PQFP chip size
Abstract: transistor ZR cqfp package outline FLATPACK ceramic package cerdip z PACKAGE J-Lead, plcc package on package chips
Text: The following is an index of Cypress Package Diagrams. Click on the appropriate package letter to view package diagrams under that description. TQFP PPGA BGA CerDIP CQFP CerSOJ CPGA WLCC PLCC CerPACK LCC PQFP SSOP PDIP QSOP W-LCC WPGA SOIC W-CerPACK CQFP SOJ
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CERAMIC QUAD FLATPACK CQFP
Abstract: No abstract text available
Text: Cypress Semiconductor Qualification Report QTP# 97061 VERSION 1.0 November, 1997 160-pins Ceramic Quad Flatpack CQFP Golden Altos Assembly Cypress Semiconductor Assembly: Golden Altos, USA Package: 160-pins CQFP QTP# 97304, V. 1.0 Page 2 of 4 August, 1997
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160-pins
160-pin
7C375DT-GAUMB
CERAMIC QUAD FLATPACK CQFP
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CERAMIC QUAD FLATPACK CQFP
Abstract: CQFP 240
Text: CQFP.FRM Page 1 Tuesday, February 9, 1999 4:20 PM CQFP Packaging Capabilities Surface Mount Description The Ceramic Quad Flatpack CQFP is a high-density package for high lead count surface mount applications. It has a higher lead count and smaller lead pitch than most
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GA98111PDF2/99
CERAMIC QUAD FLATPACK CQFP
CQFP 240
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CLCC68
Abstract: CQFP80 CDIP40 package cdip28 PLCC68 package ANSI Y14.5 cqfp package outline PLCC28 package CDIP24 CDIP28 package
Text: INTEGRATED CIRCUITS DATA SHEET PACKAGE INFORMATION Page Index - CDIP CLCC CQFP DBS DIP HDIP PLCC QFP SIL SO SSOP - Soldering - Package outlines Package information 1995 Oct 25 File under Integrated Circuits, IC18 Philips Semiconductors
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CDIP24
0586B
CDIP28
0589B
CDIP40
0590B
CLCC44
OT341-1
MO-150AH
CLCC68
CQFP80
CDIP40 package
cdip28
PLCC68 package
ANSI Y14.5
cqfp package outline
PLCC28 package
CDIP24
CDIP28 package
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Untitled
Abstract: No abstract text available
Text: Hermetic Packages for Integrated Circuits Package Outline Drawing R64.A 64 CERAMIC QUAD FLATPACK PACKAGE CQFP Rev 5, 10/13 1.118 (28.40) 1.080 (27.43) 0.567 (14.40) 0.547 (13.90) 0.290 (7.37) 0.255 (6.48) 64 0.025 (0.635) BSC 49 1 PIN 1 INDEX AREA 48 0.567 (14.40)
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Abstract: No abstract text available
Text: Hermetic Packages for Integrated Circuits Package Outline Drawing R48.B 48 CERAMIC QUAD FLATPACK PACKAGE CQFP WITH BOTTOM HEATSINK Rev 0, 10/12 1.118 (28.40) 1.080 (27.43) 0.572 (14.53) 0.555 (14.10) #1 #48 0.287 (7.29) 0.253 (6.43) 0.040 (1.016) BSC PIN 1
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Abstract: No abstract text available
Text: Hermetic Packages for Integrated Circuits Package Outline Drawing R48.A 48 CERAMIC QUAD FLATPACK PACKAGE CQFP Rev 3, 10/12 1.118 (28.40) 1.080 (27.43) 0.572 (14.53) 0.555 (14.10) #1 #48 0.287 (7.29) 0.253 (6.43) 0.040 (1.02) BSC PIN 1 INDEX AREA 0.572 (14.53)
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Untitled
Abstract: No abstract text available
