CMPD914
Abstract: diode marking r5 318 SOT23
Text: Central CMPD914 Semiconductor Corp. SURFACE MOUNT HIGH SPEED SILICON SWITCHING DIODE DESCRIPTION: The Central Semiconductor CMPD914 is a ultrahigh speed silicon switching diode manufactured by the epitaxial planar process, in an epoxy molded surface mount package, designed for
|
OCR Scan
|
CMPD914
OT-23
100i2,
CPD63
OT-23
diode marking r5
318 SOT23
|
PDF
|
diode C5d
Abstract: marking C5D transistor C5D CMPD914 TP10 diode marking r5 R5 SOT CMPD914 diode switching diode marking code R5 sot23
Text: Central CMPD914 TM Semiconductor Corp. SURFACE MOUNT HIGH SPEED SILICON SWITCHING DIODE DESCRIPTION: The Central Semiconductor CMPD914 is a ultrahigh speed silicon switching diode manufactured by the epitaxial planar process, in an epoxy molded surface mount package, designed for
|
Original
|
CMPD914
CMPD914
OT-23
diode C5d
marking C5D
transistor C5D
TP10
diode marking r5
R5 SOT
CMPD914 diode
switching diode
marking code R5 sot23
|
PDF
|
sot-23 marking code T25
Abstract: CMPD914 sot-23 MARKING CODE JS
Text: Central CMPD914 Semiconductor Corp. HIGH SPEED SWITCHING DIODE DESCRIPTION: The Central Semiconductor CMPD914 is a ultrahigh speed silicon switching diode manufactured by the epitaxial planar process, in an epoxy molded surface mount package, designed for
|
OCR Scan
|
CMPD914
OT-23
100pA
13-November
OT-23
sot-23 marking code T25
sot-23 MARKING CODE JS
|
PDF
|
diode C5d
Abstract: marking C5D TP10 CMPD914 CMPD914 diode
Text: Central CMPD914 TM Semiconductor Corp. HIGH SPEED SWITCHING DIODE DESCRIPTION: The Central Semiconductor CMPD914 is a ultrahigh speed silicon switching diode manufactured by the epitaxial planar process, in an epoxy molded surface mount package, designed for
|
Original
|
CMPD914
OT-23
13-November
diode C5d
marking C5D
TP10
CMPD914 diode
|
PDF
|
CMPD914
Abstract: No abstract text available
Text: Central CMPD914 Semiconductor Corp. HIGH SPEED SWITCHING DIODE DESCRIPTION The CENTRAL SEMICONDUCTOR CMPD914 type is a ultra-high speed silicon switching diode manufactured by the epitaxial planar process, in an epoxy molded surface mount package, designed for high speed
|
OCR Scan
|
CMPD914
OT-23
CMPD914
100hA
|
PDF
|
CMPD914
Abstract: diode By 129
Text: Central CMPD914 TM Semiconductor Corp. HIGH SPEED SWITCHING DIODE DESCRIPTION The CENTRAL SEMICONDUCTOR CMPD914 type is a ultra-high speed silicon switching diode manufactured by the epitaxial planar process, in an epoxy molded surface mount package, designed for high speed
|
Original
|
CMPD914
CMPD914
OT-23
diode By 129
|
PDF
|
Untitled
Abstract: No abstract text available
Text: CMPD914 SURFACE MOUNT HIGH SPEED SILICON SWITCHING DIODE w w w. c e n t r a l s e m i . c o m DESCRIPTION: The CENTRAL SEMICONDUCTOR CMPD914 is a ultra-high speed silicon switching diode manufactured by the epitaxial planar process, in an epoxy molded surface mount package, designed for high speed
|
Original
|
CMPD914
CMPD914
OT-23
25-January
|
PDF
|
diode C5d
Abstract: CMPD914 marking C5D CMPD914 diode
Text: CMPD914 SURFACE MOUNT HIGH SPEED SILICON SWITCHING DIODE w w w. c e n t r a l s e m i . c o m DESCRIPTION: The CENTRAL SEMICONDUCTOR CMPD914 is a ultra-high speed silicon switching diode manufactured by the epitaxial planar process, in an epoxy molded surface mount package, designed for high speed
|
Original
|
CMPD914
CMPD914
OT-23
25-January
diode C5d
marking C5D
CMPD914 diode
|
PDF
|
CMPD914
Abstract: No abstract text available
Text: Central CMPD914 TM Sem i c o n d u c t o r C o r p . HIGH SPEED SWITCHING DIODE DESCRIPTION The C ENTRAL S E M IC O N D U C TO R CMPD914 type is a ultra-high speed silicon switching diode manufactured by the epitaxial planar process, in an epoxy molded surface
|
OCR Scan
|
CMPD914
OT-23
CMPD914
|
PDF
|
marking 321 sot-23
Abstract: No abstract text available
Text: Central' CMPD914E Semiconductor Corp. ENHANCED SPECIFICATION SURFACE MOUNT HIGH SPEED SILICON SWITCHING DIODE DESCRIPTION: The Central Semiconductor CMPD914E is an Enhanced version of the CMPD914 High Speed Switching Diode in a SOT-23 surface mount package, designed for high speed applications.
