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Catalog Datasheet	MFG & Type	PDF	Document Tags
CMNTVS5V0 Abstract: No abstract text available Text: PROCESS CPZ39R Transient Voltage Suppressor 5 Volt Quad TVS Chip PROCESS DETAILS Die Size 11 x 11 MILS Die Thickness 3.94 MILS Cathode Bonding Pad Areas 4 3.54 MILS DIAMETER EACH Top Side Metalization Al - 30,000Å Back Side Metalization Au - 9,000Å GEOMETRY	Original	PDF	CPZ39R 22-January CMNTVS5V0

Catalog Datasheet

MFG & Type

PDF

Document Tags

CMNTVS5V0

Abstract: No abstract text available
Text: PROCESS CPZ39R Transient Voltage Suppressor 5 Volt Quad TVS Chip PROCESS DETAILS Die Size 11 x 11 MILS Die Thickness 3.94 MILS Cathode Bonding Pad Areas 4 3.54 MILS DIAMETER EACH Top Side Metalization Al - 30,000Å Back Side Metalization Au - 9,000Å GEOMETRY

Original

PDF

CPZ39R 22-January CMNTVS5V0