CP710
Abstract: CMPTA94 CXTA94 CZTA94 MPSA94
Text: PROCESS CP710 Small Signal Transistor PNP - High Voltage Transistor Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 26 x 26 MILS Die Thickness 9.0 MILS Base Bonding Pad Area 6.1 x 4.9 MILS Emitter Bonding Pad Area 5.2 x 5.2 MILS Top Side Metalization
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CP710
CMPTA94
CXTA94
CZTA94
MPSA94
22-March
CP710
CMPTA94
CXTA94
CZTA94
MPSA94
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CMPTA94
Abstract: CP710 CXTA94 CZTA94 MPSA94
Text: PROCESS CP710 Small Signal Transistors PNP - High VoltageTransistor Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 26 x 26 MILS Die Thickness 9.0 MILS Base Bonding Pad Area 6.1 x 4.9 MILS Emitter Bonding Pad Area 5.2 x 5.2 MILS Top Side Metalization
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CP710
CMPTA94
CXTA94
CZTA94
MPSA94
CMPTA94
CP710
CXTA94
CZTA94
MPSA94
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CMPTA94
Abstract: CP710 CXTA94 CZTA94 MPSA94
Text: PROCESS CP710 Central Small Signal Transistor TM Semiconductor Corp. PNP - High Voltage Transistor Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 26 x 26 MILS Die Thickness 9.0 MILS Base Bonding Pad Area 6.1 x 4.9 MILS Emitter Bonding Pad Area 5.2 x 5.2 MILS
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CP710
CMPTA94
CXTA94
CZTA94
MPSA94
CMPTA94
CP710
CXTA94
CZTA94
MPSA94
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CXTA94
Abstract: chip die transistor
Text: PROCESS CP710 Small Signal Transistor PNP - High Voltage Transistor Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 26 x 26 MILS Die Thickness 9.0 MILS Base Bonding Pad Area 6.1 x 4.9 MILS Emitter Bonding Pad Area 5.2 x 5.2 MILS Top Side Metalization
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CP710
CMPTA94
CXTA94
CZTA94
MPSA94
23-August
chip die transistor
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BF244 datasheet
Abstract: 2N5133 equivalent MPS5771 BD345 BD347 BF244 2n5248 bf256 2N3304 2n5910
Text: Index Industry Part Number Central Process No. Page # Industry Part Number 1N456 .CPD64 . 216 1N456A.CPD64 . 216 1N457 .CPD64 . 216
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1N456
CPD64
1N456A.
1N457
1N457A.
1N458
BF244 datasheet
2N5133 equivalent
MPS5771
BD345
BD347
BF244
2n5248
bf256
2N3304
2n5910
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MPSA94
Abstract: CMPTA94 CP710 CXTA94 CZTA94
Text: PROCESS CP710 Small Signal Transistor PNP - High Voltage Transistor Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 26 x 26 MILS Die Thickness 9.0 MILS Base Bonding Pad Area 6.1 x 4.9 MILS Emitter Bonding Pad Area 5.2 x 5.2 MILS Top Side Metalization
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CP710
CMPTA94
CXTA94
CZTA94
MPSA94
631tage
MPSA94
CMPTA94
CP710
CXTA94
CZTA94
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