|
OCR Scan
|
CMPD914E
CMPD914
OT-23
CPD63
OT-23
marking 321 sot-23
|
PDF
|
ED marking code diode
Abstract: sot-23 marking code T25 diode MARKING ED
Text: Central" CMPD914E semiconductor Corp. NHANCED SPECIFICATION SURFACE MOUNT HIGH SPEED SILICON SWITCHING DIODE DESCRIPTION: The Central Semiconductor CMPD914E is an Enhanced version of the CMPD914 High Speed Switching Diode in a SOT-23 surface mount package, designed for high speed applications.
|
OCR Scan
|
CMPD914E
CMPD914
OT-23
20-February
OT-23
ED marking code diode
sot-23 marking code T25
diode MARKING ED
|
PDF
|
Untitled
Abstract: No abstract text available
Text: CMPD914 Diodes General Purpose Fast Rectifier Military/High-RelN I O Max.(A) Output Current200m V(RRM)(V) Rep.Pk.Rev. Voltage100 t(rr) Max.(s) Rev.Rec. Time4.0n @I(F) (A) (Test Condition) @I(R) (A) (Test Condition) V(FM) Max.(V) Forward Voltage1.0 @I(FM) (A) (Test Condition)10m
|
Original
|
CMPD914
Current200m
Voltage100
StyleSOT-23
|
PDF
|
F10 SOT23
Abstract: TP10 CMPD914 CMPD914E
Text: Central CMPD914E Semiconductor Corp. ENHANCED SPECIFICATION HIGH SPEED SWITCHING DIODE TM Description: The Central Semiconductor CMPD914E is an Enhanced version of the CMPD914 High Speed Switching Diode in a SOT-23 surface mount package, designed for high speed applications.
|
Original
|
CMPD914E
CMPD914E
CMPD914
OT-23
100mA
11-March
F10 SOT23
TP10
|
PDF
|
TP10
Abstract: CMPD914 CMPD914E
Text: Central CMPD914E ENHANCED SPECIFICATION TM Semiconductor Corp. SURFACE MOUNT HIGH SPEED SILICON SWITCHING DIODE DESCRIPTION: The Central Semiconductor CMPD914E is an Enhanced version of the CMPD914 High Speed Switching Diode in a SOT-23 surface mount package, designed for high speed applications.
|
Original
|
CMPD914E
CMPD914E
CMPD914
OT-23
100mA
TP10
|
PDF
|
|
Untitled
Abstract: No abstract text available
Text: CMPD914E ENHANCED SPECIFICATION SURFACE MOUNT HIGH SPEED SILICON SWITCHING DIODE w w w. c e n t r a l s e m i . c o m DESCRIPTION: The CENTRAL SEMICONDUCTOR CMPD914E is an Enhanced version of the CMPD914 High Speed Switching Diode in a SOT-23 surface mount package,
|
Original
|
CMPD914E
CMPD914E
CMPD914
OT-23
100mA
25-January
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Central C M PD 914 semiconductor Corp. HIGH SPEED SWITCHING DIODE DESCRIPTION The C EN TR AL SEM IC O N D U C TO R CMPD914 type is a ultra-high speed silicon switching diode manufactured by the epitaxial planar process, in an epoxy molded surface mount package, designed for high speed
|
OCR Scan
|
OT-23
CMPD914
|
PDF
|
CMPD914
Abstract: CMPD914E
Text: CMPD914E ENHANCED SPECIFICATION SURFACE MOUNT HIGH SPEED SILICON SWITCHING DIODE w w w. c e n t r a l s e m i . c o m DESCRIPTION: The CENTRAL SEMICONDUCTOR CMPD914E is an Enhanced version of the CMPD914 High Speed Switching Diode in a SOT-23 surface mount package,
|
Original
|
CMPD914E
CMPD914E
CMPD914
OT-23
100mA
25-January
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Central” CMPD914 Sem iconductor Corp. HIGH SPEED SWITCHING DIODE DESCRIPTION The CENTRAL S E M IC O N D U C T O R CM PD 914 type is a ultra-high speed silicon switching diode manufactured by the epitaxial planar process, in an epoxy molded surface mount package, designed for high speed
|
OCR Scan
|
CMPD914
