Untitled
Abstract: No abstract text available
Text: DATE REV ECN APP'D. BY 2 -1 7 -0 6 A1 - - B h .125 [3.10] t . OID [Q.Z5] □ s ° 7+ 5+ # 1+' td Srsii « <ö ÍM î 40 JE 1 .125 [3.10] -— 1 B L .45a [11 .4 3 ] .65D [16.51] M A X — - NOTES: 1. CONNECTOR MATERIALS; HOUSING: THERMOPLASTIC UL94 V-0 CONTACTS:
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SS65100-019F
Z35-7512
CT650112F
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Untitled
Abstract: No abstract text available
Text: DATE 1 — REV ECN 1/23/06 A1 7454 JM 6/2 3/06 A2 7663 JM APP’D. BY .125 [3.18]±.010 [0.25] □ 1*0 o> a LO — .125 [3.18] - . 6 5 0 [16.51] M A X- NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V - 0 CONTACTS: COPPER ALLOY CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA
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PR026-01.
CT650112
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BY123
Abstract: CI 7454
Text: REV ECN APP’D. BY 1/23/06 A1 7454 JM 6/23/06 A2 7663 JM DATE 1 — .125 [3.18]±.010 [0.25] □ ? rO CM OS in B B r- CM CO \Z — .125 [3.18] .650 [16.51] MAX- NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS: COPPER ALLOY CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA
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PR026-01.
SS-650810-A-NF-K1
CT650112
BY123
CI 7454
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