ACTEL CCGA 624 mechanical
Abstract: CCGA ACTEL CCGA 1152 mechanical CG1152 pogo pin cleaning CGS624 a440 ceramic actel package mechanical drawing RTAX2000 90Pb 10Sn solder paste
Text: Application Note AC190 Ceramic Column Grid Array Introduction Ceramic Column Grid Array CCGA packages are becoming increasingly popular as an alternative to Ceramic Ball Grid Array (CBGA) packages for applications requiring very high-density interconnections
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AC190
624-pin
CG624)
CG1152)
1272-pin
ACTEL CCGA 624 mechanical
CCGA
ACTEL CCGA 1152 mechanical
CG1152
pogo pin cleaning
CGS624
a440 ceramic
actel package mechanical drawing
RTAX2000
90Pb 10Sn solder paste
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408-1379
Abstract: AMP catalog 82003 komax 433 nas 7103 KOMAX 333 operating instructions komax 200277-2 201355-1 201692-4 21393
Text: RoHS Ready M Series Pin and Socket Connectors AMP M Series Pin and Socket Connectors NOTE: All part numbers are RoHS Compliant M Series Connectors Product Facts • Most connectors intermateable with connectors made to MIL-C-28748 requirements Standard Housings
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MIL-C-28748
wire42
408-1379
AMP catalog 82003
komax 433
nas 7103
KOMAX 333
operating instructions komax
200277-2
201355-1
201692-4
21393
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Untitled
Abstract: No abstract text available
Text: AXR 7 ULTRA LOW-PROFILE RECEPTACLE OF 2.9 mm I/O CONNECTORS FOR PORTABLE EQUIPMENT FEATURES 1. Ultra low-profile receptacle of 2.9 mm 2. Plug construction which accepts any direction (topside up or upside down) for mounting receptacles onto the boards Since the lock is released in the sideways
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AXR61154
Abstract: No abstract text available
Text: AXR 6 I/O BACK CONNECTORS FOR PC CARD I/O CONNECTORS FOR PC CARD FEATURES APPLICATIONS 1. Receptacle is only 2.9 mm 2. Bellows-type contacts Bellows-type contacts resist mating stress and offer high contact reliability. PC CARD, PDA etc. Contact The bellows type contacts are fabricated
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134 kHz RFID
Abstract: db9f connector M513 MASY-007028-000100 MASY-007028-0001TB MASY-007028-0001TR MASY-007028-SW01TB
Text: MASY-007028-000100 Synthesizer, SMT for RFID Covering all UHF Bands Rev. V2 Features • • • • • • • • • Description Fully Integrated VCO, PLL, Loop Filter Includes TCXO with <10 PPM Stability Low Phase Noise High Performance, Low Cost Covers US, European and Japanese RFID Bands
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MASY-007028-000100
134 kHz RFID
db9f connector
M513
MASY-007028-000100
MASY-007028-0001TB
MASY-007028-0001TR
MASY-007028-SW01TB
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Pb95Sn5
Abstract: pcb warpage in ipc standard ROSIN FLUX TYPE ROL0 EIA-746 IPC-6012A MAXIM Assembly Locations OF CODE underfill dispense needle FR4 substrate height and thickness DS2761X J-STD-004 sn63pb37
Text: Maxim > App Notes > GENERAL ENGINEERING TOPICS PROTOTYPING AND PC BOARD LAYOUT Keywords: Wafer Level Package, WLP, Flip Chip, Flip-Chip, CSP, Chip Scale Package, PCB Assembly, PCBA, Die Product, Silicon Circuit, Silicon Die Circuit Oct 18, 2004 APPLICATION NOTE 3377
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DS2411:
DS2415:
DS2417:
DS2432:
DS2433:
DS2502:
DS2760:
DS2761:
DS2762:
DS9503:
Pb95Sn5
pcb warpage in ipc standard
ROSIN FLUX TYPE ROL0
EIA-746
IPC-6012A
MAXIM Assembly Locations OF CODE
underfill dispense needle
FR4 substrate height and thickness
DS2761X
J-STD-004 sn63pb37
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Untitled
Abstract: No abstract text available
Text: AXR6.fm 87 ページ ２００３年１２月２２日 月曜日 午後１２時２分 AXR 6 I/O BACK CONNECTORS FOR PC CARD I/O CONNECTORS FOR PC CARD FEATURES APPLICATIONS 1. Receptacle is only 2.9 mm 2. Bellows-type contacts Bellows-type contacts resist mating
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pcb warpage in ipc standard
Abstract: Intel reflow soldering profile BGA a5764 "BGA Rework Practices", corner relief carrier tape Intel reflow soldering profile BGA LEAD FREE bga 196 land pattern fine line bga thermal cycling reliability JEDEC bga 63 tray fine BGA thermal profile
Text: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)
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Intel reflow soldering profile BGA
Abstract: A5832 JEDEC bga 63 tray Intel BGA cte table epoxy substrate BGA PROFILING A4470-01 Lead Free reflow soldering profile BGA land pattern BGA 196 a5764
Text: Ball Grid Array BGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads) packages are many. Having no leads to bend, the PBGA has greatly reduced coplanarity problems
