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Abstract: No abstract text available
Text: REVISION K DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] NOTES: 1. C REPRESENTS A CRITICAL DIMENSION. 2. PARTS SHALL BE ROHS COMPLIANT. 3. PARTS TO BE PACKAGED IN TRAYS. LESS THAN FULL TRAY QUANTITIES ARE TO BE PACKAGED ON BLUE COHESIVE FOAM DO NOT SCALE FROM
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Pmsm matlab with DSP and CCS
Abstract: 3 phase ac motor control with ccs pid controller matlab source code pmsm matlab source code F28335 with MATLAB controlstick F28027 control card F28027 Pmsm matlab adaptive pid controller of dc motor using pic
Text: controlSUITE software Comprehensive. Intuitive. Optimized. Real-world software for real-time control. 2 controlSUITE™ software controlSUITE™ software Comprehensive. Intuitive. Optimized. Real-world software for real-time control. controlSUITE for C2000™ microcontrollers is a cohesive software suite designed to minimize software development time.
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C2000TM
C2000
B010208
SPRB199
Pmsm matlab with DSP and CCS
3 phase ac motor control with ccs
pid controller matlab source code
pmsm matlab source code
F28335 with MATLAB
controlstick
F28027 control card
F28027
Pmsm matlab
adaptive pid controller of dc motor using pic
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Abstract: No abstract text available
Text: REVISION K DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] NOTES: 1. C REPRESENTS A CRITICAL DIMENSION. 2. PARTS SHALL BE ROHS COMPLIANT. 3. PARTS TO BE PACKAGED IN TRAYS. LESS THAN FULL TRAY QUANTITIES ARE TO BE PACKAGED ON BLUE COHESIVE FOAM DO NOT SCALE FROM
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Untitled
Abstract: No abstract text available
Text: REVISION P DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] NOTES: 1. C REPRESENTS A CRITICAL DIMENSION. 2. PARTS SHALL BE ROHS COMPLIANT. 3. PARTS TO BE PACKAGED IN TRAYS. LESS THAN FULL TRAY QUANTITIES ARE TO BE PACKAGED ON BLUE COHESIVE FOAM DO NOT SCALE FROM
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HDMI-19-01-X-TH-PF-L)
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dlna Schematic
Abstract: NAS 7825 hd DVR soc 862-NAS7825-AABCF
Text: NAS 7825, Next Generation Multi-functional Networked Storage Solution Key Benefits The Evolution of the Consumer Market Unique Trident architecture including dual-core ARM 11 MP each core running at 750 MHz, application specific hardware engines for networking, storage,
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862-NAS7825-AABCF
NAS7825-AABCF
dlna Schematic
NAS 7825
hd DVR soc
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Common rail piezo injector driver
Abstract: Common rail injector driver COMMON RAIL SOLENOID DIRECT INJECTION piezo injector driver Piezo Direct Injection SCHEMATIC IGNITION WITH IGBTS FAN7085 DRIVER injector Common rail FQD3P50TM FQD12N201
Text: AUTOMOTIVE SOLUTIONS TO MAXIMIZE FUEL EFFICIENCY & REDUCE CO2 EMISSIONS Saving our world, 1mW at a time www.fairchildsemi.com INTRODUCTION Fairchild Semiconductor Automotive Solutions Whether specifying an intelligent ignition control for high performance engine management systems or
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IBM "embedded dram"
Abstract: m5m4v4169 Intel 1103 DRAM Nintendo64 IBM98 toshiba fet databook dynamic memory controler MOSYS eDRAM "1t-sram" MoSys
Text: ABSTRACT MODERN DRAM ARCHITECTURES by Brian Thomas Davis Co-Chair: Assistant Professor Bruce Jacob Co-Chair: Professor Trevor Mudge Dynamic Random Access Memories DRAM are the dominant solid-state memory devices used for primary memories in the ubiquitous microprocessor systems of
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conn95]
64-Mbit
Woo00]
EE380
class/ee380/
Wulf95]
Xanalys00]
Yabu99]
IBM "embedded dram"
m5m4v4169
Intel 1103 DRAM
Nintendo64
IBM98
toshiba fet databook
dynamic memory controler
MOSYS eDRAM
"1t-sram"
MoSys
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RT-1050
Abstract: No abstract text available
Text: Tyco Electronics Corporation 300 Constitution Drive Menlo Park, CA 94025 USA Specification This Issue: Date: Replaces: RT-1050/6 Issue 4 May 14, 1999 Issue 3 THERMOFIT ADHESIVE AND SEALANT THERMOFIT S-1030 Thermofit S-1030 is a general purpose, flexible, thermoplastic adhesive based on a modified polyolefin composition and
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RT-1050/6
S-1030
S-1030
RT-1050/6,
RT-1050
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optically clear adhesive
Abstract: ecg master replacement guide 1115b silver conductive ink resins QTM-500 MGC 7805 CONDUCTIVE INK FOR FLEX CIRCUITS 3m 7815 8880-S7 UL-746
Text: 3M Electronics Assembly Solutions Product Selection Guide Smart Solutions for Building In Value 3M Company, operating in more than 60 countries, has over 60,000 products. These products, based on 40 technology platforms, have been developed by 6,500 3M Product Developers Worldwide.
