Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    COEFFICIENT OF THERMAL EXPANSION KAPTON Search Results

    COEFFICIENT OF THERMAL EXPANSION KAPTON Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TCTH011AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Push-pull type Visit Toshiba Electronic Devices & Storage Corporation
    TCTH022AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation
    TCTH021AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type Visit Toshiba Electronic Devices & Storage Corporation
    TCTH012BE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Open-drain type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation
    TCTH012AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Push-pull type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation

    COEFFICIENT OF THERMAL EXPANSION KAPTON Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    AMD reflow soldering profile BGA

    Abstract: ipc-SM-782 amd reflow profile 90 PATTERNS DUAL GRID BGA PROFILING
    Text: u Chapter 3 Board Assembly CHAPTER 3 BOARD ASSEMBLY Introduction PCB Designs Board Assembly Methods Land Patterns Packages and Packing Publication Revision A 3/1/03 3-1 u Chapter 3 Board Assembly INTRODUCTION The electronics industry is continually challenged to


    Original     		PDF ANSI/IPC-SM-782 AMD reflow soldering profile BGA ipc-SM-782 amd reflow profile 90 PATTERNS DUAL GRID BGA PROFILING

    WK-05-060WT-350

    Abstract: TN501 tesla potentiometer 195 TK 4838 IR SENSOR ac ripple neutralizer strain gauge amplifier NAS-942 tetra-etch 11654 hahn transformer EA-06-250BF-350
    Text: VISHAY INTERTECHNO L O G Y , INC . INTERACTIVE data book strain gage technology technical data vishay micro-measurements vse-db0088-0708 Notes: 1. To navigate: a Click on the Vishay logo on any datasheet to go to the Contents page for that section. Click on the Vishay logo on any Contents


    Original     		PDF vse-db0088-0708 WK-05-060WT-350 TN501 tesla potentiometer 195 TK 4838 IR SENSOR ac ripple neutralizer strain gauge amplifier NAS-942 tetra-etch 11654 hahn transformer EA-06-250BF-350

    SL-001

    Abstract: coefficient of thermal expansion kapton thermique
    Text: Aluminiumoxydscheiben Aluminium oxide wafers 3,1 R6 17,5 3,1 4 4,2 10,9 29 4,2 11 4,8 17,5 0,6 5 26,3 4,8 Entretoises en oxyde d'aluminium R 14,5 13,2 17 30 42 40,6 AOS 3 P 1,5 mm 0,061 12 7 18 25 21 AOS 127 0,054 ➜ ➜ R 7,5 18 25,5 3,0 mm 0,076 9,5 3,2


    Original     		PDF 10-6/K SL-001 coefficient of thermal expansion kapton thermique

    AN-A001

    Abstract: AN004R
    Text: IMFET Handling and Design Guidelines Application Note 1083 Introduction This application note provides basic information on the use and handling of Hewlett-Packard’s Internally Matched Power GaAs FETs or IMFETsTM. Topics include a brief product description, proper handling, some


    Original     		PDF AN-A001, 50918824E. 5964-4379E 5965-1248E AN-A001 AN004R

    Al2O3

    Abstract: AOS340
    Text: Aluminiumoxydscheiben Aluminium oxide wafers Entretoises en oxyde d'aluminium 4,8 4,8 3,1 3,1 R6 4 17,5 4,2 - 26,3 10,9 29 11 4,2 5 17,5 4,8 R 14,5 13,2 30 42 4,1 AOS 3 P 12 7 18 25 1,5 mm 0,02 AOS 220 ➜ AOS 218 247 1 0,15 ➜ ➜ ➜ ➜ 3,0 mm ➜ 4 0,10


    Original     		PDF

    deltabond

    Abstract: Wakefield 120-320 152-1B thermal conductivity 175-6-220-P
    Text: WTS001_p50-68 6/14/07 10:46 AM Page 64 Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS 120 SERIES The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal resistance of


    Original     		PDF WTS001 p50-68 173-7-220P 173-7-230P 173-7-240P 173-7-1212P 73-7-240A 173-9-210P 173-9-230P 173-9-240P deltabond Wakefield 120-320 152-1B thermal conductivity 175-6-220-P

    Untitled

    Abstract: No abstract text available
    Text: WTS001_p50-68 6/14/07 10:46 AM Page 64 Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS 120 SERIES The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal resistance of


    Original     		PDF WTS001 p50-68 175-6-210P 173-9-210P 173-7-220P 175-6-220P 173-7-230P 173-9-230P 175-6-230P 173-7-240P

    Wakefield 120-320

    Abstract: No abstract text available
    Text: Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS 120 SERIES The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal resistance of


    Original     		PDF 173-7-220P 173-7-230P 173-7-240P 173-7-1212P 73-7-240A 173-9-210P 173-9-230P 173-9-240P 173-9-1212P 174-9-310P Wakefield 120-320

    Untitled

    Abstract: No abstract text available
    Text: Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS 120 SERIES The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal


