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10118615-516002LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded vertical header ,Through Hole ,Single row , 16 Positions ,2.54mm (0.100in) Pitch. |
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131-5516-21D
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Amphenol Communications Solutions
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Paladin® 112Gb/s Backplane Connector, 5-Pair, 6 Column, Left Polarized, Backplane Module, 2.25mm Wipe, Nickel Sulfamate. |
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131-5516-21H
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Amphenol Communications Solutions
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Paladin® 112Gb/s Backplane Connector, 5-Pair, 6 Column, Left Polarized, Backplane Module, 2.25mm Wipe, APP. |
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69155-160
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Amphenol Communications Solutions
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Quickie Slimline Header, Through Hole, Double Row, 60 Positions, 2.54 mm (0.1 in.), Right Angle Header 0.76 um (30 u\\.) GXT™ Mating Plating |
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131-5516-11D
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Amphenol Communications Solutions
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Paladin® 112Gb/s Backplane Connector, 5-Pair, 6 Column, Left Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate. |
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50015-5160JLF
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Amphenol Communications Solutions
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High Pin Count, Backplane Connectors, Header, Vertical, Through Hole, 4 Row, 160 Positions, 0 Guide Pin, 2.54mm (0.100in) Pitch |
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