CTE TABLE EPOXY SUBSTRATE Search Results

CTE TABLE EPOXY SUBSTRATE Result Highlights (4)

Part	Manufacturer	Description
LM2512ASN/NOPB	Texas Instruments	Mobile Pixel Link (MPL-1) 24Bit RGB Display Interf Serializer w/ Optional Dithering & Look Up Table 40-X2QFN -30 to 85
DAC539G2RTERQ1	Texas Instruments	Automotive, 10-bit look-up-table based GPI-to-PWM converter for a single-wire error communication 16-WQFN -40 to 125
DAC539G2WRTERQ1	Texas Instruments	Automotive, 10-bit look-up-table based GPI-to-PWM converter for a single-wire error communication 16-WQFN -40 to 125
LM2512ASM/NOPB	Texas Instruments	Mobile Pixel Link (MPL-1) 24Bit RGB Display Interf Serializer w/ Optional Dithering & Look Up Table 49-NFBGA -30 to 85

CTE TABLE EPOXY SUBSTRATE Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
Maxwell PROCESS Abstract: No abstract text available Text: TECHNICAL INFORMATION SURFACE MOUNT SOLDERING TECHNIQUES AND THERMAL SHOCK IN MULTILAYER CERAMIC CAPACITORS John Maxwell AVX Corporation Abstract: All components used in surface mount assemblies have temperature processing limitations that must be adhered to for	Original	wh80-539-1501 S-SMST00M301-R Maxwell PROCESS	PDF
mlc avx capacitors cte Abstract: cte table Vapor Phase Soldering tantalum capacitors Invar 36 cte table epoxy substrate Text: TECHNICAL INFORMATION SURFACE MOUNT SOLDERING TECHNIQUES AND THERMAL SHOCK IN MULTILAYER CERAMIC CAPACITORS John Maxwell AVX Corporation Abstract: All components used in surface mount assemblies have temperature processing limitations that must be adhered to for	Original	S-SMST00M301-R mlc avx capacitors cte cte table Vapor Phase Soldering tantalum capacitors Invar 36 cte table epoxy substrate	PDF
Untitled Abstract: No abstract text available Text: Thermally Conductive Epoxy Encapsulating & Potting Compound 832TC Technical Data Sheet 832TC Description The 832TC Thermally Conductive Epoxy, Encapsulating and Potting Compound, is an electric grade epoxy. It uses high purity aluminum oxide to provide excellent thermal conductivity at reasonable costs. This two	Original	832TC 832TC	PDF
capacitor 47 nano Abstract: capacitors coefficient of thermal expansion cte table cte table epoxy mlc avx capacitors cte cte table epoxy substrate Capacitor Assembly MTBF Text: SMPS Capacitors Assembly Guidelines Reliability ២ ២ = ២ Voltage Acceleration ២ AVX has been involved in numerous military and customer High Reliability programs for over 40 years. Reliability [% Failure Rate FR% or Mean Time Between Failure (MTBF)] is based on the number of failures and the cumulative	Original	12ions capacitor 47 nano capacitors coefficient of thermal expansion cte table cte table epoxy mlc avx capacitors cte cte table epoxy substrate Capacitor Assembly MTBF	PDF
cte table Abstract: cte table epoxy cte table epoxy substrate cte table for epoxy adhesive and substrate Capacitor Assembly MTBF CAPACITOR chip mtbf mlc avx capacitors cte capacitors coefficient of thermal expansion SMPS 1812 Text: SMPS Capacitors Assembly Guidelines Reliability ២ ២ = ២ Voltage Acceleration ២ AVX has been involved in numerous military and customer High Reliability programs for over 40 years. Reliability [% Failure Rate FR% or Mean Time Between Failure (MTBF)] is based on the number of failures and the cumulative	Original	12tions cte table cte table epoxy cte table epoxy substrate cte table for epoxy adhesive and substrate Capacitor Assembly MTBF CAPACITOR chip mtbf mlc avx capacitors cte capacitors coefficient of thermal expansion SMPS 1812	PDF
capacitors coefficient of thermal expansion Abstract: mlc avx capacitors cte cte table Capacitor Assembly MTBF Text: SMPS Capacitors Assembly Guidelines Reliability ២ ២ = ២ Voltage Acceleration ២ AVX has been involved in numerous military and customer High Reliability programs for over 40 years. Reliability [% Failure Rate FR% or Mean Time Between Failure (MTBF)] is based on the number of failures and the cumulative	Original	12estrictions capacitors coefficient of thermal expansion mlc avx capacitors cte cte table Capacitor Assembly MTBF	PDF
