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    CPGA PACKAGE DESIGN Search Results

    CPGA PACKAGE DESIGN Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    CPGA PACKAGE DESIGN Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    CPGA

    Abstract: amkor "ceramic frit" CPGA Package design
    Text: data sheet CERAMIC / HERMETIC CPGA Ceramic Pin Grid Array Package CPGA Amkor Technology is committed to continuing to service this long established standard industry package. This thru-hole package consists of a co-fired ceramic base that has a matrix of pins


    Original     		PDF DS805 CPGA amkor "ceramic frit" CPGA Package design

    Untitled

    Abstract: No abstract text available
    Text: Nomenclature Guide HMU/HMA Types H MU 16 J C - PREFIX FAMILY MU: Multiplier MA: Multiplier/ Accumulator DEVICE TYPE 16, 17, 510 PACKAGE DESIGNATOR J: Plastic Leaded Chip Carrier PLCC G: Ceramic Pin Grid Array (CPGA) 1 35 /883 HIGH RELIABILITY DESIGNATOR


    Original     		PDF MIL-STD-883, 1-888-INTERSIL

    oki cross

    Abstract: CERAMIC LEADLESS CHIP CARRIER CLCC
    Text: Nomenclature Guide 80C, 82CXXX Types M D TEMPERATURE RANGE C: 0°C to +70°C I: -40°C to +85°C M: -55°C to +125°C PACKAGE DESIGNATOR P: Dual-In-Line Plastic PDIP D: Ceramic Dual-In-Line Frit-Seal (CERDIP) or Ceramic Dual-In-Line Metal Seal (SBDIP) G: Ceramic Pin Grid Array (CPGA)


    Original     		PDF 82CXXX 80CXXX: 82CXXX: 80C86 10MHz 12MHz oki cross CERAMIC LEADLESS CHIP CARRIER CLCC

    Untitled

    Abstract: No abstract text available
    Text: MECHANICAL DATA MCPG023 – OCTOBER 1997 GB S-CPGA-P68 CERAMIC PIN GRID ARRAY PACKAGE 0.970 (24,63) 0.950 (24,13) 0.536 (13,61) 0.800 (20,32) TYP 0.524 (13,31) J H G F E D C B A 1 2 3 4 5 6 7 8 9 0.088 (2,23) 0.072 (1,83) 0.100 (2,54) 0.194 (4,98) 0.166 (4,16)


    Original     		PDF MCPG023 S-CPGA-P68) 4040114-14/C 76ocal

    Untitled

    Abstract: No abstract text available
    Text: MECHANICAL DATA MCPG013E – JUNE 1997 GF S-CPGA-P325 CERAMIC PIN GRID ARRAY PACKAGE 1.717 (43,61) TYP 1.683 (42,75) 1.879 (47,73) SQ 1.841 (46,76) 0.100 (2,54) AR AN AL AJ AG AE AC AA W U R N L J G E C A 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35


    Original     		PDF MCPG013E S-CPGA-P325)

    MO-067-AC

    Abstract: CMGA15-PN
    Text: MECHANICAL DATA MCPG003A – JANUARY 1997 GA-GB S-CPGA-P11 X 11 CERAMIC PIN GRID ARRAY PACKAGE A or A1 SQ 1.000 (25,40) TYP L K J H G F E D C B A 1 B or B1 C or C1 0.050 (1,27) DIA 4 Places 0.022 (0,55) 0.016 (0,41) 0.140 (3,56) 0.120 (3,05) 0.100 (2,54)


    Original     		PDF MCPG003A S-CPGA-P11 4040114ocal MO-067-AC CMGA15-PN

    CMGA15-PN

    Abstract: No abstract text available
    Text: MECHANICAL DATA MCPG003A – OCTOBER 1996 GA-GB S-CPGA-P11 X 11 CERAMIC PIN GRID ARRAY PACKAGE A or A1 SQ 1.000 (25,40) TYP L K J H G F E D C B A 1 B or B1 C or C1 0.050 (1,27) DIA 4 Places 0.022 (0,55) 0.016 (0,41) 0.140 (3,56) 0.120 (3,05) 0.100 (2,54)


    Original     		PDF MCPG003A S-CPGA-P11 4040114ocal CMGA15-PN

    067-AB

    Abstract: No abstract text available
    Text: MECHANICAL DATA MCPG002 – OCTOBER 1994 GA-GB S-CPGA-P10 X 10 CERAMIC PIN GRID ARRAY PACKAGE A or A1 SQ 0.900 (22,86) TYP K J H G F E D C B A 1 DIM 0.100 (2,54) B or B1 C or C1 0.050 (1,27) DIA 4 Places 0.022 (0,55) 0.016 (0,41) 0.140 (3,56) 0.120 (3,05)