OT-23
100i2,
0177e
|
PDF
|
CMPD914
Abstract: CMPD914 diode
Text: Central C M P D 914 S em ico ndu cto r Corp. HIGH SPEED SWITCHING DIODE DESCRIPTION The CENTRAL S E M IC O N D U C TO R CMPD914 type is a ultra-high speed silicon switching diode manufactured by the epitaxial planar process, in an epoxy molded surface mount package, designed for high speed
|
OCR Scan
|
OT-23
CMPD914
CMPD914 diode
|
PDF
|
1n4148
Abstract: 1n4148 die chip DIODE CHIP 1N4148 1N4148.1N4448 1N4154 1N4448 1N4454 1N914 1N914B CMPD4448
Text: PROCESS CPD63 Central Switching Diode TM Semiconductor Corp. High Speed Switching Diode Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 11 x 11 MILS Die Thickness 11 MILS Anode Bonding pad Area 3.3 x 3.3 MILS Top Side Metalization Al - 30,000Å Back Side Metalization
|
Original
|
CPD63
CMPD914
CMPD4448
1N914
1N914B
1N4148
1N4448
1N4154
1N4454
1n4148
1n4148 die chip
DIODE CHIP 1N4148
1N4148.1N4448
1N4154
1N4448
1N4454
1N914
1N914B
CMPD4448
|
PDF
|
diode S 335
Abstract: 1n4148 die 1n4148 1n4148 die chip 1N4154 1N4448 1N4454 1N914 DIODE CHIP 1N4148 CMPD2836
Text: PROCESS CPD83V Switching Diode High Speed Switching Diode Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 11 x 11 MILS Die Thickness 7.1 MILS Anode Bonding Pad Area 3.35 x 3.35 MILS Top Side Metalization Al - 30,000Å Back Side Metalization Au-As - 13,000Å
|
Original
|
CPD83V
CMPD914
CMPD4448
1N914
1N914B
1N4148
1N4448
1N4154
1N4454
CMPD2836
diode S 335
1n4148 die
1n4148
1n4148 die chip
1N4154
1N4448
1N4454
1N914
DIODE CHIP 1N4148
CMPD2836
|
PDF
|
CMPD2836
Abstract: CMPD2838 CMPD914 1N4454 CMPD7000 1N4148.1N4448 1N4148 1N4154 1N4448 1N914
Text: PROCESS CPD83V Switching Diode High Speed Switching Diode Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 11 x 11 MILS Die Thickness 7.1 MILS Anode Bonding pad Area 3.3 x 3.3 MILS Top Side Metalization Al - 30,000Å Back Side Metalization Au.As - 13,000Å
|
Original
|
CPD83V
CMPD914
CMPD4448
1N914
1N914B
1N4148
1N4448
1N4154
1N4454
CMPD2836
CMPD2836
CMPD2838
CMPD914
1N4454
CMPD7000
1N4148.1N4448
1N4148
1N4154
1N4448
1N914
|
PDF
|
1n4148 die
Abstract: DIODE CHIP 1N4148 1n4148 die chip 1N4148.1N4448 1n914 equivalent 1N4454 1N4148 CMPD914 1N914B 1N4148 chip
Text: PROCESS CPD63 Switching Diode High Speed Switching Diode Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 11 x 11 MILS Die Thickness 11 MILS Anode Bonding pad Area 3.3 x 3.3 MILS Top Side Metalization Al - 30,000Å Back Side Metalization Au - 18,000Å
|
Original
|
CPD63
CMPD914
CMPD4448
1N914
1N914B
1N4148
1N4448
1N4154
1N4454
1n4148 die
DIODE CHIP 1N4148
1n4148 die chip
1N4148.1N4448
1n914 equivalent
1N4454
1N4148
CMPD914
1N914B
1N4148 chip
|
PDF
|
1N4148 chip
Abstract: DIODE CHIP 1N4148 1n4148 die 1n4148 1n4148 die chip 1N4148.1N4448 CPD83V DIODE R3 1N4154 1N4448
Text: PROCESS CPD83V Switching Diode High Speed Switching Diode Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 11 x11 MILS Die Thickness 7.1MILS Anode Bonding Pad Area 3.3 x 3.3 MILS Top Side Metalization Al - 30,000Å Back Side Metalization Au-As - 13,000Å
|
Original
|
CPD83V
CMPD914
CMPD4448
1N914
1N914B
1N4148
1N4448
1N4154
1N4454
CMPD2836
1N4148 chip
DIODE CHIP 1N4148
1n4148 die
1n4148
1n4148 die chip
1N4148.1N4448
CPD83V
DIODE R3
1N4154
1N4448
|
PDF
|