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Catalog Datasheet	MFG & Type	PDF	Document Tags
CMLT7820G Abstract: CMPT7820 CXT7820 Text: PROCESS CP782X Small Signal Transistor PNP - Low VCE SAT Transistor Chip PROCESS DETAILS Die Size 26 x 26 MILS Die Thickness 5.9 MILS Base Bonding Pad Area 5.5 x 5.5 MILS Emitter Bonding Pad Area 5.5 x 5.5 MILS Top Side Metalization Al - 30,000Å Back Side Metalization	Original	PDF	CP782X CMLT7820G CMPT7820 CXT7820 CMLT7820G CMPT7820 CXT7820

Catalog Datasheet

MFG & Type

PDF

Document Tags

CMLT7820G

Abstract: CMPT7820 CXT7820
Text: PROCESS CP782X Small Signal Transistor PNP - Low VCE SAT Transistor Chip PROCESS DETAILS Die Size 26 x 26 MILS Die Thickness 5.9 MILS Base Bonding Pad Area 5.5 x 5.5 MILS Emitter Bonding Pad Area 5.5 x 5.5 MILS Top Side Metalization Al - 30,000Å Back Side Metalization

Original

PDF

CP782X CMLT7820G CMPT7820 CXT7820 CMLT7820G CMPT7820 CXT7820