Text: Hermetic Packages for Integrated Circuits Package Outline Drawing R64.C 64 CERAMIC QUAD FLATPACK PACKAGE CQFP WITH BOTTOM HEATSINK Rev 1, 10/13 1.118 (28.40) 1.080 (27.43) 0.567 (14.40) 0.547 (13.90) 0.290 (7.37) 0.255 (6.48) 64 0.025 (0.635) BSC 1 49 PIN 1
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Untitled
Abstract: No abstract text available
Text: The following is an index of Cypress Package Diagrams. Click on the appropriate package letter, to view package diagrams under that description. TQFP PPGA BGA CerDIP CQFP CerSOJ CPGA WLCC PLCC CerPACK LCC PQFP SSOP PDIP QSOP W-LCC WPGA RTSOP SOIC W-CerPACK
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Untitled
Abstract: No abstract text available
Text: Hermetic Packages for Integrated Circuits Package Outline Drawing R64.B 64 CERAMIC QUAD FLATPACK PACKAGE CQFP WITH E-PAD Rev 2, 10/13 1.118 (28.40) 1.080 (27.43) 0.567 (14.40) 0.547 (13.90) 0.290 (7.37) 0.255 (6.48) 49 64 0.025 (0.635) BSC 1 PIN 1 INDEX AREA
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cqfp package outline
Abstract: ceramic
Text: The following is an index of Cypress Package Diagrams. Click on the appropriate package letter to view package diagrams under that description. TQFP PPGA Mini-BGA BGA CerDIP CQFP CerSOJ CPGA WLCC PLCC CerPACK LCC PQFP SSOP PDIP QSOP W-LCC WPGA SOIC W-CerPACK
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Abstract: No abstract text available
Text: MAIN INDEX GO TO WEB The following is an index of Cypress Package Diagrams. Click on the appropriate package letter to view package diagrams under that description. TQFP PPGA Mini-BGA Thin BGA BGA CerDIP CQFP CerSOJ CPGA WLCC PLCC CerPACK LCC PQFP SSOP PDIP
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footprint jedec MS-026 TQFP
Abstract: JEDEC MS-026 footprint qfp 64 0.5 mm pitch land pattern fine BGA thermal profile schematic impulse sealer HQ208 PQ100 land pattern QFP 208 PQ208 TQ100
Text: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or
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schematic impulse sealer
Abstract: leadframe C7025 MO-151-BAR PG223-XC4013E XC4010E-PQ208 BGA 31 x 31 mm footprint jedec MS-026 TQFP 128 footprint jedec mo-067 XC4013E-PQ240 EIA standards 481
Text: Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or
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FG860
FG900
FG1156
schematic impulse sealer
leadframe C7025
MO-151-BAR
PG223-XC4013E
XC4010E-PQ208
BGA 31 x 31 mm
footprint jedec MS-026 TQFP 128
footprint jedec mo-067
XC4013E-PQ240
EIA standards 481
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schematic impulse sealer
Abstract: XC4010E-PQ208 JEDEC Package Code MS-026-AED XC4013E-PQ240 JEDEC MS-026 footprint MS-026-ACB footprint jedec MS-026 TQFP 128 XC4013E-BG225 PG299-XC4025E bav 21 diode
Text: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or
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schematic impulse sealer
Abstract: qfp 64 0.4 mm pitch land pattern Rotron pk100 power supply XC4013E-PQ240 EFTEC-64 XC4010E-PQ208 MO-151-AAN-1 PK100 land pattern for TSOP 2 86 PIN
Text: Packages and Thermal Characteristics: High-Reliability Products R 0 5 PK100 v1.0 June 15, 2000 Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or 0.100").