SM-05 Abstract: mlc avx capacitors cte cte table epoxy substrate g11 epoxy glass Text: TECHNICAL INFORMATION PROCESSING GUIDELINES FOR S.M.P.S. MULTILAYER CERAMIC CAPACITORS by John Maxwell and Mark Doty AVX Corporation Olean, NY Abstract: Surface mount technology and high current layout techniques will be used as high frequency switch mode power supplies move to one	Original	S-MPGC00M0401-R SM-05 mlc avx capacitors cte cte table epoxy substrate g11 epoxy glass	PDF
cte table epoxy Abstract: No abstract text available Text: TECHNICAL INFORMATION PROCESSING GUIDELINES FOR S.M.P.S. MULTILAYER CERAMIC CAPACITORS by John Maxwell and Mark Doty AVX Corporation Olean, NY Abstract: Surface mount technology and high current layout techniques will be used as high frequency switch mode power supplies move to one	Original	SMP0-539-1501 S-MPGC00M0401-R cte table epoxy	PDF
CBGA 255 motorola Abstract: 90Pb10Sn cte table epoxy BGA cte pbga package weight cte table epoxy substrate AN-1850 360-Pin Text: Freescale Semiconductor, Inc. Order Number: AN1850/D Rev. 0, 5/2000 Freescale Semiconductor, Inc. Semiconductor Products Sector Application Note Flip-Chip PBGA Package ConstructionÑ Assembly and Board-Level Reliability Motorola introduced the ßip-chip plastic ball grid array FC PBGA packages as an alternative to, and in	Original	AN1850/D CBGA 255 motorola 90Pb10Sn cte table epoxy BGA cte pbga package weight cte table epoxy substrate AN-1850 360-Pin	PDF
62Sn36Pb2Ag Abstract: 90Pb10Sn CBGA 255 motorola 480 PBGA pad recommendations Solder Balls 63Sn37Pb cte table epoxy substrate motorola pbga 302 Text: Freescale Semiconductor, Inc. Order Number: AN1850/D Rev. 0, 5/2000 Freescale Semiconductor, Inc. Freescale Semiconductor Application Note Flip-Chip PBGA Package ConstructionÑ Assembly and Board-Level Reliability Motorola introduced the ßip-chip plastic ball grid array FC PBGA packages as an alternative to, and in	Original	AN1850/D 62Sn36Pb2Ag 90Pb10Sn CBGA 255 motorola 480 PBGA pad recommendations Solder Balls 63Sn37Pb cte table epoxy substrate motorola pbga 302	PDF
Untitled Abstract: No abstract text available Text: Translucent Epoxy Encapsulating & Potting Compound 832C Technical Data Sheet 832C Description The 832C Translucent Epoxy Encapsulating and Potting Compound is an electric grade epoxy. It is simple to mix and easy to use. This two parts clear epoxy provides great insulation and protection value.	Original	193rd	PDF
Untitled Abstract: No abstract text available Text: TECHNICAL INFORMATION ASSEMBLY INDUCED DEFECTS by John Maxwell AVX Corporation Abstract: Surface mount technology holds many benefits but there is no room for sloppy practices; SMT assemblies need the control that semiconductor processing uses. Extreme care must be taken at	Original	S-AIND00M900-R	PDF
water jet cutting machine circuit Abstract: No abstract text available Text: TECHNICAL INFORMATION ASSEMBLY INDUCED DEFECTS by John Maxwell AVX Corporation Abstract: Surface mount technology holds many benefits but there is no room for sloppy practices; SMT assemblies need the control that semiconductor processing uses. Extreme care must be taken at	Original	com1496 S-AIND00M900-R water jet cutting machine circuit	PDF
transistor RJp 30 Abstract: AN1149 led signal lamp transistor RJp HPWT Text: application brief AB20 4 replaces AN1149 4 Thermal Management Considerations for SuperFlux LEDs Thermal management is critical in the design of LED signal lamps because temperature affects LED performance and reliability. The following section details the effects of temperature on	Original	AN1149 Sept2002) transistor RJp 30 led signal lamp transistor RJp HPWT	PDF