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225-3S-06
7193HB
optically clear adhesive
ecg master replacement guide
1115b
silver conductive ink resins
QTM-500
MGC 7805
CONDUCTIVE INK FOR FLEX CIRCUITS
3m 7815
8880-S7
UL-746
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Untitled
Abstract: No abstract text available
Text: 3M Scotch-Weld™ Structural Woodworking Adhesives Roping and trim attachment Crown molding sliver repair High Speed High Strength Powerful, convenient tools for production, repairs, and installation For woodworking, furniture, and cabinetry, 3M ™ Scotch-Weld™ Structural
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1-1W-10
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Sony IMX 183
Abstract: Sony sony cmos sensor imx 178 Sony imx 214 Sony ImX 252 sony cmos sensor imx 226 Sony IMX 219 CMOS Sony "IMX 219" CMOS sony IMX 322 cmos sony cmos sensor imx 185
Text: i.MX 6Solo/6DualLite Applications Processor Reference Manual Document Number: IMX6SDLRM Rev. 1, 04/2013 i.MX 6Solo/6DualLite Applications Processor Reference Manual, Rev. 1, 04/2013 2 Freescale Semiconductor, Inc. Contents Section number Title Page Chapter 1
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LR 4100 RELAY
Abstract: No abstract text available
Text: 58 AM TE-32 ASSP Telecom Standard Product Data Sheet Released r, 20 05 12 :5 3: PM4332 y, 13 De ce m be TE-32 in er In co n Tu es da High Density 32 Channel T1/E1/J1 Framer Proprietary and Confidential Released Issue No. 6: November 2005 Do wn lo ad ed by
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TE-32
PMC-2011402,
TE-32
PM4332
LR 4100 RELAY
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LR 4100 RELAY
Abstract: PM8316PGI 315-B PM8316-PGI
Text: PM8316 TEMUX 84 RELEASED DATA SHEET ISSUE 9 HIGH DENSITY T1/E1 FRAMER WITH INTEGRATED VT/TU MAPPER AND M13 MUX 10 :3 5: 14 PM PMC-1991437 ,1 3M ar ch ,2 00 6 PM8316 co n Mo nd ay TEMUX 84 DATA SHEET Do wn l oa de d by C on te nt T ea m of Pa rtm in er In HIGH DENSITY T1/E1 FRAMER WITH
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PMC-1991437
PM8316
PM8316
PMC-1991437
PMC-1991191
LR 4100 RELAY
PM8316PGI
315-B
PM8316-PGI
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mpx6115
Abstract: wheatstone bridge invasive blood pressure sensor AN1646 abstract for battery level indicator of lm3914 infusion pump pressure transducer ZO 607 TRIAC TRANSISTOR NPN, b2f piezo buzzer mtbf ABSTRACT FOR water level indicator using 4 led MPX5100
Text: Freescale Semiconductor, Inc. Freescale Semiconductor, Inc. Sensor Device Data Book DL200/D Rev. 5, 01/2003 WWW.MOTOROLA.COM/SEMICONDUCTORS For More Information On This Product, Go to: www.freescale.com Freescale Semiconductor, Inc. DATA CLASSIFICATION Product Preview
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DL200/D
DL200/D,
mpx6115
wheatstone bridge invasive blood pressure sensor
AN1646
abstract for battery level indicator of lm3914
infusion pump pressure transducer
ZO 607 TRIAC
TRANSISTOR NPN, b2f
piezo buzzer mtbf
ABSTRACT FOR water level indicator using 4 led
MPX5100
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lm78l05
Abstract: zener SMD MARK A9 smd transistor marking A10 marking code hr 31 SMD zener diode 1.6v sot-23 Marking 40g BGA-3000 lm78l05 smd MARKING SMD IC CODE 611
Text: LM78L05IBP MICRO SMD QUALIFICATION PACKAGE Winter 1999 Table of Contents 1.0 Introduction 1.1 General Product Description. . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 1.2 Technical Product Description . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
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LM78L05IBP
AN-1112
LM78L05
zener SMD MARK A9
smd transistor marking A10
marking code hr 31 SMD
zener diode 1.6v
sot-23 Marking 40g
BGA-3000
lm78l05 smd
MARKING SMD IC CODE 611
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ic 555 timer 10 minute
Abstract: proportional control ELECTRIC CONVECTION WALL OVEN pulse position modulator
Text: LMC555 MICRO SMD QUALIFICATION PACKAGE Summer 1999 Table of Contents 1.0 Introduction 1.1 General Product Description. . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 1.2 Technical Product Description . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
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LMC555
AN-1112
ic 555 timer 10 minute
proportional control ELECTRIC CONVECTION WALL OVEN
pulse position modulator
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SOLAR MOBILE CHARGER diagram
Abstract: BMP51 M-20-351 SAE-AS81531 M749 solar mobile charger block diagram block diagram bluetooth 0240 MC1500 outlet MC2404 SAE-AS-81531
Text: Printer Part Numbers Part # Description 75447314707 BMP®51 Printer with AC Adaptor* BMP®51 Printer, Rechargeable Li-Ion Battery Pack and AC Adaptor/Battery Charger* BMP®51 Printer, LabelMark 5 Software and AC Adaptor* BMP®53 Peripheral Printer with AC Adaptor*
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BMP21
com/bmp51.