    Original     		PDF 0-320P 73-7-320A 173-7-330P 173-7-340P 173-7-350P 173-7-410P 173-7-510P 173-7-520P 173-7-610P 173-7-710P

    MIL-C-47113

    Abstract: t405 6000 e595 Chomerics* T-405 deltabond ARCLAD 8223 T-412 chomerics KS21343 thermal grease Chomerics T710 174-9-250P
    Text: Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS 120 SERIES The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal


    Original     		PDF O-220 MIL-C-47113 t405 6000 e595 Chomerics* T-405 deltabond ARCLAD 8223 T-412 chomerics KS21343 thermal grease Chomerics T710 174-9-250P

    temperature based speed control of exhaust fan using triac circuit diagram

    Abstract: "OPTIMUM SNUBBERS FOR POWER SEMICONDUCTORS" simple schematic diagram PWM 40a hydrogen EI - 33c TRANSFORMER EI 33c TRANSFORMER General Electric SCR Manual, Fifth Edition, 1972 rectifiers and zener diodes data NCP1200 CROSS REFERENCE pc smps transistor manual substitution RCA Solid state Linear Integrated Circuits 1970s
    Text: HB214/D Rev. 2, Nov-2001 Rectifier Applications Handbook Rectifier Applications Handbook ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC SCILLC . SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does


    Original     		PDF HB214/D Nov-2001 NCP1200 MBRS360T3 MUR160 r14525 HB214/D temperature based speed control of exhaust fan using triac circuit diagram "OPTIMUM SNUBBERS FOR POWER SEMICONDUCTORS" simple schematic diagram PWM 40a hydrogen EI - 33c TRANSFORMER EI 33c TRANSFORMER General Electric SCR Manual, Fifth Edition, 1972 rectifiers and zener diodes data NCP1200 CROSS REFERENCE pc smps transistor manual substitution RCA Solid state Linear Integrated Circuits 1970s

    DE-Series

    Abstract: mosfet High-Speed Switching 100mhz Directed Energy DE-150 DE-275 DE-375
    Text: DIRECTED ENERGY, INC. TECHNICAL NOTE DE-SERIES FAST POWER MOSFET AN INTRODUCTION George J Krausse, Directed Energy, Inc. Abstract The DE-SERIES Fast Power TM MOSFETs are unique high power devices designed as a circuit element from the ground up for high speed, high


    Original     		PDF

    MRF1507

    Abstract: thermal analysis pld 1.5 "thermal via" AN4005 EB209
    Text: MOTOROLA Order this document by AN4005/D SEMICONDUCTOR APPLICATION NOTE AN4005 Thermal Management and Mounting Method for the PLD 1.5 RF Power Surface Mount Package Prepared by: Jeanne Pavio and Mike McCloskey Motorola SPS Communications Technology Center


    Original     		PDF AN4005/D AN4005 MRF1507 thermal analysis pld 1.5 "thermal via" AN4005 EB209

    AN4005

    Abstract: MRF1507 EB209
    Text: MOTOROLA Freescale Semiconductor, Inc. SEMICONDUCTOR APPLICATION NOTE Order this document by AN4005/D AN4005 Thermal Management and Mounting Method for the PLD 1.5 RF Power Surface Mount Package Prepared by: Jeanne Pavio and Mike McCloskey Motorola SPS Communications Technology Center


    Original     		PDF AN4005/D AN4005 AN4005 MRF1507 EB209

    IXFR170N10

    Abstract: SIL-PAD to-247 IXFX55N50 SIL-PAD PLUS247 26N50 ISOPLUS247 IXFR150N10 IXFR55N50 IXFX180N10
    Text: Technical Application The Revolution in Discrete Isolation Technique by Martin Arnold, Product Marketing, IXYS Semiconductor GmbH & Ralph Locher, Application Engineering, IXYS Corporation Introduction When using power semiconductors, there is usually the need to electrically isolate the devices from the heatsink, which


    Original     		PDF ISOPLUS247 IXFR55N50 IXFX55N50 IXFX55N50 D-68623 IXFR170N10 SIL-PAD to-247 SIL-PAD PLUS247 26N50 IXFR150N10 IXFR55N50 IXFX180N10

    NXR-1400

    Abstract: nicolet nxr1400 reballing Air-Vac Engineering Company 830B A112 AN1231 JESD22 MPC105 OMPAC
    Text: MOTOROLA Order this document by AN1231/D SEMICONDUCTOR TECHNICAL DATA AN1231 Plastic Ball Grid Array PBGA Prepared by: Andrew Mawer (MMTG Final Manufacturing Operations) INTRODUCTION TO THE PBGA The Plastic Ball Grid Array or PBGA package is the industry description of what is sometimes referred to as Motorola’s


    Original     		PDF AN1231/D AN1231 AN1231/D* NXR-1400 nicolet nxr1400 reballing Air-Vac Engineering Company 830B A112 AN1231 JESD22 MPC105 OMPAC

