Untitled
Abstract: No abstract text available
Text: Standard-D How to Order D B M E 25 P V K87 Series D - D-Sub Shell Size Fits Contacts Shell Size Standard 20 High Density (22) E A B C D 9 15 25 37 50 15 26 44 62 78 Class Omit M MM MA MAM C U - Original D* Series - one piece insulator - solder - One piece insulator - commercial - solder
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Mil-C-24308
Mil-C-24308
tine40
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Untitled
Abstract: No abstract text available
Text: Amphenol D Subminiature Interconnects M Series Standard Density System According to Mil-C-24308 Electrical Materials Current DWV Insulation Res. – 7.5A – 1000Vrms @ Sea Level – 5000 MΩ Mechanical Related Information Shell Standard Shell Space Grade
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Mil-C-24308
1000Vrms
M81969/1-02
UL94V-0
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gsfc 311 d-sub connector
Abstract: esa scc 3401 d-sub 8635-NMB esa 3401 S-311-P10 8635 p s-311-p-4 S-311-P-10 MIL-DTL-24308 3401/001
Text: D-Sub D*M-NMB Standard density D-Sub, Non Removable Contacts Space Grade Applications Satellite Launcher Space station Shuttle hardware Probe D*M-NMB non-magnetic connectors use the same components as the 3401/001 ESA/SCC and S311-P-10 GSFC connectors. However they
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S311-P-10
MIL-DTL-24308.
gsfc 311 d-sub connector
esa scc 3401 d-sub
8635-NMB
esa 3401
S-311-P10
8635 p
s-311-p-4
S-311-P-10
MIL-DTL-24308
3401/001
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Untitled
Abstract: No abstract text available
Text: Standard Density D-Sub Amphenol Receptacle Right Angle Europe Footprint – Screwlocks Specifications : Contact Resistance : 20 m? Max Insulator Resistance : 1000 M? Min at 500V DC Current Rating: 5A Dielectric Withstanding Voltage : 1000V AC for 1 minute
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UL94V-0
L77SDE09S1ACH4F
L77SDE09S1ACH3F
L77SDA15S1ACH4F
L77SDA15S1ACH3F
L77SDB25S1ACH4F
L77SDB25S1ACH3F
L77SDC37S1ACH4F
L77SDC37S1ACH3F
L177SDE09S1ACH4F
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Untitled
Abstract: No abstract text available
Text: Standard Density D-Sub Amphenol Plug Right Angle Europe Footprint – Front Screwlocks Specifications : Contact Resistance : 20 m? Max Insulator Resistance : 1000 M? Min at 500V DC Current Rating: 5A Dielectric Withstanding Voltage : 1000V AC for 1 minute
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UL94V-0
L717SDE09P1ACH4F
L717SDE09P1ACH3F
L717SDA15P1ACH4F
L717SDA15P1ACH3F
L717SDB25P1ACH4F
L717SDB25P1ACH3F
L717SDC37P1ACH4F
L717SDC37P1ACH3F
L777SDE09P1ACH4F
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Untitled
Abstract: No abstract text available
Text: Standard Density D-Sub Amphenol Receptacle Right Angle Europe Footprint – Rear Inserts Specifications : Contact Resistance : 20 m? Max Insulator Resistance : 1000 M? Min at 500V DC Current Rating: 5A Dielectric Withstanding Voltage : 1000V AC for 1 minute
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UL94V-0
L77SDE09S1ACH4R
L77SDE09S1ACH3R
L77SDA15S1ACH4R
L77SDA15S1ACH3R
L77SDB25S1ACH4R
L77SDB25S1ACH3R
L77SDC37S1ACH4R
L77SDC37S1ACH3R
L177SDE09S1ACH4R
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DDM78P
Abstract: 6111 subminiature DD-78 5532 dd 2079152 CIET-22D 030-2042-000
Text: H igh Density D How to Order — D *M A Crim p Connectors Receptacles Includes Socket Contacts With .120' Through-Mounting Holes Number of Contacts Standard (Shell Size) Version 78 (D) D D M A 78 S - D D M A M 7 8S Plugs (Includes Pin Contacts)* With .120" Through Mounting Holes
