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    Text: Document226-1 xDSLFilterModules By using C o ilc ra ft’s tig h t-to le ra n c e chip inductors m ounted on a S IP package, th ese filter m odules offer superior p erfo rm ance while occupying a fraction of the space of conventional designs. T h e y offer significant


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    PDF Document226-1 COLCS00607 LCVDSL250 LCVDSL251