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Catalog Datasheet	MFG & Type	PDF	Document Tags
CMO5V0LC Abstract: No abstract text available Text: PROCESS CPZ40X Transient Voltage Suppressor 5 Volt TVS Chip PROCESS DETAILS Die Size 13.4 x 13.4 MILS Die Thickness 5.5 MILS Cathode Bonding Pad Area 3.9 x 6.7 MILS Top Side Metalization Al - 30,000Å Back Side Metalization Au - 9,000Å GEOMETRY GROSS DIE PER 5 INCH WAFER	Original	PDF	CPZ40X CMO5V0LC

Catalog Datasheet

MFG & Type

PDF

Document Tags

CMO5V0LC

Abstract: No abstract text available
Text: PROCESS CPZ40X Transient Voltage Suppressor 5 Volt TVS Chip PROCESS DETAILS Die Size 13.4 x 13.4 MILS Die Thickness 5.5 MILS Cathode Bonding Pad Area 3.9 x 6.7 MILS Top Side Metalization Al - 30,000Å Back Side Metalization Au - 9,000Å GEOMETRY GROSS DIE PER 5 INCH WAFER

Original

PDF

CPZ40X CMO5V0LC