Y1616703
MS1616703
SOLAR MOBILE CHARGER diagram
BMP51
M-20-351
SAE-AS81531
M749
solar mobile charger block diagram
block diagram bluetooth 0240
MC1500 outlet
MC2404
SAE-AS-81531
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Untitled
Abstract: No abstract text available
Text: Smart choice for power IQ FOR YOUR RV The Xantrex Freedom Sequence is an intelligent energy management system EMS that provides automatic power & load management for Recreational Vehicles (RVs) when powered by shore power or generator. Together with the Freedom SW Inverter/Charger, System Control Panel (SCP) and Automatic
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TC-PAM
Abstract: tcpam encoder Modulation TC-PAM G.SHDSL LOOP modems LXT776 G.SHDSL Line Driver SHDSL SHDSL chips PAM time division multiplexing
Text: LXT776 Multi-Standard DSL Modem Product Overview n TC-PAM transceiver n Forward Error Correction FEC feature n Flexible frame mapper n Analog front-end with integrated line driver. Glossary OEMs can program the Time Slot Assignment (TSA) function to select and map individual DS0
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LXT776
192Kbps
PB-1013
USA/0600/7K/ASI/CR
TC-PAM
tcpam encoder
Modulation TC-PAM
G.SHDSL LOOP modems
G.SHDSL
Line Driver SHDSL
SHDSL chips
PAM time division multiplexing
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Untitled
Abstract: No abstract text available
Text: product brief GigaBlade Network Accelerator Card Product Overview www.intel.com/IXA The GigaBlade™ is a flexible, high-speed networking subsystem for use in both local area LAN and wide area network (WAN) switches and routers. The GigaBlade is a complete solution
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OC-12,
OC-48,
OC-192
64-bit
64-bit
PB-1001
USA/0600/4K/ASI/CR
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pci0643
Abstract: PCI-0640B
Text: PCI0643 C M D TECHNOLOGY, the first to introduce a fu lly com patible PCI to IDE controller chip, announces the PCI0643, the w orld's first 3.3V .5|jm PCI to IDE controller chip that supports high-speed PIO or bus master data transfers. C M D continues to provide our users with a simple, cohesive upgrade path from
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PCI0643
PCI0643,
PC10640B
PCI0646
PCI0643
PC10640B,
PCI0646,
PCI0646.
PCI-0640B
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Untitled
Abstract: No abstract text available
Text: REVISION B NOTES: 1 . <C> REPRESENTS CRITICAL DIMENSION. 2. PARTS ARE ROHS COMPLIANT. 3. PARTS TO BE PACKAGED IN CARDBOARD BOXES FOR FULL BOX QUANTITIES, PARTIAL ORDERS TO BE PACKAGED IN COHESIVE FOAM. 1 1 1 3 4 3 _ 1 1 1 " 1 1 II n n n n n n n n n n n n n n n n n n n n n l l
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Abstract: No abstract text available
Text: REVISION B NOTES: 1 . <C> REPRESENTS CRITICAL DIMENSION. 2. PARTS ARE ROHS COMPLIANT. 3. PARTS TO BE PACKAGED IN CARDBOARD BOXES FOR FULL BOX QUANTITIES, PARTIAL ORDERS TO BE PACKAGED IN COHESIVE FOAM. TABLE 1 posm oN S "A" "B" "C" "D” "E" "F" -36 .984 [25.00]
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Abstract: No abstract text available
Text: r a iO M O G O M V Military ì860tm 64-Bit M icro p ro cesso r • Compatible with Industry Standards — ANSI/IEEE Standard 754-1985 for Binary Floating-Point Arithmetic — 386 /j 486TM Microprocessor Data Formats and Page Table Entries ■ Parallel Architecture that Supports Up
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860tm
64-Bit
486TM
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