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Abstract: No abstract text available
Text: DATE REV ECN APP'D. BY 9-16-05 01-26-06 AO 7275 TRM A1 7467 JM B B 4.612 [117.14] BOTTOM SURFACE OF JACK (PCB SURFACE) • -4.554 [115.67] MAX.- ( .148 [3.75] ) TO HIGHEST POINT OF BEAM W ° o NOTES: ( .014 [0.36] H -4.300 [109.22] ( .083 [2.12] ) —
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CT660210
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Abstract: No abstract text available
Text: DATE REV ECN APP'D. BY 9 -1 6 -0 5 AO 7275 TRM 0 1 -2 6 -0 6 A1 7467 JM B BOTTOM SURFACE OF JACK PCB SURFACE - - ( .148 [3.75] ) TO HIGHEST POINT OF BEAM ^ ¿ NOTES: ( .014 [0.36] H 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY
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PR022-01.
CT660210
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Untitled
Abstract: No abstract text available
Text: B DATE REV ECN APP'D. BY 9-16-05 AO 7275 TRM B 4.612 [117.14] BOTTOM SURFACE OF JACK (PCB SURFACE) • -4.554 [115.67] MAX.- ( .148 [3.75] ) TO HIGHEST POINT OF BEAM W ° o NOTES: ( .014 [0.36] H -4.300 [109.22] ( .083 [2.12] ) — TO HIGHEST POINT OF BEAM
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PR022-01.
CT660210
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Untitled
Abstract: No abstract text available
Text: *4.554 [115.67] MAX *4.612 [117.14] ’*.148 [3.75] 20 — | — I [— .550 [13.97] REF 1 n T jfr ^ .425 [10.79]- *0B3 [2.12] (9)— J_ mm |iiii|iin i i i i | ii ii llllj] INImir hui M il. liui INI. lllll 1UL lllll r-j 1 4 j ? 4 Cvj .275 [6.99]— „
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CT660210
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