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    CTE TABLE IC BGA Search Results

    CTE TABLE IC BGA Result Highlights (6)

    Part ECAD Model Manufacturer Description Download Buy
    74HC4053FT Toshiba Electronic Devices & Storage Corporation CMOS Logic IC, SPDT(1:2)/Analog Multiplexer, TSSOP16B, -40 to 125 degC Visit Toshiba Electronic Devices & Storage Corporation
    7UL2T125FK Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Buffer, SOT-765 (US8), -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation
    7UL2T126FK Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Buffer, SOT-765 (US8), -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation
    74HC4051FT Toshiba Electronic Devices & Storage Corporation CMOS Logic IC, SP8T(1:8)/Analog Multiplexer, TSSOP16B, -40 to 125 degC Visit Toshiba Electronic Devices & Storage Corporation
    7UL1G07FU Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Non-Inverter Buffer (Open Drain), USV, -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation
    TB67H451AFNG Toshiba Electronic Devices & Storage Corporation Brushed Motor Driver/1ch/Vout(V)=50/Iout(A)=3.5 Visit Toshiba Electronic Devices & Storage Corporation

    CTE TABLE IC BGA Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Altera Flip Chip BGA warpage

    Abstract: with or without underfill DSASW0010612 cte table epoxy substrate you ad electronics Power consumption of FCBGA 53RD
    Text: Design Guidance for the Mechanical Reliability of Low-K Flip Chip BGA Package 1 Kuo-Chin Chang*, 2Yuan Li, 1Chung-Yi Lin, and 1Mirng-Ji Lii 1 Taiwan Semiconductor Manufacturing Company, Ltd. 6, Creation Rd. 2, HsinChu Science Park, HsinChu 300, TAIWAN * Tel: 886-3-5785112 Ext.6274; Fax: 886-3-5641737; E-mail: kcchange@tsmc.com


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    IPC-6012

    Abstract: IPC-D-279 IPC-6013 IPC-6016 IPC-2223 ipc 7094 IPC-7094 IPC-2226 IPC-6011 IPC-7525
    Text: Maxim > App Notes > General Engineering Topics Prototyping and PC- Board Layout Wireless and RF Keywords: chip scale package, flip chip, CSP, UCSP, U- CSP, BGA, WLCSP May 01, 2008 APPLICATION NOTE 1891 Wafer-level packaging WLP and its applications Abstract: This application note discusses Maxim's wafer-level package (WLP). Topics include: wafer construction, tape-and-reel


    Original     		PDF 1000x com/an1891 AN1891, APP1891, Appnote1891, IPC-6012 IPC-D-279 IPC-6013 IPC-6016 IPC-2223 ipc 7094 IPC-7094 IPC-2226 IPC-6011 IPC-7525

    IPC-6011

    Abstract: IPC-D-279 IPC-6013 ipc 7094 IPC-6012 IPC-2223 IPC 6012 IPC-6016 IPC-2221 IPC-2222
    Text: Maxim > App Notes > General Engineering Topics Prototyping and PC-Board Layout Wireless, RF, and Cable Keywords: chip scale package, flip chip, CSP, UCSP, U-CSP, BGA, WLCSP May 01, 2008 APPLICATION NOTE 1891 Wafer-Level Packaging WLP and Its Applications


    Original     		PDF 1000x com/an1891 AN1891, APP1891, Appnote1891, IPC-6011 IPC-D-279 IPC-6013 ipc 7094 IPC-6012 IPC-2223 IPC 6012 IPC-6016 IPC-2221 IPC-2222

    DBGA

    Abstract: cte table ic bga DIMPLE BGA FR4 0.8mm thickness 0.65mm pitch BGA BGA cte BGA Solder Ball collapse bga thermal cycling reliability
    Text: 2ND LEVEL INTERCONNECT RELIABILITY OF CERAMIC AREA ARRAY PACKAGES Shingo Sato, Noriyuki Shimizu*, Shin Matsuda, Shoji Uegaki and Sachio Ninomiya Kyocera Corporation Kyoto, Japan Biography During temperature cycling test TCT , CBGAÕs failure usually occurs in the form of an


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    NATIONAL SEMICONDUCTOR ink MARKING