waveguide selective switch Abstract: quartz optical properties MSI nichrome resistor A1203 Thin Film Capacitors AI and Au wirebonding NICHROME wire 0.005 mm2 microwave circulators ATT Wireless Services coupler ATT coupler conductor Text: MIC Technology Vishay Electro-Films An Introduction To Substrate PIMICTM Passive Intergrated Micro-Electron Interconnect Circuitry Technology Thin film microwave integrated circuits have been evolving from a simple substrate medium which carries microwave/	Original	02-Dec-04 waveguide selective switch quartz optical properties MSI nichrome resistor A1203 Thin Film Capacitors AI and Au wirebonding NICHROME wire 0.005 mm2 microwave circulators ATT Wireless Services coupler ATT coupler conductor	PDF
FR4 epoxy dielectric constant 4.4 Abstract: FR4 substrate with dielectric constant 4.4 PCB Rogers RO4003 substrate FR4 substrate epoxy dielectric constant 4.4 FR4 substrate epoxy dielectric constant 4.6 ro4003 FR4 dielectric constant 4.3 FR4 4.9 dielectric constant FR4 dielectric constant 4.6 RO3003 Text: HF Transmission Introduction This document deals with HF Transmission issues in high-speed and broadband applications using Atmel ADCs and DACs. It stresses the hardware choices to be made to reach an optimum tradeoff between high-speed, broadband performances and system	Original	352A-BDC-10/03 FR4 epoxy dielectric constant 4.4 FR4 substrate with dielectric constant 4.4 PCB Rogers RO4003 substrate FR4 substrate epoxy dielectric constant 4.4 FR4 substrate epoxy dielectric constant 4.6 ro4003 FR4 dielectric constant 4.3 FR4 4.9 dielectric constant FR4 dielectric constant 4.6 RO3003	PDF
Vapor Phase Soldering tantalum capacitors Abstract: No abstract text available Text: TECHNICAL INFORMATION SURFACE MOUNT TANTALUM CAPACITOR APPLICATIONS INFORMATION by John Maxwell AVX Corporation Abstract: Surface mount tantalum capacitors, like all electronic components, impose restrictions on pad or land design and solder processing to	Original	t80-539-1501 S-SMTA00M301-R Vapor Phase Soldering tantalum capacitors	PDF
AVX Tantalum Electrolytic Capacitors Abstract: capacitor electrolytic BC lt 6249 Text: TECHNICAL INFORMATION VERY HIGH FREQUENCY SWITCH MODE POWER SUPPLY OUTPUT FILTER CAPACITOR CONSIDERATIONS AND MOUNTING LIMITATIONS by John Maxwell AVX Corporation Abstract: This paper discusses output filter capacitor electrical limitations and considerations when	Original	S-FMPS00M301-R AVX Tantalum Electrolytic Capacitors capacitor electrolytic BC lt 6249	PDF
Untitled Abstract: No abstract text available Text: TECHNICAL INFORMATION VERY HIGH FREQUENCY SWITCH MODE POWER SUPPLY OUTPUT FILTER CAPACITOR CONSIDERATIONS AND MOUNTING LIMITATIONS by John Maxwell AVX Corporation Abstract: This paper discusses output filter capacitor electrical limitations and considerations when	Original	S-FMPS00M301-R	PDF