    Original     		PDF MCPG002 S-CPGA-P10 067-AB

    Untitled

    Abstract: No abstract text available
    Text: MECHANICAL DATA MCPG002A – JANUARY 1997 GA-GB S-CPGA-P10 X 10 CERAMIC PIN GRID ARRAY PACKAGE A or A1 SQ 0.900 (22,86) TYP K J H G F E D C B A 1 DIM 0.100 (2,54) B or B1 C or C1 0.050 (1,27) DIA 4 Places 0.022 (0,55) 0.016 (0,41) 0.140 (3,56) 0.120 (3,05)


    Original     		PDF MCPG002A S-CPGA-P10

    Untitled

    Abstract: No abstract text available
    Text: MECHANICAL DATA MCPG004A – JANUARY 1997 GA-GB S-CPGA-P12 X 12 CERAMIC PIN GRID ARRAY PACKAGE A or A1 SQ 1.100 (27,94) TYP M L K J H G F E D C B A 1 2 3 DIM B or B1 4 5 6 7 8 9 10 11 12 MIN MAX Notes A 1.240 (31,50) 1.280 (32,51) Large Outline A1 1.180 (29,97)


    Original     		PDF MCPG004A S-CPGA-P12

    Untitled

    Abstract: No abstract text available
    Text: MECHANICAL DATA MCPG001A – JANUARY 1997 GA-GB S-CPGA-P9 X 9 CERAMIC PIN GRID ARRAY PACKAGE A or A1 SQ 0.800 (20,32) TYP J H G F E D C B A 1 2 DIM 0.100 (2,54) 0.050 (1,27) DIA 4 Places 0.016 (0,41) 4 MIN 5 6 7 8 9 MAX A 0.940 (23,88) 0.980 (24,89) A1 0.880 (22,35)


    Original     		PDF MCPG001A

    MCPG001

    Abstract: MCPG001 datasheet
    Text: MECHANICAL DATA MCPG001 – OCTOBER 1994 GA-GB S-CPGA-P9 X 9 CERAMIC PIN GRID ARRAY PACKAGE A or A1 SQ 0.800 (20,32) TYP J H G F E D C B A 1 2 DIM 0.100 (2,54) 0.050 (1,27) DIA 4 Places 0.016 (0,41) 4 MIN 5 6 7 8 9 MAX A 0.940 (23,88) 0.980 (24,89) A1 0.880 (22,35)


    Original     		PDF MCPG001 MCPG001 MCPG001 datasheet

    Untitled

    Abstract: No abstract text available
    Text: MECHANICAL DATA MCPG015A – SEPTEMBER 1996 GFA S-CPGA-P141 CERAMIC PIN GRID ARRAY PACKAGE 1.080 (27,43) SQ 1.040 (26,42) 0.900 (22,86) TYP 0.100 (2,54) TYP 0.050 (1,27) TYP W V U T R P N M L K J H G F E D C B A 2 1 0.026 (0,66) 0.006 (0,15) 4 3 6 5 8 7


    Original     		PDF MCPG015A S-CPGA-P141) 4040133/D MO-128

    p181 gb

    Abstract: P181
    Text: MECHANICAL DATA MCPG014 – OCTOBER 1995 GB S-CPGA-P181 CERAMIC PIN GRID ARRAY PACKAGE 1.590 (40,40) SQ 1.148 (37,60) 1.400 (35,56) TYP 0.100 (2,54) TYP R P N M L K J H G F E D C B A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 0.185 (4,70) 0.140 (3,55) 0.055 (1,40)


    Original     		PDF MCPG014 S-CPGA-P181) 4073426/A p181 gb P181

    ceramic pin grid array package

    Abstract: No abstract text available
    Text: MECHANICAL DATA MCPG021A – JUNE 1997 GF S-CPGA-P305 CERAMIC PIN GRID ARRAY PACKAGE 1.717 (43,61) TYP 1.683 (42,75) 1.879 (47,73) SQ 1.841 (46,76) 0.100 (2,54) AR AN AL AJ AG AE AC AA W U R N L J G E C A 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35