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JIS C 0806
Abstract: CONNECTOR BACK SHELL AXR61154 AXR62151 AXR62156 HP4338B
Text: AXR 6 I/O CONNECTORS FOR PC CARD FEATURES 1. Receptacle is only 2.9 mm 2. Bellows-type contacts Bellows-type contacts resist mating stress and offer high contact reliability. Contact The bellows type contacts are fabricated by bending thin sheet metal. They offer
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Abstract: No abstract text available
Text: Discontinued products I/O CONNECTORS FOR PC CARD FEATURES 1. Receptacle is only 2.9 mm 2. Bellows-type contacts Bellows-type contacts resist mating stress and offer high contact reliability. Contact The bellows type contacts are fabricated by bending thin sheet metal. They offer
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PBGA 256 reflow profile
Abstract: bga 196 land pattern Intel reflow soldering profile BGA BGA PACKAGE TOP MARK intel BGA PACKAGE thermal profile A5825-01 BGA and QFP Package BGA OUTLINE DRAWING bga Shipping Trays land pattern BGA 0.75
Text: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)
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WLCSP smt
Abstract: EIA-481-D-2008 Cu OSP and Cu SOP qfn tray pocket size 5 x 6 SUF1577-15 WLCSP stencil design without underfill SAC396 cte table flip chip substrate SAC 2.3 Ag bump composition
Text: AN69061 Design, Manufacturing, and Handling Guidelines for Cypress Wafer-Level Chip Scale Packages WLCSP Author: Wynces Silvoza, Bo Chang Associated Project: No Associated Part Family: All Cypress WLCSP products Software Version: None Associated Application Notes: None
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AN69061
AN69061
WLCSP smt
EIA-481-D-2008
Cu OSP and Cu SOP
qfn tray pocket size 5 x 6
SUF1577-15
WLCSP stencil design
without underfill
SAC396
cte table flip chip substrate
SAC 2.3 Ag bump composition
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Ablebond 8380
Abstract: smema DA6523 nozzle heater X3304 Theta-JC 5th mechnical engineering date sheet alpha Resistors slide cut template DRAWING Die Attach epoxy stamping
Text: 2 12 Advanced Package Applications: Tape Carrier Package 1/17/97 9:18 AM CH12WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 12 ADVANCED PACKAGE APPLICATIONS: TAPE CARRIER PACKAGE 12.1. INTRODUCTION TO THE PACKAGE TECHNOLOGY As semiconductor devices become more complex, they are being introduced into products that
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CH12WIP
Ablebond 8380
smema
DA6523
nozzle heater
X3304
Theta-JC
5th mechnical engineering date sheet
alpha Resistors slide
cut template DRAWING
Die Attach epoxy stamping
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Ablebond 8380
Abstract: X3304 ablestik ablebond Ablestik 8380 A5700 shoulder angle foot length lead solder joint reliability smema control IPC-SM-780 tms 3615 A5716
Text: Advanced Package Applications: Tape Carrier Package 12.1 12 Introduction To The Package Technology As semiconductor devices become more complex they are being introduced into products that cover the spectrum of the marketplace. Portability of computing and information management is
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ANSI/J-STD-001,
Ablebond 8380
X3304
ablestik ablebond
Ablestik 8380
A5700
shoulder angle foot length lead solder joint reliability
smema control
IPC-SM-780
tms 3615
A5716
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Ablebond 8380
Abstract: A5700 Ablestik 8380 smema nozzle heater shoulder angle foot length lead solder joint reliability tms 3615 A5716 A5707-01 alpha Resistors slide
Text: 12 Tape Carrier Package 12.1 Introduction To The Package Technology As semiconductor devices become more complex they are being introduced into products that cover the spectrum of the marketplace. Portability of computing and information management is driving the reduction in size from desktop to laptop to notebook to palm top sized products. These
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axc8
Abstract: sharp EIA 577 sharp color tv schematic diagram AXP 209 IC 945 mercury MOTHERBOARD CIRCUIT diagram 13001 s 8d semiconductors cross index schematic WELDER semiconductors cross reference axa dvd SMD MARKING CODE p4S
Text: Group Catalog Connectors 2008-2009 Narrow-pitch connectors I/O connectors Interface connectors Sockets for memory card Connectors for industrial equipment IC sockets Group Catalog Connectors 2008-2009 These materials are printed on ECF pulp. These materials are printed with earth-friendly vegetable-based soybean oil ink.
