Untitled
Abstract: No abstract text available
Text: Soft Shell Pin and Socket Connectors AMP Power Double Lock PDL Connectors (Wire-to-Board and Wire-to-Wire) (Continued) Contacts and Product Composition Contacts Material and Finish Pre-tinned copper alloy High Density Receptacle for Plug Housing, Tab for Cap Housing
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Untitled
Abstract: No abstract text available
Text: HM79-103R3LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Ferrite Core 2 COIL Polyurethane Enamelled Copper Wire 3 SOLDER Lead Free Solder Element Composition CAS No Material Mass Composition g (g) Iron Oxide Copper Oxide
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HM79-103R3LF
HM79-20220LF
HM79-60331LF
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608501-1
Abstract: copal TYCO ELECTRONICS splice kits splice 40820 copalum tubing
Text: 408-2049-36 COPALUM* Splices Pressure Type Wire Connectors 07 MAY 08 Pressure Type Wire Connectors Use Tool 933150-1 or 68068-6 PART NO. ALL SOLID WIRE SIZE SIZE RANGE COLOR CODE Copper (CU) 10 14 Aluminum 1 - - 1 and 2 - - - LENGTH 12 ALL SOLID WIRE SIZE
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VDE 0812 S
Abstract: DIN 47100 DIN47100 CEAM cavi 50265-2-1 RAL7032 ceam RAL-7032 LIYCY liycy 8
Text: CAVI PER ELETTRONICA ED INFORMATICA - SERIE Li-YCY ELECTRONICS AND COMPUTER CABLES - Li-YCY SERIES MULTICOPPIE SCHERMATE - SHIELDED MULTIPAIR CABLES POSA FISSA - FIXED INSTALLATION COMPOSIZIONE - COMPOSITION conduttori / conductors rame nudo, flessibile / flexible bare copper wire
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DIN47100
G0307R00
VDE 0812 S
DIN 47100
CEAM cavi
50265-2-1
RAL7032
ceam
RAL-7032
LIYCY
liycy 8
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Untitled
Abstract: No abstract text available
Text: HM53-208R0VLF summary material content, BI Technologies Corporation Index Item Material Name TOROID CORE Iron Powder 2 COIL Polyurethane Enamelled Copper Magnet Wire 3 SOLDER Lead Free Solder 1 Element Composition CAS No Fe Resin Coating Lubricant Polyester
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HM53-208R0VLF
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Untitled
Abstract: No abstract text available
Text: HM53-001R6VLF summary material content, BI Technologies Corporation Index Item Material Name TOROID CORE Iron Powder 2 COIL Polyurethane Enamelled Copper Magnet Wire 3 SOLDER Lead Free Solder 1 Element Composition CAS No Fe Resin Coating Lubricant Polyester
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HM53-001R6VLF
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Untitled
Abstract: No abstract text available
Text: HM53-101R6VLF summary material content, BI Technologies Corporation Index Item Material Name TOROID CORE Iron Powder 2 COIL Polyurethane Enamelled Copper Magnet Wire 3 SOLDER Lead Free Solder 1 Element Composition CAS No Fe Resin Coating Lubricant Polyester
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HM53-101R6VLF
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Untitled
Abstract: No abstract text available
Text: HM79S-63470LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Ferrite Core 2 COIL Polyurethane Enamelled Copper Wire SOLDER Lead Free Solder 3 4 ADHESIVE Epoxy Resin Element Composition CAS No Material Mass Composition
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HM79S-63470LF
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Untitled
Abstract: No abstract text available
Text: HM78-10150LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Ferrite Core 2 COIL Polyurethane Enamelled Copper Wire 3 SOLDER Lead Free Solder 4 ADHESIVE Epoxy Resin Element Composition CAS No Material Mass Composition g
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HM78-10150LF
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MC9S08SH8/4
Abstract: No abstract text available
Text: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See
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EB806:
MC9S08SH8/4
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Untitled
Abstract: No abstract text available
Text: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See
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EB806:
MC9S08GT16A
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MC9S08SH8/4
Abstract: MC9S08JM60 c code example
Text: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See
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EB806:
MC9S08SH8/4
MC9S08JM60 c code example
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MC9S08SH8/4
Abstract: No abstract text available
Text: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See
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EB806:
MC9S08SH8/4