Altera Flip Chip BGA warpage Abstract: cte table flip chip substrate 1806 footprint cte table epoxy substrate BGA cte cte table for epoxy adhesive and substrate with or without underfill bga warpage crack flip chip cte table epoxy Text: Reliability of Large Organic Flip-Chip Packages for Industrial Temperature Environments Anurag Bansal1, Yuan Li2, and Don Fritz2 1 Reliability Engineering Package Development Altera Corporation 101 Innovation Drive San Jose, CA 95134 abansal@altera.com 2 Abstract	Original		PDF
ah1 d Abstract: No abstract text available Text: P R E L I M I N A R Y Imaging CCD PT1109AAQ-711 Time Delay and Integration Sensor D A T A S H E E T Description The output tap works at a maximum data rate of 20 In the PerkinElmer PT1109AAQ MHz. Line scan rates reach Time Delay and Integration TDI 18.6 kHz. The sensor incorporates 4 vertical and 2	Original	PT1109AAQ-711 PT1109AAQ 4/2004W ah1 d	PDF
defect ppm Abstract: No abstract text available Text: TECHNICAL INFORMATION SURFACE MOUNT TANTALUM CAPACITOR APPLICATIONS INFORMATION by John Maxwell AVX Corporation Abstract: Surface mount tantalum capacitors, like all electronic components, impose restrictions on pad or land design and solder processing to	Original	S-SMTA00M301-R defect ppm	PDF
AUS308 Abstract: PSR4000 AUS308 HL832NX TAIYO PSR 4000 AUS308 dielectric TAIYO PSR 4000 AUS308 Thermal Conductivity PSR-4000 AUS-308 PSR4000 AUS308 thermal Text: March 21, 2007 CN 032107 Customer Notification CX2751x-12 Material Set Change Dear Valued Customer: This notification is for the CX27511-11, CX27512-12, CX27513-12, CX27514-12, CX27512G-14. Mindspeed’s turnkey supplier has sent notification that all their BGA products will be manufactured using	Original	CX2751x-12 CX27511-11, CX27512-12, CX27513-12, CX27514-12, CX27512G-14. CX2751x-12, CX2751xG-12, 2751x-PCN-001-A AUS308 PSR4000 AUS308 HL832NX TAIYO PSR 4000 AUS308 dielectric TAIYO PSR 4000 AUS308 Thermal Conductivity PSR-4000 AUS-308 PSR4000 AUS308 thermal	PDF
ceramic rework Abstract: CCGA BGA Solder Ball collapse 90Pb 10Sn solder paste 304-pin ltcc MPC105 MPC106 MPC107 BGA PROFILING spray nozzles Text: Ceramic Ball Grid Array Packaging, Assembly & Reliability Freescale Semiconductor 1 Outline for Discussion • • • • • • Why BGA? CBGA Introduction and Package Description PC Board Design for CBGA CBGA Assembly Rework Board-Level Solder Joint Reliability	Original	25x25x1 ceramic rework CCGA BGA Solder Ball collapse 90Pb 10Sn solder paste 304-pin ltcc MPC105 MPC106 MPC107 BGA PROFILING spray nozzles	PDF

CTE TABLE EPOXY SUBSTRATE Search Results

CTE TABLE EPOXY SUBSTRATE Result Highlights (4)

CTE TABLE EPOXY SUBSTRATE Datasheets Context Search

Maxwell PROCESS

mlc avx capacitors cte

Untitled

capacitor 47 nano

cte table

capacitors coefficient of thermal expansion

SM-05

cte table epoxy

CBGA 255 motorola

62Sn36Pb2Ag

Untitled

Untitled

water jet cutting machine circuit

transistor RJp 30

waveguide selective switch

FR4 epoxy dielectric constant 4.4

Vapor Phase Soldering tantalum capacitors

AVX Tantalum Electrolytic Capacitors

Untitled

Altera Flip Chip BGA warpage

ah1 d

defect ppm

AUS308

ceramic rework