Untitled
Abstract: No abstract text available
Text: 1 2 3 No Heatsink L 2.0 oz. Copper
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Sanyo Denki dc fan 109P4412H8016
Abstract: 109X4412H6016 109P4405H8016 109p4412h8016 109X6512H1196 109P5405H8016 Sanyo Denki dc fan 109X7612H1106 109P5405H2016 109P5412H2016
Text: CPU Active Heatsinks SANYO DENKI San Ace MC Brushless DC Motor with Plastic Fan Housing and Impeller with 100% Copper, Aluminium/Copper Hybrid or 100% Aluminium Heatsink Permanently Lubricated Dual Ball Bearing System Current Limiting System with Reverse Polarity Protection
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PGA478
109P4405H9016
109P4412H9016
109P4405H9216
109P4412H9216
109P4405H9416
109P4412H9416
Sanyo Denki dc fan 109P4412H8016
109X4412H6016
109P4405H8016
109p4412h8016
109X6512H1196
109P5405H8016
Sanyo Denki dc fan
109X7612H1106
109P5405H2016
109P5412H2016
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Untitled
Abstract: No abstract text available
Text: TGH Series Specifications Material Heat Sink: Nickel-plated copper Contacts: Nickel-plated copper Substrate: Al203 96% Molding Compound: High-performance epoxy, compliant to UL94-V0 Terminal Nuts: American standard 303 stainless steel 0.473" ±0.008 (12.0mm ±0.2)
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Al203
UL94-V0
250ppm
000Vrms/80
TGHHV1R00JE
1-866-9-OHMITE
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TGHHVR100JE
Abstract: No abstract text available
Text: TGH Series Specifications Material Heat Sink: Nickel-plated copper Contacts: Nickel-plated copper Substrate: Al203 96% Molding Compound: High-performance epoxy, compliant to UL94-V0 Terminal Nuts: American standard 303 stainless steel 0.473" ±0.008 (12.0mm ±0.2)
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Al203
UL94-V0
OT227Package
1-866-9-OHMITE
TGHHVR100JE
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Untitled
Abstract: No abstract text available
Text: TGH Series Specifications Material Heat Sink: Nickel-plated copper Contacts: Nickel-plated copper Substrate: Al203 96% Molding Compound: High-performance epoxy, compliant to UL94-V0 Terminal Nuts: American standard 303 stainless steel 120 and 200 Watt SOT227Package
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Al203
UL94-V0
250ppm
000Vrms/80
1-866-9-OHMITE
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Untitled
Abstract: No abstract text available
Text: MCMA200P1600SA tentative Thyristor Module T = Phase leg Part number Backside: isolated 1 Features / Advantages: Thyristor for line frequency Planar passivated chip Long-term stability Copper base plate with Direct Copper Bonded Al2O3-ceramic Spring contacts for solder-free dirver connection
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MCMA200P1600SA
60747and
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Untitled
Abstract: No abstract text available
Text: MCMA200PD1600SA tentative Thyristor Module T = Phase leg Part number Backside: isolated 1 Features / Advantages: Thyristor for line frequency Planar passivated chip Long-term stability Copper base plate with Direct Copper Bonded Al2O3-ceramic Spring contacts for solder-free dirver connection
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MCMA200PD1600SA
60747and
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LM2596T
Abstract: No abstract text available
Text: Component Side L Heatsink COUT + Copper side LM2596T pin 1 D1 CIN REGULATED OUTPUT VOLTAGE + ON/OFF - Ground DC INPUT VOLTAGE + +
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LM2596T
LM2596T
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LM2596T
Abstract: LM2596
Text: Copper side Component Side L REGULATED OUTPUT VOLTAGE + + COUT ON/OFF - LM2596T Ground pin 1 D1 Heatsink CIN + DC INPUT VOLTAGE +
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LM2596T
LM2596T
LM2596
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RGMII to MII
Abstract: BCM5461S BCM5248 BCM5646 BCM5248 100 fbga Broadcom 5461 BCM5404 RGMII to SGMII BCM5461
Text: BCM5461S 10/100/1000BASE-T GIGABIT COPPER TRANSCEIVER SUMMARY OF BENEFITS FEATURES • Fully-integrated 10BASE-T/100BASE-TX/1000BASE-T Gigabit Ethernet transceiver • GMII, RGMII, SGMII, SerDes, RTBI and MII MAC Interface options • Line-side copper and fiber interfaces