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Untitled
Abstract: No abstract text available
Text: HM53-30150HLF summary material content, BI Technologies Corporation Index Item Material Name TOROID CORE Iron Powder 2 COIL Polyurethane Enamelled Copper Magnet Wire 3 SOLDER Lead Free Solder 1 4 ADHESIVE Epoxy Resin Element Composition CAS No Fe Resin Coating
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HM53-30150HLF
0200hane
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Untitled
Abstract: No abstract text available
Text: HM56-10100R15LF summary material content, BI Technologies Corporation Index Item Material Name FS2 1 CORE M25 2 3 4 5 ADHESIVE Epoxy Resin COIL Enamelled Copper Magnet Wire SOLDER TAPE Lead Free Solder Tape # 1H860 Element Composition Iron Oxide Nickel Oxide
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HM56-10100R15LF
1H860
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Untitled
Abstract: No abstract text available
Text: HM53-60130HLF summary material content, BI Technologies Corporation Index Item Material Name TOROID CORE Iron Powder 2 COIL Polyurethane Enamelled Copper Magnet Wire 3 SOLDER Lead Free Solder 1 4 ADHESIVE Epoxy Resin Element Composition CAS No Fe Resin Coating
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HM53-60130HLF
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Untitled
Abstract: No abstract text available
Text: HM53-40360HLF summary material content, BI Technologies Corporation Index Item Material Name TOROID CORE Iron Powder 2 COIL Polyurethane Enamelled Copper Magnet Wire 3 SOLDER Lead Free Solder 1 4 ADHESIVE Epoxy Resin Element Composition CAS No Fe Resin Coating
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HM53-40360HLF
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Untitled
Abstract: No abstract text available
Text: HM54-44R42VLF summary material content, BI Technologies Corporation Index Item Material Name Element Composition CAS No Material Mass mg Composition (mg) 7439-89-6 - 1730 1712.7 10.38 6.92 1 CORE Toroid Core Iron Binder Lubricant 2 WIRE NY UEW-H Copper Polyurethane (PU)
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HM54-44R42VLF
HM54-50R60VLF
HM54-60R86VLF
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Untitled
Abstract: No abstract text available
Text: HM100-251R0LF summary material content, BI Technologies Corporation Index Item Material Name E CORE Iron Powder I CORE Iron Powder 1 2 3 4 ADHESIVE COIL SOLDER Epoxy Resin Enamelled Copper Wire Lead Free Solder Element Composition CAS No Fe2O3 MnO ZnO Others
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HM100-251R0LF
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Untitled
Abstract: No abstract text available
Text: POWER TYPE RESISTORS TECHNOLOGY OF TOMORROW CERAMIC STRUCTURE ANTI SURGE HIGH VOLTAGE PCF 1 2 3 4 5 6 Metal oxide composition Silver edge Steel caps Cu, Sn plated Solder plated copper wire Welding joint Silicon overcoating IDENTIFICATION PRODUCT CODE COATING COLOR
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D-25578
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Untitled
Abstract: No abstract text available
Text: HM88-10091R0LF summary material content, BI Technologies Corporation Index Item Material Name E CORE Iron Powder I CORE Iron Powder 1 2 ADHESIVE Epoxy Resin 3 COIL Enamelled Copper Wire 4 5 SOLDER DUMMY Lead Free Solder Dummy Lead Element Composition CAS No
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HM88-10091R0LF
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yellow led 5mm
Abstract: red led red led 5mm CD43
Text: mVEREXr OPTIONAL ACCESSORIES - CATHODE & GATE LEAD KITS -• 11.80 . L .O ,L U S / / / / / * V / / / / / A YELLOW LEAD I I I (RED LEAD) 1. WIRE COMPOSITION: AWG 2 2 , TINNED COPPER STRANDED WIRE WITH ETEF INSULATION RATED TO 125’ C. 2. LEAD COLORS:
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CD42-CD47
10A0115
yellow led 5mm
red led
red led 5mm
CD43
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Untitled
Abstract: No abstract text available
Text: RSDF FLAME PROOF CARBON POWER RESISTOR TYPE INTRODUCTION Small size, high power, excellent pulse characteristics CARBON COMPOSITION SUBSTITUTE 1 SOLDER PLATED COPPER LEAD WIRE (2) FINE CARBON FILM WITHSTANDING PULSE VOLTAGE (3) NON-FLAMMABLE INSULATING SILICON COATING
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Untitled
Abstract: No abstract text available
Text: Lead Information Types: The following paragraphs correlate the terms with the actual lead composition and application. Oxygen free leads are copper wire normally coated with a 60% tin 40% lead composition. The primary function of the coating is to prevent oxidation of the
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