Untitled
Abstract: No abstract text available
Text: Hauptübersicht | Index Main Overview | Index Technik/Technic Technische Daten der COB-Technologie Erläuterung der LED-Chip-On-Board-Technologie und ihrer lichttechnischen Eigenschaften Technical Data of COB-Technology Explanation of the LED-Chip-On-Bord-Technology
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Untitled
Abstract: No abstract text available
Text: Hauptübersicht | Index Main Overview | Index Technik/Technic Technische Daten der COB-Technologie Erläuterung der LED-Chip-On-Board-Technologie und ihrer lichttechnischen Eigenschaften Technical Data of COB-Technology Explanation of the LED-Chip-On-Bord-Technology
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2500K
10000K,
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Untitled
Abstract: No abstract text available
Text: Hauptübersicht | Index Main Overview | Index Technik/Technic Technische Daten der COB-Technologie Erläuterung der LED-Chip-On-Board-Technologie und ihrer lichttechnischen Eigenschaften Technical Data of COB-Technology Explanation of the LED-Chip-On-Bord-Technology
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G11777-003P
Abstract: spot light size photodiode InGaAs PIN photodiode Wavelength .6 to 1.7 InGaas PIN photodiode chip
Text: InGaAs PIN photodiode G11777-003P Surface mounted type COB chip on board package The G11777-003P is a small-size near infrared detector available in a surface mount COB (chip on board) package. Its size is drastically reduced compared to the previous metal package type (G8376-03). The spectral response covers a
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G11777-003P
G11777-003P
G8376-03)
KIRD1114E03
spot light size photodiode
InGaAs PIN photodiode Wavelength .6 to 1.7
InGaas PIN photodiode chip
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Untitled
Abstract: No abstract text available
Text: Simplify light-fixture installations and achieve industryleading thermal, electric and optic performance with reliable, solderless LED Array Holders Chip-On-Board COB LED Array Holders simplify the LED installation process by eliminating the need for labor-intensive hand soldering. Risk of LED CoB
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CXA1507and
CXA1512
CXA2520,
CXA2530
CXA2540
USA/KC/2013
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NR30
Abstract: No abstract text available
Text: Chip on Board COB C-MAC MicroTechnology’s COB design and manufacturing method allows additional functionality to be introduced within the footprint constraints of existing components, eliminating the need to redesign the product package. We can upgrade or fix your product faster
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MOTOROLA OPTOELECTRONIC led
Abstract: gold scanner detector PSD elcos multi color 7-segment led smt a1 transistor PerkinElmer Optoelectronics philips LED GaAsP Sensors PSD Elcos AG MOTOROLA OPTOELECTRONIC
Text: PerkinElmer Elcos Innovative LED Solutions chip on board custom design optoelectronics ELCOS was founded in 1976 as a specialist for optoelectronic components. You as our customer can rely on more than 25 years of experience in chip on board COB technology, chip
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CAT0406P
MOTOROLA OPTOELECTRONIC led
gold scanner detector
PSD elcos
multi color 7-segment led
smt a1 transistor
PerkinElmer Optoelectronics
philips LED GaAsP
Sensors PSD
Elcos AG
MOTOROLA OPTOELECTRONIC
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COB CHIP ON BOARD
Abstract: C-MAC MicroTechnology NR30 dam and fill
Text: Chip on Board COB C-MAC MicroTechnology’s COB design and manufacturing method allows additional functionality to be introduced within the footprint constraints of existing components, eliminating the need to redesign the product package. We can upgrade or fix your product faster
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Untitled
Abstract: No abstract text available
Text: Rev : 006 Product Family Data Sheet LC013A - COB Chip on Board LED Introduction Features • 13W COB LED : 25.25 x 20.25 x t 1.5 (mm) · InGaN/GaN MQW LED with long-time reliability · Lead (Pd) free product - RoHS compliant Applications · Spot / Downlighting
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LC013A
