Untitled
Abstract: No abstract text available
Text: DATE 01-27-05 REV ECN APP'D. BY AO - - i«c r-i ion +.020 [0.51 •1 25 [3 ' 18]-.010 [0.25; -.650 [16.51] MAX.- □ B .627 [15.93] MAX. B ES.125 [3.18] 2 - NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS: COPPER ALLOY CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA
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PR023-01
SS65100-032F
SS65100-031F
CT650040F
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Untitled
Abstract: No abstract text available
Text: 2 DATE 0 1 -2 7 -0 5 REV ECN APP'D. BY AO - - 1 -1 7 -0 6 A1 7435 JM 2 -1 2 -0 9 A2 8660 TA .125 [3.18] ±.010 [0.25] -.650 [16.51] MAX.- □ B .627 [15.93] MAX. .125 [3.18] 2 NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS: COPPER ALLOY
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PR026-01
SS6510
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031F
Abstract: No abstract text available
Text: DATE REV ECN AO - 1 -1 7 -0 6 A1 7435 JM 2 -1 2 -0 9 A2 8660 TA 0 1 -2 7 -0 5 APP’D. BY - .125 [3.18] ±.010 [0.25] -.650 [16.51] MAX.- □ B .627 [15.93] MAX. B IB .125 [3.18] 2 - NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0
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PR026-01
1E2-22-05
CT650040F
031F
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