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PK100
060ROM
schematic impulse sealer
qfp 64 0.4 mm pitch land pattern
Rotron
pk100 power supply
XC4013E-PQ240
EFTEC-64
XC4010E-PQ208
MO-151-AAN-1
PK100
land pattern for TSOP 2 86 PIN
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footprint jedec MS-026 TQFP 128
Abstract: schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228
Text: 08 001-022_pkg.fm Page 1 Tuesday, March 14, 2000 2:15 PM Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or
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FG860
FG900
FG1156
footprint jedec MS-026 TQFP 128
schematic impulse sealer
footprint jedec MS-026 TQFP
TSOP 86 land pattern
BAV 235
BGA and QFP Package
xc4010e-pq208
leadframe C7025
QFP PACKAGE thermal resistance
CB228
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RTAX2000S
Abstract: RTAX2000 CQ256 2-CQFP RTAX2000S-CQ352 SK-AX1-CQ352-KITBTM SK-AX250-CQ352RTFG484S RTAX2000S-CQ256
Text: Application Note AC274 CQFP to FBGA Adapter Sockets Table of Contents Introduction . . . . . . . . . . . . . . . . . . . . . . . . CQFP to FBGA Adapter Sockets . . . . . . . . . . . . . CQFP to FBGA Adapter Socket Assembly Procedure . . CQ352 to FG484 23x23 Adapter Socket Outline Drawing
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23x23
FG896
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RTAX2000S
RTAX2000
2-CQFP
RTAX2000S-CQ352
SK-AX1-CQ352-KITBTM
SK-AX250-CQ352RTFG484S
RTAX2000S-CQ256
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AX2000-CQ256
Abstract: RTAX2000S-CQ352
Text: Application Note AC274 CQFP to FBGA Adapter Sockets Table of Contents Introduction . . . . . . . . . . . . . . . . . . . . . . . . CQFP to FBGA Adapter Sockets . . . . . . . . . . . . . CQFP to FBGA Adapter Socket Assembly Procedure . . CQ352 to FG484 23x23 Adapter Socket Outline Drawing
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CQ352
FG484
23x23
FG896
CQ256
AX2000-CQ256
RTAX2000S-CQ352
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TEA 1732
Abstract: A09 N03
Text: 1.6 PowerPC 603e Microprocessor Pinout Listings The following sections provide the pinout listings for the 603e CQFP and BGA packages. 1.6.1 Pinout Listing for the CQFP Package Table 10 provides the pinout listing for the 603e CQFP package. Table 10. Pinout Listing for the 240-pin CQFP Package
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240-pin
888888P
1234567I
TEA 1732
A09 N03
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Untitled
Abstract: No abstract text available
Text: GLOSSARY OF PACKAGING ABBREVIATIONS CLCC Ceramic Leaded Chip Carrier. Solder sealed, mul tilayer ceramic. COB Chip on Board. CQFP Glass sealed Ceramic Quad Flat Pack with gull wing leads. Also called CERQUAD or CQUAD. CQUAD Same as CQFP. DPAK Small power transistor package for surface mount.
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O-220)
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Untitled
Abstract: No abstract text available
Text: 1. 6 Pow erPC 603e M icroprocessor Pinout Listings The following sections contain the pinout listings for the 603e CQFP and CBGA packages. 1.6.1 P i n o u t L is tin g for th e C Q F P P a c k a g e Table 10 provides the pinout listing for the 603e CQFP package.
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240-pin
PID6-603e
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8N07
Abstract: 030 b03 cn/A/U 237 BG
Text: 1. 6 Pow erPC 603e M icroprocessor Pinout Listings The following sections provide the pinout listings for the 603e CQFP and BGA packages. 1.6.1 P i n o u t L i s t i n g for t h e C Q F P P a c k a g e Table 10 provides the pinout listing for the 603e CQFP package.
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240-pin
PID7v-603e
8N07
030 b03
cn/A/U 237 BG
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2 010 073 007
Abstract: cqfp package outline CERAMIC QUAD FLATPACK CQFP CQFP 172 PIN
Text: AMI A M I S E M IC O N D U C T O R %s CQFP Packaging Capabilities Description Surface Mount The ceramic Quad Flatpack CQFP is a high-density package for high lead count surface mount applications. It has a higher leaad count and smaller lead pitch than most other ceramic packages. It has been provided in a
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