    Original     		PDF MCPG021A S-CPGA-P305) 4040035-3/E ceramic pin grid array package

    texas instruments 1148

    Abstract: No abstract text available
    Text: MECHANICAL DATA MCPG020 – NOVEMBER 1995 GE S-CPGA-P181 CERAMIC PIN GRID ARRAY PACKAGE 1.590 (40,40) SQ 1.148 (37,60) 1.400 (35,56) TYP 0.100 (2,54) TYP R P N M L K J H G F E D C B A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 0.185 (4,70) 0.140 (3,55) 0.060 (1,52)


    Original     		PDF MCPG020 S-CPGA-P181) 4073425/A texas instruments 1148

    CPGA large cavity

    Abstract: No abstract text available
    Text: MECHANICAL DATA MCPG004 – OCTOBER 1994 GA-GB S-CPGA-P12 X 12 CERAMIC PIN GRID ARRAY PACKAGE A or A1 SQ 1.100 (27,94) TYP M L K J H G F E D C B A 1 2 3 DIM B or B1 4 5 6 7 8 9 10 11 12 MIN MAX Notes A 1.240 (31,50) 1.280 (32,51) Large Outline A1 1.180 (29,97)


    Original     		PDF MCPG004 S-CPGA-P12 CPGA large cavity

    Untitled

    Abstract: No abstract text available
    Text: MECHANICAL DATA MCPG006A – JANUARY 1997 GA-GB S-CPGA-P14 X 14 CERAMIC PIN GRID ARRAY PACKAGE A or A1 SQ 1.300 (33,02) TYP P N M L K J H G F E D C B A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 DIM MIN MAX Notes Large Outline Small Outline Cavity Up Cavity Down Cavity


    Original     		PDF MCPG006A S-CPGA-P14

    Untitled

    Abstract: No abstract text available
    Text: MECHANICAL DATA MCPG018 – NOVEMBER 1995 GH S-CPGA-P296 CERAMIC PIN GRID ARRAY PACKAGE 1.805 (45,85) TYP 1.795 (45,59) 0.100 (2,54) TYP 1.965 (49,91) SQ 1.935 (49,15) 0.050 (1,27) TYP AN AL AJ AG AE AC AA Y W U S Q N L J G E C A 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37


    Original     		PDF MCPG018 S-CPGA-P296) 4073429/A

    CMGA23

    Abstract: No abstract text available
    Text: MECHANICAL DATA MCPG011A – JANUARY 1997 GA-GB S-CPGA-P19 X 19 CERAMIC PIN GRID ARRAY PACKAGE A or A1 SQ 1.800 (45,72) TYP W V U T R P N M L K J H G F E D C B A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 DIM B or B1 MIN MAX Notes A 1.940 (49,28) 1.980 (50,29)


    Original     		PDF MCPG011A S-CPGA-P19 CMGA23

    Untitled

    Abstract: No abstract text available
    Text: MECHANICAL DATA MCPG010A – JANUARY 1997 GA-GB S-CPGA-P18 X 18 CERAMIC PIN GRID ARRAY PACKAGE A or A1 SQ 1.700 (43,18) TYP V U T R P N M L K J H G F E D C B A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 DIM B or B1 C or C1 0.140 (3,56) 0.120 (3,05) 0.050 (1,27) DIA


    Original     		PDF MCPG010A S-CPGA-P18

    CMGA17

    Abstract: No abstract text available
    Text: MECHANICAL DATA MCPG005A – JANUARY 1997 GA-GB S-CPGA-P13 X 13 CERAMIC PIN GRID ARRAY PACKAGE A or A1 SQ 1.200 (30,48) TYP N M L K J H G F E D C B A 1 2 3 4 5 6 7 8 9 10 11 12 13 DIM B or B1 C or C1 0.050 (1,27) DIA 4 Places 0.022 (0,55) 0.016 (0,41) 0.140 (3,56)


    Original     		PDF MCPG005A S-CPGA-P13 CMGA17

    Untitled

    Abstract: No abstract text available
    Text: MECHANICAL DATA MCPG007A – SEPTEMBER 1996 GA-GB S-CPGA-P15 X 15 CERAMIC PIN GRID ARRAY PACKAGE A or A1 SQ 1.400 (35,56) TYP R P N M L K J H G F E D C B A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 DIM MIN MAX A 1.540 (39,12) 1.590 (40,38) Large Outline A1 1.480 (37,59)


    Original     		PDF MCPG007A S-CPGA-P15 40ocal

    CPGA

    Abstract: cpga dimensions
    Text: %s AM I A M I SE M IC O N D U C TO R CPGA Packaging Capabilities Description Through Hole The Ceramic Pin Grid Array CPGA is a through-hoie mount package for high density packaging with very high pin counts. The lead design also makes it compatible with socket insertion mounting. The CPGAs are also designed


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