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Untitled
Abstract: No abstract text available
Text: Rev : 005 Product Family Data Sheet LC006A - COB Chip on Board LED Introduction Features • 6.4 COB LED : 18.0 x 13.5 x t 6.4 (mm) · InGaN/GaN MQW LED with long-time reliability · Lead (Pd) free product - RoHS compliant Applications · Spot / Downlighting
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LC006A
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HD66710FS
Abstract: DB3 X51 Y59 r 130 HCD66205L HD44105D HD61104A HD61105A HD61203D HD66100D
Text: Chip Shipment Products COB chip on board and COG (chip on glass) products form only a small percentage of the thin form and miniature mounting products shipped. However, these products, which are referred to here as “chip shipment products”, involve shipping
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HCD66205L
HD66710FS
DB3 X51
Y59 r 130
HCD66205L
HD44105D
HD61104A
HD61105A
HD61203D
HD66100D
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WE 251
Abstract: Vossloh-Schwabe
Text: LEDLine 150 COB Lichtmodule als Einbauplatine Nennspannung: 24 V DC Gewicht: 7 g Diodenabstand bei max. Bestückung: 4,5 mm Anschluss über 6-poligen Verbindungsstecker in Schneid-Klemmtechnik I (cd/klm) Die universelle Lichtleiste LEDLine 150 ist ausgeführt in Chip-on-Board-Technologie (COB) und
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Untitled
Abstract: No abstract text available
Text: Rev : 003 Product Family Data Sheet LC196A - COB Chip On Board LED Introduction Features 26W COB LED : 31.00 x 21.00 x 1.4 (mm) InGaN/GaN MQW LED with long-time reliability Lead (Pd) free product - RoHS compliant Applications Spot / Down light
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LC196A
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Untitled
Abstract: No abstract text available
Text: Rev : 006 Product Family Data Sheet LC026A - COB Chip on Board LED Introduction Features • 26W COB LED : 31.00 x 21.00 x t 1.4 (mm) · InGaN/GaN MQW LED with long-time reliability · Lead (Pd) free product - RoHS compliant Applications · Spot / Downlighting
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LC026A
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WU-M-215
Abstract: WUM 215 RGB Vossloh-Schwabe LI 20 AB 506847
Text: LEDLine 200 COB Lichtmodule als Einbauplatine Nennspannung: 24 V DC Gewicht: 8 g Diodenabstand bei max. Bestückung: 4,5 mm Anschluss über 6-poligen Verbindungsstecker in Schneid-Klemmtechnik I (cd/klm) Die universelle Lichtleiste LEDLine 200 ist ausgeführt in Chip-on-Board-Technologie (COB) und
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60are
WU-M-215
WUM 215 RGB
Vossloh-Schwabe
LI 20 AB
506847
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C-MAC MicroTechnology
Abstract: c-mac 1553 ltcc chip Book Microelectronic electrical engineering projects fuel level probe MEMS pressure sensor HP10 NR30 TS16949
Text: TOTALLY OBSESSED WITH MICROTECHNOLOGY HIGH RELIABILITY MICROELECTRONICS FOR HARSH ENVIRONMENTS Thick film / LTCC / Chip & Wire Multi-Chip Modules Hermetic packaging Specialist SMT Chip on Board COB Conformal coating www.cmac.com C-MAC MicroTechnology is dedicated to the design, manufacture
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B-9600
C-MAC MicroTechnology
c-mac 1553
ltcc chip
Book Microelectronic
electrical engineering projects
fuel level probe
MEMS pressure sensor
HP10
NR30
TS16949
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vpc3230d
Abstract: vga to cvbs converter micronas vpc 3230D VDP3140D CrCb micronas ddp 3310B transistor RGB mixer 3310B PIP VIDEO processor PICTURE TUBE
Text: VDP 3140D Short Information VDP 3140D 100/120-Hz Video, Display and Deflection Processor Design name: Sipadoss Single Package Double-Scan Solution (64-pin COB, 64-pin PSDIP-compatible) The VDP 3140D is a COB (Chip-On-Board) and performs video decoding, scan rate conversion to 100 or
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3140D
100/120-Hz
64-pin
3140D
3230D
3310B
6251-507-1SI
vpc3230d
vga to cvbs converter
micronas vpc 3230D
VDP3140D
CrCb
micronas ddp 3310B transistor
RGB mixer
PIP VIDEO processor
PICTURE TUBE
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7 segment countdown timer
Abstract: BUTTON PCB GU30 MLX90720