    Abstract: Die Attach epoxy stamping cte table flip chip substrate cte table ic bga JESD 49 gold wire bond failures due to ultrasonic cleaning Aluminum alloys physical properties FLIP CHIP PRODUCTS micro machine thermal conductivity coefficient of thermal expansion of thermal conductive pressure sensitive adhesive
    Text: September 2000 Die Products Business Unit as watches, calculators and smart cards as well as leading edge multiple die applications like cellular handsets and digital cameras. Better device performance utilizing die show up in processor modules for computers, workstations and servers as


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    WLCSP smt

    Abstract: EIA-481-D-2008 Cu OSP and Cu SOP qfn tray pocket size 5 x 6 SUF1577-15 WLCSP stencil design without underfill SAC396 cte table flip chip substrate SAC 2.3 Ag bump composition
    Text: AN69061 Design, Manufacturing, and Handling Guidelines for Cypress Wafer-Level Chip Scale Packages WLCSP Author: Wynces Silvoza, Bo Chang Associated Project: No Associated Part Family: All Cypress WLCSP products Software Version: None Associated Application Notes: None


    Original     		PDF AN69061 AN69061 WLCSP smt EIA-481-D-2008 Cu OSP and Cu SOP qfn tray pocket size 5 x 6 SUF1577-15 WLCSP stencil design without underfill SAC396 cte table flip chip substrate SAC 2.3 Ag bump composition

    IDT71V2576

    Abstract: IDT71V2578 IDT71V3576 IDT71V3578 cte table ic bga SSIO-24 71V2578
    Text: PRELIMINARY IDT71V2576 IDT71V2578 IDT71V3576 IDT71V3578 128K X 36, 256K X 18, 3.3V SYNCHRONOUS SRAMS WITH 2.5V I/O OPTION, PIPELINED OUTPUTS, BURST COUNTER, SINGLE CYCLE DESELECT FEATURES: DESCRIPTION: • 128K x 36, 256K x 18 memory configurations • Supports high system speed:


    Original     		PDF IDT71V2576 IDT71V2578 IDT71V3576 IDT71V3578 200MHz 183MHz 166MHz 150MHz 133MHz 71V2576 IDT71V2576 IDT71V2578 IDT71V3576 IDT71V3578 cte table ic bga SSIO-24 71V2578

    transistor smd G46

    Abstract: fluke 52 k/j Thermocouple 7512 pin diodes in micro semi data sheet smd transistor marking ey SMD MARKING CODE h5 MCP Technology Trend BGA-64 pad AMD reflow soldering profile BGA SMD MARKING CODE l6 BGA Solder Ball 0.6mm
    Text: FBGA User’s Guide Version 4.2 -XO\  7KH IROORZLQJ GRFXPHQW UHIHUV WR 6SDQVLRQ PHPRU\ SURGXFWV WKDW DUH QRZ RIIHUHG E\ ERWK $GYDQFHG 0LFUR 'HYLFHV DQG XMLWVX $OWKRXJK WKH GRFXPHQW LV PDUNHG ZLWK WKH QDPH RI WKH FRPSDQ\ WKDW RULJ LQDOO\ GHYHORSHG WKH VSHFLILFDWLRQ WKHVH SURGXFWV ZLOO EH RIIHUHG WR FXVWRPHUV RI ERWK $0' DQG


    Original     		PDF N32-2400 22142J transistor smd G46 fluke 52 k/j Thermocouple 7512 pin diodes in micro semi data sheet smd transistor marking ey SMD MARKING CODE h5 MCP Technology Trend BGA-64 pad AMD reflow soldering profile BGA SMD MARKING CODE l6 BGA Solder Ball 0.6mm

    TDA9321H

    Abstract: SAB9078HS smd transistor 2fh SAB9079HS SQFP128 TDA8310 TDA9143 TDA831 mp1192 TDA9321
    Text: INTEGRATED CIRCUITS DATA SHEET SAB9079HS Multistandard Picture-In-Picture PIP controller Preliminary specification File under Integrated Circuits, IC02 2000 Jan 13 Philips Semiconductors Preliminary specification Multistandard Picture-In-Picture (PIP) controller


    Original     		PDF SAB9079HS SAB9079HS 545004/50/01/pp48 TDA9321H SAB9078HS smd transistor 2fh SQFP128 TDA8310 TDA9143 TDA831 mp1192 TDA9321

