Heat Sink LCD-TV - Notebook PC - PC Telecom Device - Wireless Hub.etc.
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TG2030
D5470
D2240
ASTM D374
ASTM D2240, D412
ASTM D412
ASTM
d412
ASTM D2240
D2240
ASTM d792
ASTM-D-257
ASTM-D-374
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bergquist
Abstract: SIL-PAD 1000 TO 247 ASTM D2240, D412 ASTM D374 SIL-PAD 900S D149 D150 D2240 D257 D374
Text: Sil-Pad 900S High Performance Insulator for Low-Pressure Applications Features and Benefits TYPICAL PROPERTIES OF SIL-PAD 900S PROPERTY Color • Thermal impedance: 0.61°C-in2/W @50 psi • Electrically isolating • Low mounting pressures • Smooth and highly compliant surface
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D2240
bergquist
SIL-PAD 1000 TO 247
ASTM D2240, D412
ASTM D374
SIL-PAD 900S
D149
D150
D2240
D257
D374
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optically clear adhesive
Abstract: ecg master replacement guide 1115b silver conductive ink resins QTM-500 MGC 7805 CONDUCTIVE INK FOR FLEX CIRCUITS 3m 7815 8880-S7 UL-746
Text: 3M Electronics Assembly Solutions Product Selection Guide Smart Solutions for Building In Value 3M Company, operating in more than 60 countries, has over 60,000 products. These products, based on 40 technology platforms, have been developed by 6,500 3M Product Developers Worldwide.
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225-3S-06
7193HB
optically clear adhesive
ecg master replacement guide
1115b
silver conductive ink resins
QTM-500
MGC 7805
CONDUCTIVE INK FOR FLEX CIRCUITS
3m 7815
8880-S7
UL-746
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astm D150
Abstract: D412 ASTM D412 ASTM D5470 ASTM D2240, D412 ASTM D2240 T-Flex 200 Outgassing CVCM ASTM
Text: Laird Technologies Web site: www.LairdTech.com Item # Tflex 2130 V0, Tflex 200 V0 Series Gap Filler Material Tflex™ 200 V0 Series Gap Filler Material The Tflex™ 200 V0 Series is a very soft, free standing gap filler that is more compressible than most gap fillers. Tflex™
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D5470
IPC-TM-650
astm D150
D412
ASTM D412
ASTM D5470
ASTM D2240, D412
ASTM D2240
T-Flex 200
Outgassing
CVCM
ASTM
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D149
Abstract: D2240 D257 D412 A15561-00
Text: TgardTM 3000 Thermally Conductive Insulators Innovative Technology for a Connected World Electrically Insulating, Thermally Conductive Material The TgardTM 3000 is specifically designed to solve over heating issues such as lower component efficiency, premature component failures, size limitations and other performance problems for today’s power
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A15561-00
A15099-00
D149
D2240
D257
D412
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bergquist
Abstract: 2500S2
Text: Gap Pad 2500S20 Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 2500S20 • Thermal conductivity: 2.4 W/m-K PROPERTY Color • Low “S-Class” thermal resistance at
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2500S20
2500S20
bergquist
2500S2
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Thermal Gap Filler
Abstract: D149 D2240 D257 D412 E595
Text: TflexTM 200 V0 Series Thermal Gap Filler Innovative Technology for a Connected World SOFT, FREESTANDING GAP FILLER Tflex 200 V0 is a very soft, freestanding gap filler that is more compliant than most other gap fillers. Combining good thermal conductivity of 1.1 W/mK with high conformability, this
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A14175-00
Thermal Gap Filler
D149
D2240
D257
D412
E595
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Untitled
Abstract: No abstract text available
Text: Bond-Ply 400 Thermally Conductive,Un-Reinforced,Pressure Sensitive Adhesive Tape Features and Benefits • Thermal impedance: 0.87°C-in 2/W @50 psi • Easy application • Eliminates need for external hardware (screws,clips,etc.) • Available with easy release tabs
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E1356
D1002
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Untitled
Abstract: No abstract text available
Text: Gap Pad 1500S30 Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 1500S30 • Thermal conductivity: 1.3 W/m-K PROPERTY Color • Highly conformable / low hardness Reinforcement Carrier
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1500S30
E1269
D2240
1500S30
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Untitled
Abstract: No abstract text available
Text: Hi-Flow 225U Un-Reinforced Phase Change Thermal Interface Material Features and Benefits T YPICAL PROPERT IES OF H I-FLOW 225U PROPERTY Color • Thermal impedance:0.07°C-in /W @25 psi • Hi-Flow coating will resist dripping • Thermally conductive 55°C phase change
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D3418
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a3000
Abstract: No abstract text available
Text: Gap Pad A3000 Thermally Conductive, Reinforced Gap Filling Material Features and Benefits • Thermal conductivity: 2.6 W/m-K • Fiberglass reinforced for puncture, shear and tear resistance • Reduced tack on one side to aid in application assembly • Electrically isolating
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A3000
E1269
a3000
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Untitled
Abstract: No abstract text available
Text: Sil-Pad 800 High Performance Insulator for Low-Pressure Applications Features and Benefits T YPICAL PROPERT IES OF SIL-PAD 800 PROPERTY Color • Thermal impedance: 0.45°C-in 2/W @50 psi • High value material • Smooth and highly compliant surface