Text: MLX90720 One Button Timer Features and Benefits Flexible timer chip thanks to several configurations and options Low cost – minimal external components Low power consumption guarantees a long operation life on a low cost 1.5V button cell COB Chip-On-Board package technology
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MLX90720
30/Nov/00
MLX902xx
MLX90720
22/Aug/98
7 segment countdown timer
BUTTON PCB
GU30
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B102
Abstract: CECC00802 J-STD-020A MLX90720 7 segment countdown timer
Text: MLX90720 One Button Timer Features and Benefits Flexible timer chip thanks to several configurations and options Low cost – minimal external components Low power consumption guarantees a long operation life on a low cost 1.5V button cell COB Chip-On-Board package
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MLX90720
QS9000,
ISO14001
Aug/02
B102
CECC00802
J-STD-020A
MLX90720
7 segment countdown timer
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Untitled
Abstract: No abstract text available
Text: MLX90720 One Button Timer Features and Benefits Flexible timer chip thanks to several configurations and options Low cost – minimal external components Low power consumption guarantees a long operation life on a low cost 1.5V button cell COB Chip-On-Board package technology
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MLX90720
MLX90720
ISO14001
Mar/04
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cables
Abstract: Flat Ribbon Connector 1x36 IDC male Flat Ribbon Connector 2x10 IDC Female 50522 diode sy 104 DMX chip Flat Ribbon Connector 2x10 IDC male wu-m-310 WU-M-310-SBSBSB Vossloh-Schwabe 505781 DIGILED 1-10V
Text: A New Lighting Experience • high quality due to Chip-on-Board technology • available in monochrome and RGB • resistant against shock and vibrations • low mounting height LEDLine 300 COB, LEDLine 150 COB WU-M-305, WU-M-306, WU-M-310, WU-M-311, WU-M-313, WU-M-314
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WU-M-305,
WU-M-306,
WU-M-310,
WU-M-311,
WU-M-313,
WU-M-314
cables
Flat Ribbon Connector 1x36 IDC male
Flat Ribbon Connector 2x10 IDC Female
50522
diode sy 104
DMX chip
Flat Ribbon Connector 2x10 IDC male
wu-m-310
WU-M-310-SBSBSB
Vossloh-Schwabe 505781 DIGILED 1-10V
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led cob RGB
Abstract: diode sy 104 DMX chip WU-M-310 WU-M-310-SGSGSG WU-M-311 diodes SY 200 WU-M-311-SBSBSB WU-M-310-SBSBSB WU-M-305-SO
Text: A New Lighting Experience • high quality due to Chip-on-Board technology • available in monochrome and RGB • resistant against shock and vibrations • low mounting height LEDLine 300 COB, LEDLine 150 COB WU-M-305, WU-M-306, WU-M-310, WU-M-311, WU-M-313, WU-M-314
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WU-M-305,
WU-M-306,
WU-M-310,
WU-M-311,
WU-M-313,
WU-M-314
led cob RGB
diode sy 104
DMX chip
WU-M-310
WU-M-310-SGSGSG
WU-M-311
diodes SY 200
WU-M-311-SBSBSB
WU-M-310-SBSBSB
WU-M-305-SO
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Vossloh-Schwabe 505781 DIGILED 1-10V
Abstract: WU-M-310 vs 529620 WU-M-311 dali DMX chip led cob RGB WU-M-305-SO
Text: A New Lighting Experience • hohe Qualität durch Chip-on-Board Technik • in monochrom und RGB erhältlich • unempfindlich gegen Stoß und Vibrationen • geringe Einbauhöhe LEDLine 300 COB, LEDLine 150 COB WU-M-305, WU-M-306, WU-M-310, WU-M-311, WU-M-313, WU-M-314
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WU-M-305,
WU-M-306,
WU-M-310,
WU-M-311,
WU-M-313,
WU-M-314
WU-M-305-SO/SG/SB/SY/W)
Vossloh-Schwabe 505781 DIGILED 1-10V
WU-M-310
vs 529620
WU-M-311
dali
DMX chip
led cob RGB
WU-M-305-SO
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hitachi product lot number
Abstract: No abstract text available
Text: Chip Shipment Products COB chip on board and COG (chip on glass) products form only a small percentage o f the thin form and m iniature m ounting products shipped. However, these products, which are referred to here as “chip shipment products”, involve shipping unmounted chips from the factory.
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HCD44780UxxxFS
HCD61202U
HCD61203U
HCD66002
HCD66206
HCD66702RxxxF
HCD66710XXX
HCD66712XXX
HCD66717XXX
HCD66720XXX
hitachi product lot number
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