    IXAN0025

    Abstract: diode kv 1236 SIL-PAD 1000 TO 247 SIL-PAD to-247 IXFR170N10 DC to 3Phase converter SIL-PAD 26N50 CS 112 thyristor IXFX180N10
    Text: ISOPLUSTM - The Revolution in Discrete Isolation Technique Technical Application IXAN0025 Introduction When using power semiconductors, there is usually the need to electrically isolate the devices from the heatsink, which could also be the equipment chassis. The three main reasons for this are: a safety; b) the desire to reduce


    Original     		PDF IXAN0025 ISOPLUS220TM ISOPLUS247TM D-68623 IXAN0025 diode kv 1236 SIL-PAD 1000 TO 247 SIL-PAD to-247 IXFR170N10 DC to 3Phase converter SIL-PAD 26N50 CS 112 thyristor IXFX180N10

    transistor nec 8772

    Abstract: nec 7912 nec 8772 motorola 7912 1764 676 kapton NXR-1400 2SB444 8772 P bga dye pry
    Text: MOTOROLA Order this document by AN1231/D SEMICONDUCTOR TECHNICAL DATA AN1231 Plastic Ball Grid Array PBGA Prepared by: Andrew Mawer (MMTG Final Manufacturing Operations) INTRODUCTION TO THE PBGA The Plastic Ball Grid Array or PBGA package is the industry description of what is sometimes referred to as Motorola’s


    Original     		PDF AN1231/D AN1231 transistor nec 8772 nec 7912 nec 8772 motorola 7912 1764 676 kapton NXR-1400 2SB444 8772 P bga dye pry

    transistor nec 8772

    Abstract: NXR-1400 FXS-160 nec 8772 nec 8772 transistor nicolet nxr1400 8772 P Epoxy, glass laminate 2SB444 nec 7912
    Text: Freescale Semiconductor, Inc. MOTOROLA Order this document by AN1231/D SEMICONDUCTOR TECHNICAL DATA ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005 AN1231 Plastic Ball Grid Array PBGA Prepared by: Andrew Mawer (MMTG Final Manufacturing Operations) ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005


    Original     		PDF AN1231/D AN1231 transistor nec 8772 NXR-1400 FXS-160 nec 8772 nec 8772 transistor nicolet nxr1400 8772 P Epoxy, glass laminate 2SB444 nec 7912

    RY43

    Abstract: KFG-02-120-C1-11L3M3R
    Text: OMEGA STRAIN GAGES SPECIFICATIONS CHART c a a b b c b a a b c c a Foil strain gages are constructed by embedding a foil measuring element into a carrier. Foil measuring grid Carrier Substrate thickness Cover thickness Connection dimensions in mm [in] Nominal resistance


    Original     		PDF SG-3/350-XY47K RY43 KFG-02-120-C1-11L3M3R

    chotherm 1674

    Abstract: P4855-1 TC-30AG 32-microinch TO3 SILICONE MICA SHEET torque for SELF TAPPING SCREW 87-HS-9 to225a SIL-PAD density Case 806-05
    Text: SECTION 7 MOUNTING TECHNIQUES FOR THYRISTORS Edited and Updated Figure 7.1 shows an example of doing nearly everything wrong. A tab mount TO-220 package is shown being used as a replacement for a TO-213AA TO-66 part which was socket mounted. To use the socket, the


    Original     		PDF

    310 thermistor

    Abstract: KYNAR film TEFZEL awg 30 TWISTED PAIR THERMISTORS SCK 016 radial lead ptc mexico thermistor conversion table Quality Thermistor SENSOR m8 thermistor THERMISTORS NTC 15 KM UV 471
    Text: For more information on Quality Thermistor, Inc., or on QTI brand thermistors, probes, and engineering services, contact Technical Support. Quality Thermistor, Inc. 2108 Century Way Boise, ID 83709 NTC TH ER MI STOR DESIGN GUIDE FOR DISCRETE COMPONENTS & PROBES


    Original     		PDF

    tetra-etch

    Abstract: MR1-350-130 Gore tetra etch PCT-2M 430-FST 136-awp 134-AWP MR1-350-127 M-line accessories MCA-2 EPOXYLITE 813
    Text: VISHAY INTERTECHNO L O G Y , INC . INTERACTIVE data book strain gage accessories vishay micro-measurements vse-db0065-0707 Notes: 1. To navigate: a Click on the Vishay logo on any datasheet to go to the Contents page for that section. Click on the Vishay logo on any Contents


    Original     		PDF vse-db0065-0707 tetra-etch MR1-350-130 Gore tetra etch PCT-2M 430-FST 136-awp 134-AWP MR1-350-127 M-line accessories MCA-2 EPOXYLITE 813

    Untitled

    Abstract: No abstract text available
    Text: AMITRON RESISTORS Standard resistor materials are made from glasses and oxides of ruthenium metal. Special materials are available for high power, high voltage and poten­ tiometer applications. Sheet resistivities from milli-ohms to giga-ohms can be combined on the same substrate and


    OCR Scan     		PDF