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    CSP80 Search Results

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    CSP80 Price and Stock

    ASSMANN WSW components GmbH

    ASSMANN WSW components GmbH A-MCSP-80020-R

    CABLE MOD 8P8C PLUG-PLUG 6.56'
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey A-MCSP-80020-R Bulk 405 1
    • 1 $4.59
    • 10 $3.898
    • 100 $3.3125
    • 1000 $2.81586
    • 10000 $2.63974
    		Buy Now

    ASSMANN WSW components GmbH A-MCSP-80010-R

    CABLE MOD 8P8C PLUG-PLUG 3.28'
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey A-MCSP-80010-R Bulk 385 1
    • 1 $3.64
    • 10 $3.091
    • 100 $2.627
    • 1000 $2.23306
    • 10000 $2.09338
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    Bristol Electronics A-MCSP-80010-R 20
    • 1 -
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    • 100 -
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    • 10000 -
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    ASSMANN WSW components GmbH A-MCSP-80010-B

    CABLE MOD 8P8C PLUG-PLUG 3.28'
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey A-MCSP-80010-B Bulk 373 1
    • 1 $3.91
    • 10 $3.321
    • 100 $2.8228
    • 1000 $2.39958
    • 10000 $2.24949
    		Buy Now

    ASSMANN WSW components GmbH A-MCSP-80010-Y

    CABLE MOD 8P8C PLUG-PLUG 3.28'
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey A-MCSP-80010-Y Bulk 365 1
    • 1 $3.64
    • 10 $3.091
    • 100 $2.627
    • 1000 $2.23306
    • 10000 $2.09338
    		Buy Now

    ASSMANN WSW components GmbH A-MCSP-80020-Y

    CABLE MOD 8P8C PLUG-PLUG 6.56'
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey A-MCSP-80020-Y Bulk 358 1
    • 1 $4.93
    • 10 $4.189
    • 100 $3.56
    • 1000 $3.02627
    • 10000 $2.837
    		Buy Now
    Find more CSP80 price and stock on Findchips.com

    CSP80 Datasheets (1)

    Part
    ECAD Model
    Manufacturer
    Description
    Curated
    Datasheet Type
    PDF
    CSP8-01
    		Richco Accessories, Hardware, Fasteners, Accessories, COLLAR SPACER PIN .436" Original PDF

    CSP80 Datasheets Context Search

    Catalog Datasheet
    Type
    Document Tags
    PDF

    CSI-3-135

    Abstract: INCOMING RAW MATERIAL INSPECTION procedure csp-1-122 4202 bd MAS-2-100 CSP-8-013 INCOMING RAW MATERIAL INSPECTION report
    Contextual Info: NATIONAL SEMICONDUCTOR CORPORATION QUALITY POLICY MANUAL SC CP-0008 REVISION BE PAGE 1 OF 12 THIS DOCUMENT IS UNCONTROLLED UNLESS IT IS PART OF A DCB/TOC OR IS VIEWED ONLINE


    Original     		CP-0008 9707201641CGAYSC CP-0008 CSI-3-135 INCOMING RAW MATERIAL INSPECTION procedure csp-1-122 4202 bd MAS-2-100 CSP-8-013 INCOMING RAW MATERIAL INSPECTION report PDF

    TAIYO PSR 4000

    Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
    Contextual Info: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).


    Original     		PDF

    CSP-4

    Abstract: CSR6-224-01 RMS 01 CSR8 CSR6-295-01 CSP6-01 csp8-01 csr8-394-01
    Contextual Info: PART NO. CSP4-01 CSP6-01 CSP8-01 "B" DIA. ±.010 [±0.25] .295 [7.5] .394 [10.0] .436 [11.0] "C" DIA. "D" REF. "E" REF. -.29 [7.3] .33 [8.3] -.12 [3.0] .14 [3.6] .10 [2.5] .20 [5.0] .22 [5.5] "B" "C" MOUNTING HOLE DIA. ±.003 [±0.08] RECOMMENDED SCREW SIZE


    Original     		CSP4-01 CSP6-01 CSP8-01 CSR4-224-01 CSR4-295-01 CSR4-394-01 CSR4-591-01 CSR4-787-01 CSR6-224-01 CSR6-295-01 CSP-4 CSR6-224-01 RMS 01 CSR8 CSR6-295-01 CSP6-01 csp8-01 csr8-394-01 PDF

    KL SN 102 94v0

    Abstract: ASTM d4066 ms3367 RBS 6601 Installation guide for RBS 6000 SHK 55-65 Scanbe ejector kit rbs 6501 cr40 steel 11633-1 SCANBE KL SN 102 94v
    Contextual Info: RI-55006 cat cover for pdf 8/5/02 9:48 AM Page 2 2002 NEW PRODUCTS DISTRIBUTOR LOCATIONS WORLDWIDE RICHCO USA Please call Customer Service 773 539-4060, Samples (800) 621-1892, or visit www.richcoinc.com for your nearest distributor location. EUROPE Alldistri Handelsges. m.b.H.


    Original     		RI-55006 3000-Rupea-Brasov SR-3230 OFS90 WIT-30AR PPR-10 KL SN 102 94v0 ASTM d4066 ms3367 RBS 6601 Installation guide for RBS 6000 SHK 55-65 Scanbe ejector kit rbs 6501 cr40 steel 11633-1 SCANBE KL SN 102 94v PDF

    TAIYO PSR 4000

    Abstract: manual PACE PSR 800 CCL-HL-832 fbga Substrate design guidelines JEDEC Kostat FBGA CCL-HL832 ablebond esec 3018 operation kostat bga 6mm x 6mm nitto hc100
    Contextual Info: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).


    Original     		PDF

    bd 4612

    Abstract: CSI-3-135
    Contextual Info: NATIONAL SEMICONDUCTOR CORPORATION QUALITY POLICY MANUAL SC CP-0008 REVISION BF PAGE 1 OF 12 THIS DOCUMENT IS UNCONTROLLED UNLESS IT IS PART OF A DCB/TOC OR IS VIEWED ONLINE


    Original     		CP-0008 9707201641CGAYSC throug16 bd 4612 CSI-3-135 PDF