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BCM5461S
10/100/1000BASE-T
10BASE-T/100BASE-TX/1000BASE-T
5461-PB06-R
RGMII to MII
BCM5461S
BCM5248
BCM5646
BCM5248 100 fbga
Broadcom 5461
BCM5404
RGMII to SGMII
BCM5461
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LM2596T
Abstract: No abstract text available
Text: Copper side Component Side L Cff + R2 REGULATED OUTPUT VOLTAGE + COUT ON/OFF - R1 LM2596T Ground pin 1 D1 Heatsink CIN + DC INPUT VOLTAGE +
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LM2596T
LM2596T
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LM2596T
Abstract: LM2596
Text: L Heatsink Component Side Cff R1 COUT + Copper side R2 LM2596T pin 1 D1 CIN REGULATED OUTPUT VOLTAGE + ON/OFF - Ground DC INPUT VOLTAGE + +
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LM2596T
LM2596T
LM2596
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Untitled
Abstract: No abstract text available
Text: DCB Module Technology Based on new technologies IXYS is using a patented method which allows bonding of thick copper circuit-board conductors directly on both sides to ceramic aluminium oxide Al20 3 or aluminium nitride (AIN) materials. This DCB (Direct-Copper-Bonding) technology is the basis for
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JFM38
Abstract: hx 740
Text: Intel Ethernet Controller I210 Datasheet LAN Access Division LAD Features: • • • • • • • • Small package: 9 x 9 mm PCIe v2.1 (2.5 GT/s) x1, with Switching Voltage Regulator (iSVR) Integrated Non-Volatile Memory (iNVM) Three single port SKUs: SerDes, Copper, Copper IT
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ECMA-393
JFM38
hx 740
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Untitled
Abstract: No abstract text available
Text: Intel Ethernet Controller I210 Datasheet Networking Division ND Features: • • • • • • • • Small package: 9 x 9 mm PCIe v2.1 (2.5 GT/s) x1, with Switching Voltage Regulator (iSVR) Integrated Non-Volatile Memory (iNVM) Three single port SKUs: SerDes, Copper, Copper IT
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ECMA-393
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BCM5464S
Abstract: BCM569
Text: BCM5464S PRODUCT Brief QUAD-PORT GIGABIT COPPER TRANSCEIVER WITH COPPER/FIBER MEDIA INTERFACE B C M 5 4 6 4 S S U M M A R Y F E AT U R E S Four fully integrated 10BASE-T/100BASE-TX/ • 1000BASE-T Gigabit Ethernet transceivers RGMII, SGMII and SerDes MAC interface
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BCM5464S
1000BASE-T
10BASE-T/100BASE-TX/
5464S-PB01-R-7
BCM5464S
BCM569
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RUJ 17 33
Abstract: 3145
Text: AMI A M I S E M IC O N D U C T O R %s PQ2 Packaging Capabilities . . Description Surface Mount The Power Quad II is a molded plastic quad flatpack with improved thermal performance. The Power Quad II isconstruced using a copper lead frame which is directly attached to a copper heat slug. The heat slup increases the thermal
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TOP3 package
Abstract: TO220 HEATSINK Heatsinks TO220 HEATSINK DATASHEET Heatsinks TO247 to247 package 0747 FCH020WT SFV019NA DMC018D
Text: HEATSINKS & MOUNTINGS HEATSINKS DPAK package SMH008D A range of high quality heatsinks from Calinar offering excellent thermal performance but at lower cost. Finish is black anodised throughout unless otherwise stated. A compact surface mount copper heatsink, with
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SMH008D
SVB030WT
SVT030AC
CLIP-03
SVT030TL
PG/0747
TOP3 package
TO220 HEATSINK
Heatsinks
TO220 HEATSINK DATASHEET
Heatsinks TO247
to247 package
0747
FCH020WT
SFV019NA
DMC018D
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Untitled
Abstract: No abstract text available
Text: BetaTHERM Sensors Custom and Standard Instrumentation Probes Style: H080 Economical Tinned Copper Surface Mount "Ring Tongue" Terminal Probe: Applications: ¥ Instrumentation heatsink temperatures. ¥ Over-temperature protection in power supplies and other heat sensitive equipment and instruments.