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DD-78
CIET-22D
DDM78P
6111 subminiature
DD-78
5532 dd
2079152
CIET-22D
030-2042-000
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PDF
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Untitled
Abstract: No abstract text available
Text: High Density D D*MA C rim p P rin te d C ircuit See page 342 (See page 343) Performance and Material Specifications MATERIALS AND FINISHES Standard Military Material Finish Shell Steel per A ST M A -620 Insulator Diallyl phthalate glass-filled per M IL-M -14, type SDG-F,
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CIET-22D
M22520/2-01
M22520/2-06
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PDF
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Untitled
Abstract: No abstract text available
Text: Micro D Plastic Shell - .050" Contact Spacing M D *B-P C B M D *B -PC B connectors use standard M D *B all plas tic shells and are designed for use w ith flex circuitry, printed circuit and m ulti-layer boards. They are easily mounted and soldered and provide
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RG178/U
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GG1Q
Abstract: GG1Q171
Text: INTEGRATE» DEVICE m 47E D Mâ2S7?l GG1Q171 b • IDT IDT7M4068 IDT7MB40G8 256K x 8 BiCMOS/CMOS STATIC RAM MODULE Integrated D evice T ech no logy, Inc. FEATURES: DESCRIPTION: • High density 2 megabit C M O S static RAM module • Equivalent to the JE D E C standard for future monolithic
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GG1Q171
IDT7M4068
IDT7MB40G8
32-pin,
7M4068LxxN
7MB4068SXXP
GG1Q
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Untitled
Abstract: No abstract text available
Text: H igh D ensity D D*MA Crimp P rinted Circuit See page 342 (See page 343) Performance and M aterial Specifications M A TER IA LS A N D FINISH ES Standard Military M aterial Shell Finish Steel per A S T M A -6 2 0 1 ^ Insulator Yellow chromate over cadmium
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-P-416
39D29
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PDF
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1507 CONVERTER
Abstract: No abstract text available
Text: M S C D R B SERIES CUTTING-EDGE TECHNOLOGIES OF EMI/EMC SOLUTIONS S M D P o w e r In d u c to rs • FEATURES Maximum power density. Modified standard products are available. Miniature surface mount design. ■ APPLICATIONS Notebook type PC Desk-top type PC
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MSCDRB-0403
MSCDRB-1507
60Max
45Max
92Max
MSCDRB-0905
50Max
20Max
1507 CONVERTER
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USART 6402
Abstract: advantages of master slave jk flip flop verilog code for 8254 timer
Text: Si GEC P L E S S E Y NOVEM BER 1997 S E M I C O N D U C T O R S D S 4830 - 3.0 GSC200 SERIES 0.35|a CMOS STANDARD CELL ASICs INTRODUCTION The GSC200 standard cell ASIC family from GEC Plessey Semiconductors GPS is a standard cell product combining low power, mixed voltage capability with a very high density
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GSC200
USART 6402
advantages of master slave jk flip flop
verilog code for 8254 timer
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Untitled
Abstract: No abstract text available
Text: 16 Megabyte CMOS DRAM DENSE-PAC DP3ED4MX32PSW DESCRIPTION: The D P 3 E D 4 M X 3 2 P S W is the 4 M eg x 32 D ynam ic R A M S O D iM M module. The module is constructed of eight 4 M eg x 4 D ynam ic R A M 's w h ich are surface mounted on an industry standard 72-pin S O D IM M substrate.