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D2240
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D150
Abstract: D257 INCOMING MATERIAL FLOW PROCESS
Text: 45 Features • Out-of-the-Box Convenience • Exceptional Thermal Performance • Simplifies Bill of Materials and Purchasing Data Sheet ThermScreen TM Factory Applied Thermal Interface Product Overview ThermScreen is a factory applied thermal interface material available as an option for
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6/03/10M
D150
D257
INCOMING MATERIAL FLOW PROCESS
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Untitled
Abstract: No abstract text available
Text: Gap Pad 2500S20 Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 2500S20 • Thermal conductivity: 2.4 W/m-K PROPERTY Color • Low “S-Class” thermal resistance at
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2500S20
E1269
D2240
2500S20
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TIC 220
Abstract: D257 D792 TIC1000A
Text: TIC 1000A High Performance, Value Compound for High-End Computer Processors Features and Benefits • High thermal performance: 0.32°C/W TO-220 thermal test @ 50 psi • Good screenability • Room temperature storage • No post “cure” required
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O-220
D5470
TIC1000A
TIC 220
D257
D792
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C351
Abstract: D149 D150 D2240 D257 D374 D575 D792 ASTM d792 ASTM D2240
Text: Gap Pad 2000S40 Highly Conformable,Thermally Conductive “S-Class” Gap Filling Material Features & Benefits TYPICAL PROPERTIES OF GAP PAD 2000S40 PROPERTY Color • Thermal conductivity = 2.0 W/mK • Low S-Class thermal resistance at very low pressures
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2000S40
C351
D149
D150
D2240
D257
D374
D575
D792
ASTM d792
ASTM D2240
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Untitled
Abstract: No abstract text available
Text: TflexTM 300 Series Thermal Gap Filler Innovative Technology for a Connected World UNIQUE SILICONE GEL OFFERS COMPLIANCY, THERMAL RESISTANCE Tflex 300, at pressures of 50psi, will deflect to over 50% the original thickness. This high rate of compliancy allows the material to “totally blanket” the component, enhancing
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50psi,
300-H
A15293-00
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Untitled
Abstract: No abstract text available
Text: TgardTM 20 Thermally Conductive Insulators Innovative Technology for a Connected World LOW COST, MEDIUM PERFORMANCE INSULATOR MATERIAL The TgardTM 20 is designed to solve over heating issues such as lower component efficiency, premature component failures, size limitations and other performance
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A15561-00
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a13514
Abstract: D149 D150 D2240 D257 D412 E595 ASTM D2240, D412 ASTM-D257 Dielectric Constant Silicon Nitride
Text: T-gardTM 200 Series global solutions : local support TM T-gard 200 Series Features and Benefits: High Performance Thermal Interface Products • High thermal Conductivity of 5.0 W/mK The T-gard™ 200 is a high performance interface pad. Consisting of silicon/
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D149
Abstract: D150 D2240 D257 D412 E595
Text: T-flex 600 Series Thermal Gap Filler global solutions : local support ™ T-flexTM 600 Series Thermal Gap Filler Exceptionally soft, highly compressible gap filler T-flex™ 600 is an exceptionally soft, highly compressible gap filling interface pad with a thermal conductivity of 3 W/mK. These
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Untitled
Abstract: No abstract text available
Text: Poly-Pad 400 Polyester-Based,Thermally Conductive Insulation Material Features and Benefits • Thermal impedance: 1.13°C-in2/W @50 psi • Polyester based • For applications requiring conformal coatings • Designed for silicone-sensitive standard
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D2240
D1458
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Untitled
Abstract: No abstract text available
Text: Gap Pad VO Conformable,Thermally Conductive Material for Filling Air Gaps Features and Benefits TYPICAL PROPERTIES OF GAP PAD VO • Thermal conductivity: 0.8 W/m-K • Enhanced puncture, shear and tear resistance • Conformable gap filling material • Electrically isolating
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E1269
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Untitled
Abstract: No abstract text available
Text: TG-X Ultra Soft Thermal Conductive Pad Features Superior thermal conductivity Highly compressible Naturally tacky Low Shore OO hardness Low oil bleed Electrically insulating Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device /
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D5470
320-320mm
D2240
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Untitled
Abstract: No abstract text available
Text: DC0040/01/PC99AL-0.10-0.1 Die Cut PCM SCR Darlington Module Features Low thermal resistance Natural tack Applications SCR Darlington Module REACH Compliant Properties RoHS Compliant Property PC99AL Unit Test Method Colour Grey - Visual Thickness 0.10 mm ASTM D374
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DC0040/01/PC99AL-0
PC99AL
D5470
DC0040/01
DC0040/02
DC0040/03
DC0040/04
DC0040/05
DC0040/06
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