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    COOKSON GROUP Search Results

    COOKSON GROUP Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    SF-NDYYYF0001-001M_Group Amphenol Cables on Demand Amphenol SF-NDYYYF0001-001M 1m (3.3') 400GbE QSFP-DD Cable - Amphenol 400-Gigabit Ethernet Passive Copper QSFP Double Density Cable (Dual Entry 30 AWG) - QSFP-DD to QSFP-DD Datasheet
    SF-QSFP4SFPPS-005_Group Amphenol Cables on Demand Amphenol SF-QSFP4SFPPS-005_Group 5m QSFP to 4 SFP+ Splitter Cable (26 AWG Passive Copper) - 1 x QSFP+ (40G) to 4 x SFP+ (10G) Connectors (16.4 ft) Datasheet
    RTK7EKA4M1S00001BU Renesas Electronics Corporation Evaluation Kit for RA4M1 MCU Group Visit Renesas Electronics Corporation
    RTK7EKA4W1S00000BJ Renesas Electronics Corporation Evaluation Kit for RA4W1 MCU Group Visit Renesas Electronics Corporation
    RTK7EKA4M2S00001BE Renesas Electronics Corporation Evaluation Kit for RA4M2 MCU Group Visit Renesas Electronics Corporation

    COOKSON GROUP Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    elmwood sensors ltd

    Abstract: elmwood thermal switch saft rectifier ABB sensycon SICK OPTEX elmwood sensors Oscillatek abb entrelec relays Litton Electron Devices microwave tubes Anzac Electronics
    Text: S OURCE ESB’ S Last Two Years of M ANUFACTURER N AME C HANGES Specifying and buying parts is hard enough without constant name changes due to manufacturing mergers, acquisitions and company spin-offs. Historically, each regional Electronics Source Book has diligently tracked these changes to save you time and headaches. We're happy to provide this


    Original     		BMIC/Ele03 elmwood sensors ltd elmwood thermal switch saft rectifier ABB sensycon SICK OPTEX elmwood sensors Oscillatek abb entrelec relays Litton Electron Devices microwave tubes Anzac Electronics PDF

    CU-106A

    Abstract: 0.4mm pitch BGA IPC-6012A beagleboard 0.4mm pitch BGA routing IPC-6012 IPC-D-317 NAND FLASH LGA reflow profile CU-106A shelf life CBB Capacitor Selection Guide
    Text: Application Report SPRAAV1B – May 2009 PCB Design Guidelines for 0.4mm Package-On-Package PoP Packages, Part I Keith Gutierrez and Gerald Coley . ABSTRACT


    Original     		PDF

    Solder bar of Senju M705

    Abstract: senju M31 GRN360 Senju senju m31 JESD Senju 7100 reflow profile 16QN50T23030 JESD 51-7, ambient measurement qfn 32 land pattern Senju paste 7100
    Text: Application Report SCBA017D – February 2004 Quad Flatpack No-Lead Logic Packages Frank Mortan and Lance Wright SLL Package Development ABSTRACT Texas Instruments TI Quad Flatpack No-lead (QFN) 14/16/20-terminal Pb-free plastic packages meet dimensions specified in JEDEC standard MO-241, allow for board miniaturization, and hold


    Original     		SCBA017D 14/16/20-terminal MO-241, Solder bar of Senju M705 senju M31 GRN360 Senju senju m31 JESD Senju 7100 reflow profile 16QN50T23030 JESD 51-7, ambient measurement qfn 32 land pattern Senju paste 7100 PDF

    k639

    Abstract: Cookson Group solder paste SAC305 alpha metal SAC405 10084 SAC305
    Text: Small Form- Factor Pluggable SFP DWDM (Dense Wavelength Division Multiplexer) Connector and Cage Assembly NOTE i Application Specification 114- 13178 06 JUL 09 Rev D All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters. Unless


    Original     		PDF

    minimum wipe length engagement

    Abstract: 108-046 press fit connector Cookson Group Kester 953 Flux 2P-24S-2P
    Text: Application Specification 114- 13038 MULTI- BEAM XL* Connectors 13 JUL 09 Rev H All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters [and inches]. Unless otherwise specified, dimensions have a tolerance of +0.13 [+.005] and angles have a tolerance of +2_.


    Original     		PDF

    minimum wipe length engagement

    Abstract: H087 Cookson Group Alpha 611 RMA msds Kester 953 Flux press-fit connector removal tool 108-046
    Text: Application Specification 114-13251 MULTI-BEAM XLE* Connectors 10 JUN 09 Rev B All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters [and inches]. Unless otherwise specified, dimensions have a tolerance of +0.13 [+.005] and angles have a tolerance of +2 .


    Original     		PDF

    solder paste SAC305 alpha metal

    Abstract: SFP CAGE 114-13120 SAC405 kester 5778 cage loncoterge A438 EIA-364-52 K638
    Text: Small Form- Factor Pluggable SFP and SFP+ Surface Mount PT Connectors and Cage Assemblies NOTE i Application Specification 114- 13120 13 JUL 09 Rev C All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters. Unless


    Original     		PDF

    Lead-Free

    Abstract: SZZA037A smema wiring smema specifications DAY20 1600X
    Text: Application Report SZZA037A - February 2003 Whisker Evaluation of Tin-Plated Logic Component Leads Douglas W. Romm, Donald C. Abbott, Stu Grenney, and Muhammad Khan Logic Packaging ABSTRACT Integrated circuits ICs with matte tin (Sn) finished leads for logic products were tested for


    Original     		SZZA037A Lead-Free smema wiring smema specifications DAY20 1600X PDF

    Untitled

    Abstract: No abstract text available
    Text: Programmable Multi Channel PMIC for Tablet PCs IDTP9165 Advanced Datasheet Features Description • Operates from a 2.7V to 5.25V supply • Five programmable, current-mode, step-down converters - Dynamic voltage scaling 12.5mV steps - Automatic PWM/PFM transition at light load


    Original     		IDTP9165 200mA, 160mA PDF

    SAC405

    Abstract: GRM155R71C104KA01 SARA-G340 SARA-G300 SARA-U260
    Text: SARA-G3 and SARA-U2 series GSM/GPRS and GSM/EGPRS/HSPA Cellular Modules System Integration Manual Abstract This document describes the features and the system integration of the SARA-G3 series GSM/GPRS cellular modules and the SARA-U2 GSM/EGPRS/HSPA cellular modules.


    Original     		UBX-13000995 SAC405 GRM155R71C104KA01 SARA-G340 SARA-G300 SARA-U260 PDF

    GTS FC-22

    Abstract: passive Infrared-Sensor IC 566 function generator an 503 hall sensor model railway signal project IR Beacon BWF 237 maa 502 BP 109 ir sensor datasheet ofdm modulator ic
    Text: IEEE Standards IEEE Std 802.15.4 -2003 802.15.4 TM IEEE Standard for Information technology— Telecommunications and information exchange between systems— Local and metropolitan area networks— Specific requirements Part 15.4: Wireless Medium Access


    Original     		4TM-2003 SH95127 SS95127 GL-36. GTS FC-22 passive Infrared-Sensor IC 566 function generator an 503 hall sensor model railway signal project IR Beacon BWF 237 maa 502 BP 109 ir sensor datasheet ofdm modulator ic PDF