    JESD-26

    Abstract: RAI-5-039 mineral spirits bulk modulus Silicone mold release agent JESD-22 KITAGAWA MINERAL SPIRITS
    Text: Package Reliability All products and packages offered by National Semiconductor Corporation meet the minimum reliability qualification requirements outlined in Table 1 and Table 2 for hermetic and plastic packages, respectively. These minimum requirements are applied to new packages as well as to existing


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    TB451

    Abstract: intersil standard part marking wlcsp inspection
    Text: Technical Brief 451 PCB Assembly Guidelines for Intersil Wafer Level Chip Scale Package Devices Introduction SOLDER BALL: Sn/Ag/Cu There is an industry-wide trend towards using the smallest package possible for a given pin count. This is driven primarily by the handheld products market where the trend towards


    Original     		PDF TB451 intersil standard part marking wlcsp inspection

    Untitled

    Abstract: No abstract text available
    Text: ADVANCE M i m n M 2 5 b K X 1 8 , 1 2 8 K X 3 2 /3 6 I 3.3V I/O, PIPELINED, SCD SYNCBURST SRAM Q X /M f^ D I in Q T O T I M v D U l l O I MT58LC256K18D9, MT58LC128K32D9, MT58LC128K36D9 C D A M 3.3V Supply, Pipelined, Burst Counter and Single-Cycle Deselect


    OCR Scan     		PDF MT58LC256K18D9, MT58LC128K32D9, MT58LC128K36D9

    Untitled

    Abstract: No abstract text available
    Text: KM736V799 128Kx36 Synchronous SRAM Document Title 128Kx36-Bit Synchronous Pipelined Burst SRAM Revision History Rev. No 0.0 0.1 History Draft Date Remark Initial d ra ft A pril . 14. 19 98 P re lim in a ry C h a n g e U n d e rs h o o t s p e c A pril . 20. 19 98


    OCR Scan     		PDF KM736V799 128Kx36 128Kx36-Bit 100-TQFP-1420A 50REF

    Untitled

    Abstract: No abstract text available
    Text: ADVANCE M i m n M 2 5 b K X 1 8 , 1 2 8 K X 3 2 /3 6 I 2.5V I/O, PIPELINED, DCD SYNCBURST SRAM Q X /M f^ D I i n Q T O T I M v D U l l O I MT58LC256K18F1, MT58LC128K32F1, MT58LC128K36F1 C D 3.3V Supply, +2.5V I/O, Pipelined, Burst Counter and Double-Cycle Deselect


    OCR Scan     		PDF MT58LC256K18F1, MT58LC128K32F1, MT58LC128K36F1

    Untitled

    Abstract: No abstract text available
    Text: IBM041811PLA Preliminary 6 4 K x 18 P IP E L IN E S R A M Features • 6 4 K x 18 O rganization • • 0 .5 Micron C M O S Technology • Self-tim ed W rite O peration • S ynchronous Pipeline M o d e O f Operation • Byte W rite Capability • Single + 3 .3 V ± 5 % P ow er S upply and Ground


    OCR Scan     		PDF IBM041811PLA MMDM05DSU-00 IBM041811 119X10

    scb68459

    Abstract: SA1000 floppy disk spindle controller scn68454 ISCN68454 SCN68000 SCN68454C6A52 SCN68454C6I48 SCN68454C6N48 ST506
    Text: Signetics M icro p ro ce sso r P rod ucts DESCRIPTION The SCN68454 Intelligent Multiple Disk C ontroller IMDC provides the tradition­ al and advanced features required to control W inchester type rigid disks and floppy disks. It can control up to four rigid or floppy disk drives, in any com bi­


    OCR Scan     		PDF SCN68454 SA1000 ST506 16-bit SCN68454 N68454 scb68459 floppy disk spindle controller ISCN68454 SCN68000 SCN68454C6A52 SCN68454C6I48 SCN68454C6N48

    f9001

    Abstract: NAFI tae 2026 CV17 LQFP32 PCD5008 PCD5013 PCD5013H 8668A X1HB
    Text: P hilips S em ico n d uctors FLEX roaming decoder II C O N TE N TS 1 F E A TU R E S 2 A P P LIC A T IO N S 3 G E N E R A L D ES C R IPTIO N 4 Q U IC K R EFE R E N C E D ATA 5 O R D E R IN G IN FO R M A TIO N 6 B LO C K D IA G R AM 7 P IN NING 8 F U N C T IO N A L D ES C R IPTIO N