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AC53a
Abstract: RJT3A23D25 AC51 RJT3A23D20 RJT3A60D20 RJT3A60D25 of relay Anti-Parallel Thyristor 1L13L25L3
Text: Solid State Relays 3 Independently Switched Poles Integrated heatsink Type RJT3A - Trio • 3 in 1 semiconductor contactor • Three control inputs - three independently switched poles • Direct copper bonding DCB technology • LED indication for each pole
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3x25AAC,
600VAC
1200Vp
AC53a
RJT3A23D25
AC51
RJT3A23D20
RJT3A60D20
RJT3A60D25
of relay
Anti-Parallel Thyristor
1L13L25L3
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RJ1A60D50U
Abstract: RJ1A60D45E RJ1A23A45E RJ1A23A45U RJ1A23D45E RJ1A23D45U RJ1A23D50E RJ1A23D50U RJ1A60A45E RJ1A60A45U
Text: Solid State Relays SOLITRON MIDI - With Integrated Heatsink Types RJ1A, RJ1B • AC semiconductor contactor • Zero switching RJ1A or instant-on switching (RJ1B) • Direct copper bonding (DCB) technology • LED-indication • Cage clamp output terminals
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VAC/24-48VDC
AWG20)
AWG12)
AWG14)
RJ1A60D50U
RJ1A60D45E
RJ1A23A45E
RJ1A23A45U
RJ1A23D45E
RJ1A23D45U
RJ1A23D50E
RJ1A23D50U
RJ1A60A45E
RJ1A60A45U
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RJ1A60A50U
Abstract: RJ145 RJ1A60A50E RJ1A60A50EP RJ1A60D45E RJ1A69D45U RJ1A23 RJ1A60D50U RJ1A23D50E RJ1A60A45E
Text: Solid State Relays SOLITRON MIDI - With Integrated Heatsink Types RJ1A, RJ1B • AC semiconductor contactor • Zero switching RJ1A or instant-on switching (RJ1B) • Direct copper bonding (DCB) technology • LED-indication • Cage clamp output terminals
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VAC/24-48VDC
AWG20)
AWG12)
AWG14)
RJ1A60A50U
RJ145
RJ1A60A50E
RJ1A60A50EP
RJ1A60D45E
RJ1A69D45U
RJ1A23
RJ1A60D50U
RJ1A23D50E
RJ1A60A45E
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2 Wavelength Laser Diode
Abstract: CT15-975 CT15-915 SPT-110 10 watt laser diode
Text: Product Summary Pump Semiconductor Laser Chip on CT Heatsink CT15-915 CT15-975 The Copper/Tungsten CT Features Semiconductor Lasers are a compact, ▲ Economical and easily integrated ▲ High brightness source ▲ Includes bypass (protection) diode ▲
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CT15-915
CT15-975
270PSSPT-01
SPT-110
2 Wavelength Laser Diode
CT15-975
CT15-915
SPT-110
10 watt laser diode
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varistor 103 2kv
Abstract: No abstract text available
Text: Solid State Relays SOLITRON MIDI - With Integrated Heatsink Types RJ1A, RJ1B • AC semiconductor contactor • Zero switching RJ1A or instant-on switching (RJ1B) • Direct copper bonding (DCB) technology • LED-indication • Cage clamp output terminals
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VAC/24-48VDC
UL508
S202-B25
S201-B25
S201-B32
230/400V
varistor 103 2kv
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