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DP3ED4MX32PSW
72-pin
30A191-00
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JIS G3141
Abstract: ANS11008 G3141 JISG3141
Text: E X A M P L E & O R D E R IN G C O D E R PD I - 15 H S-C D-SIIB CONNECTORS CRIMP SHELLS H NUMBER OF PINS: STANDARD = 9 = 15 = 25 = 37 HIGH DENSITY = 15 = 26 = 44 = 62 GENDER: MALE = FEMALE = S R SPACING: STANDARD = HIGH DENSITY =H BLANK MATING FACE: 2.5mm HEX RIVET
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G3141
ANS11008
PDI-15SS-C-H
DDD13T3
JIS G3141
JISG3141
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Untitled
Abstract: No abstract text available
Text: IBM11M16730B IBM11M16730C 16M x 72 DRAM MODULE Features • 16 8 Pin J E D E C Standard, 8 Byte D ual In-line M em ory M odule • 1 6 M x 7 2 Fast P age M ode D IM M s • Perform ance: • S ystem P erform ance B enefits: - Buffered inputs except R A S , D ata
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IBM11M16730B
IBM11M16730C
IBM11M16730CBC
07H1729
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PDF
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Untitled
Abstract: No abstract text available
Text: High Density D D *M A Crimp Printed Circuit See page 342 (See page 343) Performance and Material Specifications MATERIALS AND FINISHES Standard Military Material Shell Finish Steel per A ST M A -6 20 1 ^ Insulator Yellow chromate over cadmium QQ -P-416 Type II Class 2
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CIET-22D
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PDF
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SJ 38
Abstract: No abstract text available
Text: ADVANCE M IC R O N 2 MEG X M T4LD232 X (S) 32 D R A M M O D U LE 2 MEG x 32 _ _ _ _ _ _ _ _ 8 MEGABYTE, 3.3V, OPTIONAL SELF M m o d e ESH’ O D U L E FAST PAGE ° R ED° PAGE FEATURES PIN A SSIG N M E N T (Front View) • JEDEC-standard pinout in a 72-pin single-in-line
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T4LD232
72-pin
048-cycle
128ms
SJ 38
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PDF
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Untitled
Abstract: No abstract text available
Text: HB56UW873E-6A/7A Preliminary 8,388,608-Word x 72-Bit High Density Dynamic RAM Module 168-pin JE D E C Standard Outline Buffered 8B YTE DIM M HITACHI The H B56U W 873E belongs to 8 Byte D IM M Dual In-line Memory M odule fam ily, and has been developed as an optim ized main memory solution
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HB56UW873E-6A/7A
608-Word
72-Bit
168-pin
65805A
16-bit
44Tb2Q3
44Tti2D3
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PDF
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LM324
Abstract: No abstract text available
Text: / T L ir m TECHNOLOGY _ LT1413 Single Supply, D ual Precision O p A m p FCflTURCS D C S C M PTIO n Single Supply Operation: The LT1413 is a low cost, upgraded version of Linear Technology's industry standard LT1013 dual, single sup
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380jiV
950kHz
LT1413
LT1413
LT1013
LM324,
LM358,
OP-221
LM324
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PDF
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8730P
Abstract: No abstract text available
Text: IBM11M8730P 8M x 72 D R A M M O D U LE Features • 168 Pin JE D E C Standard, 8 Byte Dual In-line M em ory M odule • Au contacts • Optim ized for ECC applications • 8M x72 Fast Page M ode DIMM • System Perform ance Benefits: - • Perform ance: Buffered inputs except RAS, Data
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IBM11M8730P
110ns
130ns
03H7152
MMDL12DSU-00
8730P
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PDF
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Untitled
Abstract: No abstract text available
Text: H igh D ensity D D*M A Crimp P rinted Circuit See page 342 (See page 343) Performance and M aterial Specifications MATERIALS AND FINISHES Standard Military M aterial Shell Finish Steel per A S T M A -6 2 0 1 ^ Insulator Yellow chromate over cadmium Q Q -P-416 Type II Class 2
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OCR Scan
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CIET-22D
T005424
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PDF
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pin diagram for IC 7476
Abstract: MT16D164 RWS300B-15/R
Text: M ir H D N 1 1 MEG 8 MEGABYTE, 5V, FAST PAGE MODE FEATURES PIN ASSIGNMENT Front View • JE D E C - and industry-standard pinout in a 168-pin, dual-in-line m em ory m odule (D IM M ) • High-performance C M O S silicon-gate process • Single +5V ±10% pow er supply
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MT16D164
168-pin,
600mW
024-cycle
168-Pin
pin diagram for IC 7476
RWS300B-15/R
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PDF
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5145154-4
Abstract: No abstract text available
Text: tifca M em ory & Socket Products M em ory / D IM M Sockets Electronics Standard Edge .0 5 0 Series PCI Connectors • High density .0 5 0 1.27m m centreline contact spacing ■ Easy m ating of high circuit count daughter boards ■ Polarising w eb for positive board-to-connector registration
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