    OCR Scan     		PDF

    BGA153-1422-1

    Abstract: G31D
    Text: TOSHIBA TC55YK1618XB-666f-500t-400 T EN T A T IV E T O S H IB A M O S D IG IT A L IN T E G R A T E D C IR C U IT S IL IC O N G A T E C M O S 1,048,576-WORD BY 18-BIT SYNCHRONOUS STATIC RAM DESCRIPTION The TC55YK1618XB is a 18,874,368-bit synchronous static random access memory SRAM organized


    OCR Scan     		PDF TC55YK1618XB-666f-500t-400 TC55YK1618XB 368-bit TC55YK1618XB-666 D031D2Ì BGA153-1422-1 G31D

    DA05 display

    Abstract: display DA05 TDA9321H 741071 A302 w3 PICTURE TUBE DA03 DA115 SAB9079HS SQFP128
    Text: Philips Semiconductors Preliminary specification Multistandard Picture-ln-Picture PIP controller 0 . D0n7nu0 FEATURES • Suitable for single PIP, double window and multi PIP applications BUS • Data formats 4 : 1 : 1 (all modes) and 4 : 2 : 2 (most modes)


    OCR Scan     		PDF bAB9079nb DA05 display display DA05 TDA9321H 741071 A302 w3 PICTURE TUBE DA03 DA115 SAB9079HS SQFP128

    Untitled

    Abstract: No abstract text available
    Text: ADVANCE 256K x 18/128K x 36 2.5V I/O, LATCHED LATE WRITE SRAM MT59L256V18L MT59L128V36L 4.5Mb LATE WRITE SRAM FEATURES • • • • • • • • • • • • • • • • • Fast cycle times 5ns, 5.5ns and 6ns 256K x 18 or 128K x 36 configurations


    OCR Scan     		PDF 18/128K MT59L256V18L MT59L128V36L 18/128KX MT59L256V18L

    Untitled

    Abstract: No abstract text available
    Text: 1.0 Product Description The R S8228 Octal ATM Transm ission Convergence TC PH Y device dram ati­ cally increases the level o f integration for switches and access systems. The R S8228 integrates all o f the ATM Layer processing functions found in the ATM


    OCR Scan     		PDF S8228 af-phy0043 RS8228 N8228DSA

    Untitled

    Abstract: No abstract text available
    Text: ADVANCE 256K x 18/128K x 36 2.5V I/O, PIPELINED LATE WRITE SRAM MICRON I TECHNOLOGY, INC. MT59L256V18P MT59L128V36P 4.5Mb LATE WRITE SRAM FEATURES • • • • • • • • • • • • • • • • Fast cycle times 4.5ns, 5ns, 6ns and 7ns 256K x 18 or 128K x 36 configurations


    OCR Scan     		PDF 18/128K MT59L256V18P MT59L128V36P

    Untitled

    Abstract: No abstract text available
    Text: ADVANCE M ir a r i M 2 5 5 K X I 8 /1 2 8 K X 3 6 I LVTTL, FLOW-THROUGH LATE WRITE SRAM d 5 M h ^ ,J IV IU I A T F •- MT59L256L18F MT59L128L36F WRITE SRAM Dual Clock and Single Clock FEATURES • • • • • • • • • • • • • • • •


    OCR Scan     		PDF MT59L256L18F MT59L128L36F

    MCM6573A

    Abstract: S3888 MCM6576 MCM6575 character generator matrix pattern acab acab chip MCM66740 MCM66750 MCM6673 n25E
    Text: M M O T O R O L A 8 1 9 2-B IT REA D O N L Y M EM O RIES RO W S E L E C T C H A R A C T E R G E N E R A T O R S T h e M C M 6 6 7 0 0 is a m ask-p ro g ra m m a b le 8 1 9 2 -b it h o rrzontal-scan (ro w select} c h a ra c te r gen erator. It c o n ta in s


    OCR Scan     		PDF MCM66700 8192-bit MCM6573A S3888 MCM6576 MCM6575 character generator matrix pattern acab acab chip MCM66740 MCM66750 MCM6673 n25E