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AKCT1B91E
200709-8YT
axc8
sharp EIA 577 sharp color tv schematic diagram
AXP 209 IC
945 mercury MOTHERBOARD CIRCUIT diagram
13001 s 8d
semiconductors cross index
schematic WELDER
semiconductors cross reference
axa dvd
SMD MARKING CODE p4S
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30f 124 equivalent
Abstract: MC14513 C04-026 binary bcd conversion logic diagram CAZ MARKING C04022 R1C390
Text: TC7135 4-1/2 Digit A/D Converter Features General Description • • • • • • • • The TC7135 4-1/2 digit A/D Converter ADC offers 50 ppm (1 part in 20,000) resolution with a maximum nonlinearity error of 1 count. An auto-zero cycle reduces zero error to below 10 µV and zero drift to
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TC7135
TC7135
D-85737
NL-5152
DS21460C-page
30f 124 equivalent
MC14513
C04-026
binary bcd conversion logic diagram
CAZ MARKING
C04022
R1C390
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Untitled
Abstract: No abstract text available
Text: High Power Resistive Products Resistors and Terminations: Engineering Guidelines DESIGN, MEASUREMENT AND PERFORMANCE As the wireless revolution extends component requirements upward in frequency, higher in operating power, and smaller in size, performance demands on resistive devices grow ever
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MTT-33,
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APA2613
Abstract: No abstract text available
Text: APA2613 6W Stereo Class-D Audio Power Amplifier Features • • General Description Supply Voltage is 8V ~ 26V The APA2613 is a stereo, high efficiency, Class-D audio Class D operation eliminates heat sink & reduce power supply requirement amplifier available in TSSOP-28Pand QFN4x4-28A pins
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APA2613
APA2613
TSSOP-28Pand
QFN4x4-28A
JESD-22,
MIL-STD-883-3015
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APA2614
Abstract: No abstract text available
Text: APA2614 15W Stereo Class-D Audio Power Amplifier Features • • General Description Supply Voltage is 8V ~ 26V The APA2614 is a stereo, high efficiency, Class-D audio Class D operation eliminates heat sink & reduce power supply requirement amplifier available in TSSOP-28Pand QFN4x4-28 pins
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APA2614
APA2614
TSSOP-28Pand
QFN4x4-28
JESD-22,
MIL-STD-883-3015
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APA2613A
Abstract: No abstract text available
Text: APA2613A 8W Stereo Class-D Audio Power Amplifier Features • • General Description Supply Voltage is 8V ~ 26V The APA2613A is a stereo, high efficiency, Class-D audio Class D operation eliminates heat sink & reduce power supply requirement amplifier available in TSSOP-28Pand QFN4x4-28A pins
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APA2613A
APA2613A
TSSOP-28Pand
QFN4x4-28A
JESD-22,
MIL-STD-883-3015
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fr108
Abstract: Ever Ohms chip resistor
Text: AT C H I G H P O W E R R E S I S T I V E P R O D U C T S ATC Resistors and Terminations: Engineering Guidelines Design, Measurement and Performance Structures, Implementations, and Configurations . . . . . . . . . . . . . . . . . . . . .36 Specs and Specmanship . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37
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84-WA/HT-110.
MTT-33,
fr108
Ever Ohms chip resistor
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HUGHES mcw 550
Abstract: hughes welder welder hughes mcw 550 ECCOBOND 56c SN62PRMAB3 relative permittivity beryllium copper ferrite welder ECCOBOND 300 kester Re SOLDER PASTE mcw-550
Text: Ferrodisc and Drop-In* Devices Overview Ferrodisc and Drop-In circulators and isolators manufactured by M/A-COM are ex tremely well suited for all types of microwave integrated circuits MIC’s . The rapidly growing awareness and utilization of these devices in microwave systems of all
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